• Korean Journal of Computational Design and Engineering
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• v.3 no.4
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• pp.223-235
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• 1998

A dedicated CAM(Computer-Aided Manufacturing) system has been developed, which generated tool-path to machine Styrofoam stamping die-patterns in Chrysler Corporation. A previous process to build die-patterns was to "stick build" the pattern, in which stock is cut & glued together, and then the NC machining of part-surface shape completes building a Styrofoam die-pattern. The current process utilizes the developed CAM system, and almost removes the manual work, consequently reduces the overall lead time. The paper presents the overall system structures, tool-path generation, and some features of Styrofoam pattern machining.

• Proceedings of the Korea Contents Association Conference
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• 2005.11a
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• pp.659-663
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• 2005

It was expressed repeated information on reuse design pattern in the design information because it was impossible to build a standardized design pattern in the existing design pattern tools. Also, It must possible to extend standardized design pattern just as one intended of designer. And It is able to express objects just as one intended of designer. Therefore, the representative characteristic of this paper was able to define XMI metamodel to express design pattern, and was able to extend metamodel to express design pattern.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Korean Journal of Computational Design and Engineering
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• v.6 no.4
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• pp.263-270
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• 2001

In stamping-die manufacturing, the first step is to build die patterns for lost wax casting process. A recent industry trend is to manufacture the die pattern using 3-axis NC machining. This study identifies technical considerations of the pattern machining caused by the characteristics of Styrofoam material, and proposes technical methods related to establishing a process plan and generating tool paths for optimizing the pattern machining. In this paper, the process plan includes the fellowing three items: 1) deter-mining a global machining sequence-a sequence of profile, top, bottom machining and two set-ups, 2) extracting machining features from a pattern model and merging them, and 3) determining a machining sequence of machining features. To each machining feature, this study determines the machining start point, generates the approach tool path, and proposes a tool path linking method fur reducing the distance of the cutter rapid motion. Finally, a smooth tool path generation and an automatic feedrate adjustment (AFA) method are introduced far raising the machining efficiency.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.3
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• pp.47-52
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• 2001

Rapid Prototyping(RP) has been widely applied in designing and developing process of new products. RP can reduce the lead time and expense required to bring a new product form initial concept to production. Among several RP process can dramatically reduce the total build time and be applied for fabrication of large-sized and free form object because it uses in LOM the paper thickness is 0.05∼0.38mm as deposition feature segment. In this study, mechanical properties of pattern with LOM system is studied for optimal design of sand mold casting. The main result is that tensile, compressive strength and pattern size are significantly affected by temperature of hot roll.

• Korean Journal of Computational Design and Engineering
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• v.11 no.3
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• pp.223-233
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• 2006

Layered manufacturing(LM) is emerging as a new technology that enables the fabrication of three dimensional heterogeneous objects such as Multi-materials and Functionally Gradient Materials (FGMs). Among various types of heterogeneous objects, more attention has recently paid on the fabrication of FGMs because of their potentials in engineering applications. The necessary steps for LM fabrication of FGMs include representation and process planning of material information inside an FGM. This paper introduces a new process planning algorithm that takes into account the processing of material information. The detailed tasks are discretization (i.e., decomposition-based approximation of volume fraction), orientation (build direction selection), and adaptive slicing of heterogeneous objects. In particular, this paper focuses on the discretization process that converts all of the material information inside an FGM into material features like geometric features. It is thus possible to choose an optimal build direction among various pre-selected ones by approximately estimating build time. This is because total build time depends on the complexity of features. This discretization process also allows adaptive slicing of heterogeneous objects to minimize surface finish and material composition error. In addition, tool path planning can be simplified into fill pattern generation. Specific examples are shown to illustrate the overall procedure.

• Journal of KIISE:Software and Applications
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• v.29 no.8
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• pp.555-564
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• 2002

Design patterns are used to utilize well-defined design information. As using these design patterns, we can get re-use in object-oriented paradigm, decrease the time of development and improvement the quality of software. Although these design patterns are widely used among practice, most of design patterns information is manually used, inconsistent and its utilization could be very low. Because the design patterns information that a designer applies does not appear in software, it is sometimes difficult to track them. In this paper, we propose a tool support for design pattern-oriented software development. This tool supports design pattern management, software design and automatic source code generation. The design pattern management has the function for storing, managing and analyzing the existing design pattern and registering new design pattern. The software design has the function for software design with UML and automatically generate design pattern elements. By using this design information, this system can automatically generate source code. In the result to include the tracking design pattern element that is not Included In the existing CASE tools into design information, we can build the stable and efficient system that provides to analyse software, manage design pattern and automatically generate source code.

• International conference on construction engineering and project management
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• 2022.06a
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• pp.11-17
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• 2022

Design-bid-build (DBB) is the most common project delivery method among highway projects. State Highway Agencies (SHAs) usually apply a low-bid approach to select contractors for their DBB projects. In this approach, the Federal Highway Agency suggests SHAs heighten contractors' competition to lower bid prices. However, these attempts may become ineffective due to collusive bidding arrangements among certain contractors. One common strategy is the rotation of winning bidders of a group of contractors who bid on many of the same projects. These arrangements may also be specific to a particular region or vary in time. Despite the practices' adverse effects on bidding outcomes, an effective model to detect red-flag bidding patterns is lacking. This study fills the gap by proposing a novel framework that utilizes pattern mining techniques and statistical tests for unusual pattern detection. A case study with historical data from an SHA is conducted to illustrate the proposed framework.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.183-192
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• 2001

1- Buildup PCB technology is utilized to a bare chip attach substrate technology for packaging of semiconductor chip 2- Requirement for the substrate design rule is described in SIA International Technology Roadmap for Semiconductor. 3- There are seven fabrication methods of build-up technology. 4- Coating and lamination for resin and photo, and laser for micro via hope processes are available. Below $50\mu\textrm{m}$ in diameter is possible. 5- Fine pitch lines down to $30\mu\textrm{m}$ can be achieved by pattern plating with better electrical property. 6- Dielectric loss reduction is a key material improvement item for next generation build-up technology. 7- High band width up to 512 GB/s is possible with current wiring groundrule.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.3
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• pp.500-506
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• 2007

The Type Object Design Pattern is proposed to provide a solution on the situation in the case that one class has too many subclasses or the number of subclasses are undefined. Although this pattern has many advantages in terms of applicability and dynamic object behavior, it has a weak point in runtime pattern operation that it has to build and maintain a class reference mechanism in runtime to reference the class (de facto 'object') of instances. To solve that problem, this paper addresses the solution of the runtime class reference problem of Type Object Pattern. it defines a new class of Type Object Class (TOC) from Type Class and Object Class in Type Object pattern and presents the methods of creating, compiling, and memory-loading the TOC. It depends on built-in class reference mechanism of object-oriented programming language, and is not necessary to fit with the additional mechanism. Consequently, we need not to set up the additional class reference mechanism and system performance is enhanced due to it.