• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.73-78
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• 2016

Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.

• Journal of KSNVE
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• v.7 no.3
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• pp.499-509
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• 1997

During the process of oxide removal from work rolls in sheet metal manufacture, filamentary brushes frequently exhibit a bouncing or chatter behavior. The dynamics of this phenomenon is investigated through the development of expressions for the non-linear contact stiffness between the brush and the roll. With formulation of simple structural models, the time responses in the presence and absence of friction under random excitation are investigated. Possible solutions for the minimization or avoidance of this bouncing or chatter problem are also suggested.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.1
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• pp.57-62
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• 2013

Because of high torque and easiness of speed control, Direct Current(DC) motors have been used for a long time. But, its applications are limited in circumstance and performance, since they contained brush and commutator. The commutation characteristic gives effect to life and performance of the DC motor. Naturally, the commutation characteristic analysis is strongly required. In this paper, With the result of finite element analysis, The inductance is calculated each rotor position and applied to the voltage equations coupled with commutation equation. Also, contact resistances of brush/commutator assembly are considered using contact area and brush width converted with commutator segments. The time derivative term in the differential equation is solved in time difference method. This algorithm was applied to 2-pole shunt DC motor. We considered commutation characteristic by changing contact resistance between brush and commutator segment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.515-516
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• 2009

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.11a
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• pp.318-331
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• 2000

Electrical and tribological behaviours of a copper-graphite brush in a slipring-brush assembly were investigated to evaluate the characteristics of electric signal transmission between a slipring and a brush. Five brush materials containing different amounts of copper and graphite were studied. The result showed that a copper-graphite brush at a particular graphite content exhibited the most stable frictional and electrical behaviour suggesting an optimum amount of a solid lubricant in a metal-graphite brush system. Microscopic observation and the surface analysis showed good agreements with this phenomena. In addition, the deviation of the friction coefficient and electric signal distortion has a close relationship with a microscopic mechanical vibration and the change of a real contact area.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.58-63
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• 2010

A new contact force estimation technique is proposed. Keeping the contact force at a certain level between finishing tool and the object is essential since the quality of the finished surface is very sensitive to the contact force during the finishing process. However, the contact force measurement cannot be obtained by simply installing load cells under machine table or in the middle of tool linkage. The reason is that the weight of the machine table and the tool linkage are much heavier than the force to be measured. To that end, a method for estimating disturbance is proposed for a system that is similar to the mechanism of the finishing machine, and the same method is applied to estimate the contact force of the brush-type finishing machine. To verify the effectiveness of the proposed method, a small scale test set-up has been built and the method has been tested.

• KSTLE International Journal
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• v.2 no.1
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• pp.22-28
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• 2001

A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.114-118
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• 2009

PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.41-49
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• 2010

Two promising control candidates have been selected to test the sinusoidal reference tracking performance for a brush-type polishing machine having strong nonlinearities and disturbances. The controlled target system is an oscillating mechanism consisting of a common positioning stage of one degree-of-freedom with a screw and a ball nut driven by a servo motor those can be obtained commercially. Beside the strong nonlinearity such as stick-slip friction, the periodic contact of the polishing brush and the work piece adds an external disturbance. Selected control candidates are a Sliding Mode Control (SMC) and a variant of a feedback linearization control called Smooth Robust Nonlinear Control (SRNC). A SMC and SRNC are selected since they have good theoretical backgrounds, are suitable to be implemented in a digital environment and show good disturbance and modeling uncertainty rejection performance. It should be also noted that SRNC has a nobel approach in that it uses the position information to compensate the stickslip friction. For both controllers analytical and experimental studies have been conducted to show control design approaches and to compare the performance against the strong nonlinearity and the disturbances.

• Tribology and Lubricants
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• v.31 no.6
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• pp.239-244
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• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.