• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.679-682
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• 2001

An experiment is carried out to investigate the influences of shearing characteristic factors for the process design of lead frame blanking in copper alloy C194(t=0.205mm). 3 process parameters, e.g., clearance between die and punch, strip holding pressure, and bridge allowance are selected for this study. From the basis condition 6% clearance, 20N/$mm^2$, and 1.5t bridge allowance the seven times of experiment are done by varying the each factor. The square shape specimen is used to study the characteristics of shearing factors. The ratios of roll over, burnish, fracture zone are measured after blanking. The experimental analysis shows that the burnish ratio is decreased as the clearance increases. And the larger strip holding pressure is shown that the roll over and burnish ratio are both decreased. It is found that an optimal strip holding pressure is need for large burnish zone. Finally it is shown that the bridge allowance is less affected than clearance and strip holding pressure.

• 대한치과기공학회지
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• 제16권1호
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• pp.57-77
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• 1994

The purpose of this study is to investigate the extent to which dental laboratories use proper materials, procedures, devices, and equipments to fabricate crown & bridge, PFM(Porcelain Fused to Metal) crown & bridge, partial denture, complete denture, and other prosteses. 100 laboratories in Seoul were selected for this investigation. Questionnaires were constructed focusing on five topocs:crown & bridge, PFM crown & bridge, partial denture, complete denture, and other prostheses. The results from this survey were as follows : 1. Most dental laboratories used old, inexpensive, and familiar materials rather than newly developed ones. 2. Most of the dental technicians did not stick to the standard procedures of handling materials, but to their own experiences. 3. Newly developed equipments to fabricate dental prostheses were possessed by nearly 30% dental laboratories. 4. About 80% of dental laboratories were using the procedures they had learned in the school : die trimming for accurate crown margin and softening heat treatment after RPD gold casting. But less than 30% of laboratories were shown to follow the boxing procedure to produce master cast and laboratory remounting in the process of complete denture. The findings show that dental laboratory procedures to fabricate dental prostheses are incomplete and inaccurate in some instances. So, further studies are neededs to clarify the causes of some inaccurate procedures, the better and more equipments should be supplied to produce the more accurate dental posthesis, and more efforts at enancing the appropriate use of dental materials and procedures should be made.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• 대한치과보철학회지
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• 제39권6호
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• pp.641-658
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• 2001

All-ceramic restorations have become an attractive alternative to porcelain-fused-to-metal crowns. In-Ceram, and more recently IPS Empress 2 were introduced as a new all-ceramic system for single crowns and 3-unit fixed partial dentures. But their strength and marginal fit are still an important issue. This study evaluated the fracture resistance and marginal fit of three systems of 3 unit all-ceramic bridge fabricated on prepared maxillary anterior resin teeth in vitro. The 3 all-ceramic bridge systems were: (1) a glass-infiltrated, sintered alumina system (In-Ceram) fabricated conventionally, (2) the same system with copy-milled alumina cores (copy-milled In-Ceram), (3) a heat pressed, lithium disilicate reinforced glass-ceramic system (IPS Empress 2). Ten bridges of each system with standardized design of framework were fabricated. All specimens of each system were compressed at $55^{\circ}$ at the palatal surface of pontic until catastrophic fracture occurred. Another seven bridges of each system were fabricated with standard method. All of the bridge-die complexes were embedded in epoxy resin and sectioned buccolingually and mesiodistally. The absolute marginal discrepancy was measured with stereomicroscope at ${\times}50$ power. The following results were obtained: 1. There was no significant difference in the fracture strength among the 3 systems studied. 2. The Weibull modulus of copy-milled In-Ceram was higher than that of In-Ceram and IPS Empress 2 bridges. 3. Copy-milled In-Ceram($112{\mu}m$) exhibited significantly greater marginal discrepancy than In Ceram ($97{\mu}m$), and IPS Empress 2 ($94{\mu}m$) at P=0.05. 4. The lingual surfaces of the ceramic crowns showed smaller marginal discrepancies than mesial and distal points. There was no significant difference between teeth (incisor, canine) at P=0.05. 5. All-ceramic bridges of three systems appeared to exhibit sufficient initial strength and accept able marginal fit values to allow clinical application.

• 한국정밀공학회지
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• 제15권2호
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• pp.124-133
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• 1998

This paper describes a research work of developing a computer-aided design of blanking and piercing for irregular-shaped sheet metal products. An approach to the development of compact and practical CAB system is based on the knowledge-based rules. Knowledge for the CAD system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. The system has been written in AutoLISP on the AutoCAD with a personal computer. Based on knowledge-based rules, the system, STRT-DES, is designed by considering several factors, such as complexities of blank geometry and punch profile, availability of press equipment and standard parts, utilization ratio which minimizes the scrap in a single or a pairwise operation, bridge width, grain orientation and design requirements which maximize the strength of the part when subsequent bending is involved. This system checks a forming feasibility with both internal and external features, a dimension of blanked hole, and a corner and a fillet radius for irregualrly shaped sheet metal products. Therefore this system can carry out a die design for each process which is obtained from results of an automated blank layout drawing with a best utilization ratio for irregular shape of product that was successful in production feasibility check module and those of an automated strip layout drawing and generate part drawings and the assembly drawing of die set in graphic forms.

• 대한치과기공학회지
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• 제13권1호
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• pp.9-13
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• 1991

The purpose of this study was to determine the marginal fit of recasting by used nickel-chromium metal alloys, Hi-Crown, New-Crown and CB-80. Ninety crown prosthetics were divided into eighteen groups according to new to old metal ratios. Each crown was seated on its master die and then the marginal gaps were measured under optical microscope($\times$50). All groups were showed good marginal fit, except group 3 of Hi-Crown(156$\mu$m). The results suggest that the marginal fit of Ni-Cr metal alloy casting bodies were good as without concerned to mixed ratios and metals.

• Restorative Dentistry and Endodontics
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• 제32권2호
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• pp.111-120
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• 2007

본 연구는 복합레진 인레이 브릿지에서 강화재의 표면 처리와 사용 방법이 파괴 강도에 미치는 영향을 평가하였다. 본 연구에서 사용한 강화재료는 I Beam, U Beam, 1 + U Beam이었으며, 표면처리 방법은 Silane, Sandblast, Hole형성 (U beam)이었다. 강화 재료의 구성과 표면 처리 방법에 따라 총 11개의 실험군을 설정하였다. 상악 인공치 모형에서 제2소구치의 발거 상태를 가정하고 복합레진 인레이 브릿지 제작을 위하여 인접한 제1소구치에 DO, 제1대구치에 MO 와동을 형성하였다. 와동이 형성된 인공치 모형을 고무 인상체를 이용하여 석고로 제작하고, 각 실험군 별로 강화재료와 강화 재료의 표면 처리 방법에 따라 Tescera ATL (BISCO Inc. IL, USA) 복합레진을 사용하여 복합레진 인레이 브릿지를 제작하였다 그 후 시편을 복제모형에 인산아연시멘트로 합착하고 Universal testing machine (EZ Test, Shimadzu, Japan)을 이용하여 flexural stress를 가하여 파괴 강도를 측정하였으며 95% 유의 수준에서 one-way ANOVA/ Scheffes post-hoc test를 시행하여 통계 분석하였다. 다음과 같은 결론을 얻을 수 있었다. 1. 내부 강화재 I beam을 사용한 실험군이 유의성 있게 높은 파괴 강도 값을 보였다 (P<0.05). 2. 표면 처리 방법에 따른 차이는 나타나지 않았다 (P>0.05). 3. 복합레진 인레이 브릿지의 파괴는 강화 재료를 사용 시에는 복합레진과 강화 재료간에 분리 파괴가 나타났으며 사용하지 않은 경우에는 수직파괴 경향이 나타났다. 4. U beam에 유지 hole을 형성한 경우 파괴 강도 증가를 시키지 않았다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.79-85
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• 2007

본 연구의 목적은 OSP, 전해 Au과 무전해 Ni/Au로써 표면처리를 달리한 연성회로기판 상에 Au 스터드 플립칩 범프의 초음파 접합 가능성을 연구하는 것이었다. Au 스터드 범프는 표면처리 방법에 상관없이 성공적으로 연성회로기판의 패드 상에 초음파 접합되었다 접합 강도는 접합 시간에 민감하게 영향을 받았다. 접합 시간이 길어짐에 따라 접합 강도는 증가하였으나, 2초 이상의 접합 시간에서는 이웃 범프끼리 단락되는 bridge 현상이 발생하였다. 최적 접합조건은 OSP 처리된 가판상에 0.5초간 초음파 접합하는 것이었다.