• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.16-22
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• 2024

With advances of artificial intelligence (AI) technology, the demand is increasing for high-end semiconductors in various places such as data centers. In order to improve the performance of semiconductors, reducing the pitch of patterns and increasing density of I/Os are required. For this issue, 2.5dimension(D) packaging is gaining attention as a promising solution. The core technologies used in 2.5D packaging include microbump, interposer, and bridge die. These technologies enable the implementation of a larger number of I/Os than conventional methods, enabling a large amount of information to be transmitted and received simultaneously. This paper proposes the Molded Bridge die on Substrate (MBoS) process technology, which combines molding and Redistribution Layer (RDL) processes. The proposed MBoS technology is expected to contribute to the popularization of next-generation packaging technology due to its easy adaption and wide application areas.

• The Journal of Korean Academy of Prosthodontics
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• v.32 no.2
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• pp.212-224
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• 1994

The purpose of this study was to evaluate and compare film thickness of five kinds of resin luting cements [Comspan, Panavia Ex, Maryland bridge adhesive, All-bond C & B cementation kit, and Super-bond C & B]. Zinc-phosphate cement and glass-ionomer cement were used as the control group. In order to measure the film thickness the methods used were in broad compliance with ADA Specification No. 8, a tapered-die system that simulates clinical conditions more closely, and the connected tapered-die system that simulates bridge conditions. The inorganic filler size of resin cements was also examined with scanning electron micrographs. The results were obtained as follows ; 1. The film thickness of resin cements was increased in the order of Comspan, Panavia Ex, Super-bond C & B, Maryland bridge adhesive, and All-bond C & B cementation kit. Maryland bridge adhesive and All-bond C & B cementation kit showed significantly higher film thickness than the control group(p<0.01). 2. For all resin cements, there was a significant difference of film thickness between the ADA method and the tapered-die system. Generally, the tapered-die system demonstrated lower film thickness than the ADA method(p<0.01). 3. There was no significant difference in film thickness between the tapered-die system and the tapered-die bridge system in all resin cements(p<0.01). 4. The scanning electron microscope showed that the cement with larger filler had a tendency to be higher in film thickness.

• Transactions of Materials Processing
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• v.24 no.6
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• pp.400-404
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• 2015

For mass production of stamped parts, which require complicated in-press operations, it is always advisable to use a progressive die set. It is difficult to choose a progressive die set if the stamped parts need to be deep drawn and especially if they are unsymmetrical. Because unsymmetrical deep drawing parts are very sensitive to the effect of weight during moving to the next step, they are hard to exactly locate on the die face. An automotive seat side cushion panel is about 80mm high, unsymmetrical and its low edge needs hemming, so it is hard to produce even using a progressive die set. In the current paper a progressive stamping for seat side cushion panel was examined. Five strip bridges were considered to be strong enough to move to the next die as predicted by the CAE analysis.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.85-88
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• 2001

Deep drawing process, one of sheet metal forming methods, is used widely. Circular or square shape blanks are currently studied mainly. Especially, circular blank for coating case of chip condenser remains bridges when it is made out of aluminum coil. The bridge reduces Material-withdrawal-rate of aluminum coil to $60\%$. This paper proposes a no-bridge blank instead of circular blank. To get the different values of two cases, comparison circular blank with no-bridge blank is accomplished in the point of thickness strain in the vicinity of flange. In order to find optimal condition in new proposed blank, several process variables - those are blank holder shape, die shape radii, punch shape radii and blank holding force - are changed.

• Transactions of Materials Processing
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• v.28 no.6
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• pp.347-353
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• 2019

The porthole extrusion process is a classic metal forming process to produce complex cross-section shaped aluminum profile. It is very difficult to design porthole die and extrusion process because of the complex shape of extrusion die and internal metal flow. The main variables in this process are ram speed, initial billet and tool temperature, and die shape. In general, the metal flow of porthole extrusion process can be divided into two steps. During the first step, the billet is divided into several parts in the porthole die bridge. During the second step, the divided billets are welded in the welding chamber. In the welding chamber, the level of welding pressure is very important for the quality of the final product. The purpose of this study is to increase the welding pressure in the welding chamber by using a two stage welding chamber. The porthole extrusion die was designed by using the Taguchi method with orthogonal array. The effectiveness of the optimized porthole die was verified by using the finite element analysis.

• Transactions of Materials Processing
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• v.26 no.2
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• pp.115-120
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• 2017

Porthole extrusion process is a very effective metal forming process to produce aluminum profiles with hollow sections. The structure of porthole extrusion die is very complex. In this process, the billet is divided by porthole bridge, and then the divided billet is welded in the welding chamber. The welding pressure in the welding chamber is very important. The higher welding pressure improves the quality of the aluminum profiles. Therefore, the objective of this study is to develop a new porthole extrusion die for improving the welding pressure in the welding chamber by using numerical analysis. The effectiveness of the new porthole extrusion die was verified by using numerical analysis. Through numerical analysis, the welding pressures in the welding chamber between the new porthole die and the conventional porthole die were compared with each other.

• Transactions of Materials Processing
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• v.10 no.5
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• pp.425-432
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• 2001

In order to investigate the influences of process parameters on the shape of lead frame, experimental study has been carried out. In the experiment, dimensional accuracy of the die sets, measurement accuracy has been managed carefully enough to simulate actual lead frame blanking process. With the blanking of square-shaped specimen, the effects of clearance, strip holding pressure and bridge width on the shape of blanked profile have been investigated. Experimental results show that the burnish ratio is increased as the clearance decreases. the strip holding pressure increases, and bridge width increases. Although the results seems to be similar to the ordinary blanking, the lead frame blanking shows a subtle different characteristics to the ordinary blanking due to the narrow bridge width.

• Design & Manufacturing
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• v.6 no.1
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• pp.79-83
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• 2012

Anti-theft safety caps for bolted joints are necessary to ensure the safety of citizens and prevent theft of manholes, bridge guardrails, bulletin boards, subway safety handrails and others. Safety caps enhance the look of bolted joints, avert accidents that involve hitting the head of bolts, hamper them from coming loose by covering the head of bolts. This study focuses on press die design methods and press molding condition setting to resolve bursting and cracks in products, and on molding material selection and heat treatment technologies to boost life extension.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.5
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• pp.583-594
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• 2000

Dislodgement of a crown or extension bridge and the loosening of a retainer of a bridge is a serious clinical problem in fixed restoration. Generally these problems are considered to be associated with deformation of the restoration. During biting, the restoration is subjected to complex forces and deforms considerably within the limit of its elasticity. Deformation of the restoration under the occlusal force induces excessive stress in the cement film, which then leads to the cement fracture. Such a fracture may eventually cause loss of the restoration. Because most of the past retention tests for full veneer crown were done without fatigue loading, they were not exactly simulating intraoral environment. And the purpose of this study was to evaluate the effect of cyclic cantilever loading on the retentive strength of full veneer crowns depending on different type of cements and taper of prepared abutment. Steel dies with $8^{\circ}\;or\;16^{\circ}$ convergence angle were fabricated through milling and crowns with the same method. These dies and crowns were divided into 8 groups. Group 1 : $16^{\circ}$ taper die, cementation with zinc phosphate cement, without loading Group 2 : $16^{\circ}$ taper die, cementation with zinc phosphate cement, with loading Group 3 : $8^{\circ}$ taper die, cementation with zinc phosphate cement, without loading Group 4 : $8^{\circ}$ taper die, cementation with zinc phosphate cement, with loading Group 5 : $16^{\circ}$ taper die, cementation with Panavia 21, without loading Group 6 : $16^{\circ}$ taper die, cementation with Panavia 21, with loading Group 7 : $8^{\circ}$ taper die, cementation with Panavia 21 without loading Group 8 : $8^{\circ}$ taper die, cementation with Panavia 21, with loading After checking the fit of die and crown, the luting surface of dies and inner surface of crowns were air-abraded for 10 seconds. The crowns were cemented to the dies, with cements mixed according to the manufacturer's recommendations. A static load of 5kg was then applied for 10 minutes with static loading device. Twenty-four hours later, group 1, 3, 5, 7 were only thermocycled, group 2, 4, 6, 8 were subjected to cyclic loading after thermocycling. Retentive tests were performed on the Instron machine. From the finding of this study, the following conclusions were obtained 1. Panavia 21 showed significantly higher retentive strength than zinc phosphate cement for all groups (p<0.05). 2. There was a significant difference in the retentive strength between $8^{\circ}\;and\;16^{\circ}$ taper for zinc phosphate cement(p<0.05), but no significant difference for Panavia 21 (p>0.05). 3. Cyclic loading significantly decreased the retentive strength for all groups(p<0.05). 4. For zinc phosphate cement, there was 35% reduction of the retentive strength after loading in the $16^{\circ}$ taper die, 25% in the $8^{\circ}$ taper die, and for Panavia 21, 21% in the $16^{\circ}$ taper die, 18% in the $8^{\circ}$ taper die.