• 대한기계학회논문집B
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• 제26권12호
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• pp.1639-1645
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• 2002

Micro engine that includes Micro scale combustor is fabricated. Design target was focused on the observation of combustion driven actuation in MEMS scale. Combustor design parameters are somewhat less than the size recommended by feasibility test. The engine structure is fabricated by isotropic etching of the photosensitive glass wafers. Electrode formed by electroplating of the Nickel. Photosensitive glass can be etched isotropically with almost vertical angle. Bonding and assembly of structured photosensitive glass wafer form the engine. Combustor size was determined to be 1 mm scale. Movable piston is engraved inside the wafer. Ignition was done by nickel spark plug which was electroplated with thickness of 40 ${\mu}{\textrm}{m}$. The wafers were bonded by epoxy that resists high temperature. In firing test due to the bonding method and design tolerance pressure buildup by reaction was not confirmed. But ignition, flame propagation and actuation of micro structure from the reaction was observed. From the result basement of design and fabrication technology was obtained.

• Journal of the Korean Wood Science and Technology
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• 제17권4호
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• pp.26-34
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• 1989

This study was carried out to manufacture bark board from oak bark by new processes and to examine the physical and mechanical properties of the board. This process with no addition of adhesive used higher pressure and temperature than the conventional one and was applied with or without paraformaldehyde. The results are as follows: 1. The new manufacturing process allowed a good bark board with high absorption coefficient. 2. The best manufacturing process for the mechanical properties of bark board was paraformaldehyde 10%-$250^{\circ}C$-100kg/$cm^2$-3 minutes, (bending strength 40kg/$cm^2$, internal bonding strength 2kg/$cm^2$) and the best manufacturing process for both the mechanical properties of bark board and economic point of view was $250^{\circ}C$-100kg/$cm^2$-3 minutes (bending strength 28kg/$cm^2$, internal bonding strength 1.52kg/$cm^2$). 3. Bark board showed specific gravities from 0.94 to 1.03 and air dried moisture content 9.2% to 11.7%, but Bark board needed paraffin wax emusion treatment. 4. The absorption coefficient of bark boards had two peaks along with frequency; one in 200-400 cps, the other 1200-2000 cps. The former was low but the latter great.

• 한국정밀공학회지
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• 제22권10호
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• pp.39-48
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• 2005

As the industrial development is accelerated, a new machining process and system are keenly required to achieve super precision surface finish. Especially to get ground surface finish fer complicated and narrow inner shape of molds, it is impossible with the existing methods so that a new method is being required to be developed. A new material, called Magic(MAGnetic Intelligent Compounds), is finally made and it is called Magic machining that uses this material. There is a way to make a material as follows, the mixture of magnetic particles, bonding material and particles of abrasive grain should be melt down by proper heat, and then this mixture put in a mold and cool down in magnetic field which has a uniform direction. This new polishing method is spotlighted as an excellent solution to the existing problems. However it hasn't reported any study about the influence of the machining conditions of polishing velocity, amplitude and polishing pressure to the surface roughness yet. This study would examine closely the influence of polishing conditions of the Magic polishing tool to the surface finish to decide the optimum polishing condition and to standardize the Magic polishing work.

• 한국표면공학회지
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• 제44권5호
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• pp.213-219
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• 2011

Recently aspheric lenses are widely used for superpricision optical instruments, such as cellular phone camera modules, digital cameras and optical communication modules. The aspherical lenses are processed using mold core under high temperature compressive forming pressure. It is imperative to develop superhard protective films for the life extension of lens forming mold core. Especially ta-C films with higher $sp^3$ fractions receive attentions for the life extension of lens forming mold and, in turn, the cost reduction of lenses due to their suprior high temperature stability, high hardness and smooth surfaces. In this study ta-C films were processed on WC mold as a function of substrate bias voltage using FVA (Filtered Vacuum Arc) method. The processed films were characterized by Raman spectroscopy and nano-indentation to investigate bonding nature and hardness, respectively. The film with maximun 87% of $sp^3$ fraction was obtained at the substrate bias voltage of -60 V, which was closest to ta-C film. ta-C films showed better high temperature stability by sustaining relatively high fraction of $sp^3$ bonding even after 2,000 glass lens forming applications.

• 소성∙가공
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• 제18권1호
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• pp.45-51
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• 2009

Shape memory alloy has been used to improve the tensile strength of composite by the occurrence of compressive residual stress in matrix using its shape memory effect. In order to fabricate shape memory alloy composite, TiNi alloy fiber and Al2024 sheets were used as reinforcing material and matrix, respectively. In this study, TiNi/Al2024 shape memory alloy composite was made by using hot press method. In order to investigate bonding condition between TiNi reinforcement and Al matrix, the micro-structure of interface was observed by using optical microscope and diffusion layer of interface was measured by using Electron Probe Micro Analyser. And the mechanical properties of composite with three parameters(volume fraction of fiber, cold rolling amount and test temperature) were obtained by tensile test. The most optimum bonding condition for fabrication the TiNi/Al2024 composite material was obtained as holding for 30min. under the pressure of 60MPa at 793K. The strength of composite material increased considerably with the volume fraction of fiber up to 7.0%. And the tensile strength of this composite increased with the reduction ratio and it also depends on the volume fraction of fiber.

• Journal of Welding and Joining
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• 제29권4호
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• pp.93-99
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• 2011

This study was performed to compare the shear strength of the bondings between stainless steel crown/direct type composite resin and stainless steel crown/indirect type composite resin. Four groups of bonding conditions were prepared. Two groups of bonding conditions were made by the indirect type composite resin system and the other two groups were made by the direct type composite resin system. The shear strength tests were carried out using universal testing machine, Model 4465 of Instron Co.. It was indicated that the bond strength values of the indirect type composite resins were higher than those of the direct type composite resins. TE-SE group was superior to the TE-ONE in indirect type resin system. These results were thought to be the high degree of the polymerization accompanied with temperature and pressure of the resin of indirect type resin. It was also found that indirect composite resin contains less amount of porosity in resin.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• 설비공학논문집
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• 제27권8호
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• pp.426-431
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• 2015

The advantages of a printed circuit heat exchanger (PCHE) are the compactness and efficiency derived from its heat-transfer characteristics; furthermore, a PCHE for which a diffusion bonding method was used during production can be applied to extreme environments such as a cryogenic condition. In this study, a micro-channel PCHE fabricated by diffusion bonding was investigated in a cryogenic environment regarding its thermal performance and the pressure drop. The test rig consists of an LN2 storage tank, vaporizers, heaters, and a cold box, whereby the vaporized cryogenic nitrogen flows in hot and cold streams. The overall heat-transfer coefficients were evaluated and compared with traditional correlations. Lastly, we suggested the modified heat-transfer correlations for a PCHE in a cryogenic condition.

• Transactions on Electrical and Electronic Materials
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• 제3권1호
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• 펄프종이기술
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• 제40권1호
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• pp.15-22
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• 2008

For the improvement of letterpress printing paper quality, special fibers obtained from the sea were used by mixing with wood fibers. The sizes of the special fibers, which were from red algae in the sea, were 0.5-1 mm in length, and 3-7 ${\mu}m$ in width, respectively, and the fibers were supplied by Pegasus Research Inc. for the study. From the study, it was found that 10% addition of algae fibers greatly improved paper surface strength and internal bonding strength. The compressibility was estimated by utilizing 'Print-surf method' at high clamping pressure and with hard backing. Again, 10% addition of algae fibers greatly improved the compressibility of the paper. These results were expected that algae and wood fibers were distributed evenly through the sheet, and integrated one another to leave no empty space inside the paper.