• 제목/요약/키워드: Bonding pressure

검색결과 392건 처리시간 0.029초

초소형 수동형 유체 압력 조정기 제작 및 실험 (Fabrication and Test of a Micro Passive Liquid Pressure Regulator)

  • 이기정;임인호;심우영;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 제39회 하계학술대회
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    • pp.1482-1483
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    • 2008
  • This report describes the design, fabrication and experimental results of an implantable micro pressure regulator. It consists of three silicon substrates, a glass substrate, and a PDMS layer. Silicon and glass substrates are fabricated by using bulk micro machining and sandblasting. The PDMS layer is used as a intermediate layer for Si-Si and Si-glass bonding processes. This micro regulator is a key component of the portable drug delivery systems for low power consumption. The device has some advantages, such as a passive type device, no power consumption, and simple structure.

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초음파 용접을 이용한 폴리에틸렌 수지의 접합 (Joining of Polyethylene Polymer by the Ultrasonic Welding)

  • 이철구
    • 한국생산제조학회지
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    • 제6권3호
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    • pp.73-81
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    • 1997
  • This study was to find the best adhesive condition comparing mechanical property in case of hot-melt adhesion using glue-gun, ultrasonic welding with adhesion and only ultrasonic welding in order to adhere thermoplastic resin of polyethylene (PE) in which reliable adhesion was resulted in case of ultrasonic welding with same materials of PE. The best welding condition were acquired at welding time 1 second, welding pressure 250kPa for PE-PE where welding time and welding pressure were increased in accordance with the increase of material strength. At the best ultrasonic welding conditions, bonding strength of PE-PE welding was about 21MPa of which material have tensile strength of 24MPa. Through the analysis of microscophic test for ultrasonic welding structure, it was distinguished between well welded structure with higher intermolecule flow and bad welded structure with lower flow, of which result is mostly correspond with the result of tensile strength test.

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초음파 금속 용착기를 이용한 Cu 박판의 접합성 평가 (The Establishment of Bonding Conditions of Cu Sheet using an Ultrasonic Metal Welder)

  • 박우열;장호수;박동삼
    • 한국기계가공학회지
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    • 제11권2호
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    • pp.66-72
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    • 2012
  • Ultrasonic metal welder is consisted of power supply, transducer, booster, and horn. Precise designing is required since each part's shape, length and mass can affect driving frequency and vibration mode. This paper gives a description of an experimental study of the ultrasonic welding of metals. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu sheet. The Cu sheet welding was done with different amplitude, pressure and welding time, and its maximum tension was measured. Maximum tension of 177.99N was obtained when the pressure was 2.5bar, amplitude was 80%, and welding time was 0.34sec. Therefore, excessive welding condition negatively influences maximum tension measurement result.

티타늄합금의 나선운동 미세입자 분사가공 시 표면거칠기 특성 (The Characteristics of Surface Roughness when Micro Blasting of Titanium Alloy with Spiral Movement)

  • 김상현;왕덕현;이세한
    • 한국기계가공학회지
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    • 제11권4호
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    • pp.125-130
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    • 2012
  • When conducting a powder blasting to a spinning cylindrical workpiece in the codition of 0.76~1.5(mm) in nozzle size, 1~5(atm) in working pressure, and 40~100(mm) in stand off distance, the value of surface roughness becomes under $0.283{\mu}m$, which is not enough to expand a bonding area. In the case of horizontal transfer blasting with 0.76mm of nozzle size, 100mm of stand off distance, and 2~5atm of working pressure, $0.5{\sim}0.7{\mu}m$ of surface roughness has achieved regardless of feed rate.

Development of a Chip Bonding Technology for Plastic Film LCDs

  • Park, S.K.;Han, J.I.;Kim, W.K.;Kwak, M.K.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.89-90
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    • 2000
  • A new technology realizing interconnection between Plastic Film LCDs panel and a driving circuit was developed under the processing condition of low temperature and pressure with ACFs developed for Plastic Film LCDs. The conduction failure of interconnection of the two resulted from elasticity, low thermal resistance and high thermal expansion of plastic substrates. Conductive particles with elasticity similar to the plastic substrate did not damaged a ITO electrode on plastic substrates, and low temperature and pressure process also did not deform the surface of plastic substrates. As a result highly reliable interconnection with minimum contact resistance was accomplished.

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탄소나노튜브 전극으로부터 전계방출을 이용한 가스센서의 응용 (Application to Gas Sensors by Electron Emission from Carbon Nanotube Emitters)

  • 김성진
    • 한국전기전자재료학회논문지
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    • 제19권5호
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    • pp.405-410
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    • 2006
  • We fabricated gas sensors using carbon nanotubes (CNTs) as electron emitters for the purpose of detecting inert gases. By using the silicon-glass anodic bonding and glass patterning technologies with the typical Si process, we improved the compactness of the sensors and the reliability in process. The proposed sensor, based on, an electrical discharge theory known as Paschen's law in principle, works by figuring the variation of the discharge current depending on gas concentration. In the experiment, the initial breakdown characteristics were measured for air and Ar as a function of gas pressure. As the result, even though it should be realized that there are many other factors which have an effect on the breakdown of a gap, the sensors led to similar result as predicted by Paschen's law, and they showed a possibility as gas sensors which enable to detect the gas density ranged to the vacuum pressure from 1 to $10^{-3}$ Torr.

The Effects of CF4 Partial Pressure on the Hydrophobic Thin Film Formation on Carbon Steel by Surface Treatment and Coating Method with Linear Microwave Ar/CH4/CF4 Plasma

  • Han, Moon-Ki;Cha, Ju-Hong;Lee, Ho-Jun;Chang, Cheol Jong;Jeon, Chang Yeop
    • Journal of Electrical Engineering and Technology
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    • 제12권5호
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    • pp.2007-2013
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    • 2017
  • In order to give hydrophobic surface properties on carbon steel, the fluorinated amorphous carbon films were prepared by using linear 2.45GHz microwave PECVD device. Two different process approaches have been tested. One is direct deposition of a-C:H:F films using admixture of $Ar/CH_4/CF_4$ working gases and the other is surface treatment using $CF_4$ plasma after deposition of a-C:H film with $Ar/CH_4$ binary gas system. $Ar/CF_4$ plasma treated surface with high $CF_4$ gas ratio shows best hydrophobicity and durability of hydrophobicity. Nanometer scale surface roughness seems one of the most important factors for hydrophobicity within our experimental conditions. The properties of a-C:H:F films and $CF_4$ plasma treated a-C:H films were investigated in terms of surface roughness, hardness, microstructure, chemical bonding, atomic bonding structure between carbon and fluorine, adhesion and water contact angle by using atomic force microscopy (AFM), nano-indentation, Raman analysis and X-ray photoelectron spectroscopy (XPS).

SOI 압력(壓力)센서 (SOl Pressure Sensors)

  • 정귀상;석전성;중촌철랑
    • 센서학회지
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    • 제3권1호
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    • pp.5-11
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    • 1994
  • 본 논문은 실리콘기판 직접접합기술과 에피택샬 성장법으로 각각 형성한 SOI구조, 즉 Si/$SiO_{2}$/Si 및 Si/$Al_{2}O_{3}$/Si 상에 제작한 압저항형 압력센서의 특성을 기술한다. SOI구조의 절연층을 압저항의 유전체 분리막으로 이용한 압력센서는 $300^{\circ}C$ 까지 사용 가능했다. SOI구조의 절연층을 박막 실리콘 다아어프램 형성시 에칭 중지막으로 이용한 경우, 제작된 압력센서의 200개 소자들에 대한 압력감도의 변화는 ${\pm}2.3%$ 이내로 제어 가능했다. 더구나 실리콘 기판 직접접합기술과 에피택샬 성장법의 결합으로 형성한 더불 SOI구조($Si/Al_{2}O_{3}/Si/SiO_{2}/Si$)상에 제작된 압력센서는 고온분위기에서 사용 가능할 뿐만 아니라 고분해 능력을 갖는 특성을 보였다.

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표면처리방법에 따른 복합레진의 결합강도에 관한 실험적 연구 (AN EXPERIMENTAL STUDY ON THE SHEAR BOND STRENGTHS OF COMPOSITE RESIN TO AIR-ABRADED ENAMEL AND DENTIN)

  • 신재호;장기택;한세현
    • 대한소아치과학회지
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    • 제24권1호
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    • pp.112-124
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    • 1997
  • According to extensive use of composite resin which have superior esthetic property, every effort on improving bonding strength between a tooth and composite resin has been continued. Acid etching technique is a method that micro-etches the tooth surface which provides bonding with composite resin possible. Recently, there were several reports that mechanical treatment obtained from air-abrasion can provide similar bonding strength with acid etching technique. So, this experimental study was designed to compare the shear bonding strength between using air-abrasion technique and using acid etching technique. Initially, bovine teeth were divided into enamel and dentin experimental groups. Respectively each group was categorized into three subgroups. One subgroup was acid etched with 35% phosphoric acid, then bonded with composite resin. The other subgroup was air-abraded with $50{\mu}m$ $Al_2O_3$ particles sprayed with 160psi air pressure using air abrasion unit(KCP-1000, A.D.T., U.SA), and composite resin was bonded. In another subgroup, composite resin was bonded after acid etching following air-abrasion. So, enamel experimental groups were made of E1 (acid etched only), E2(air-abraded only), E3(acid etched following air-abraded), and dentin experimental groups were made of D1(acid etched only), D2(air-abraded only), D3(acid etched following air-abraded). Each subgroup had 10 specimens. Dentin bonding system(Scotchbond Multi-purpose, 3M Co., U.S.A.) and composite resin(Z-100, 3M Co., U.S.A.) were applied on treated surface using 5mm diameter gelatin capsule as manufacturer's direction. After 1200 times thermocycling between $5^{\circ}C$ and $55^{\circ}C$, shear bond strength was measured in 5mm/min crosshead speed with Instron(Instron Co., U.S.A.), and also treated enamel and dentin were observed with SEM(JEOL Co., Japan). The following results were obtained: 1. In the enamel experimental groups, acid etched following air-abraded group had highest shear bond strength, but there was no significant difference compared to acid etched group. Air-abraded only group had lowest shear bond strength, and there was significant difference compared to the rest of groups. 2. In the dentin experimental groups, acid etched following air-abraded group had highest shear bond strength, but there was no significant difference compared to acid etched group. Air-abraded only group had lowest shear bond strength, and there was significant difference compared to the rest of groups. 3. In the SEM study, air-abraded enamel and dentin had irregular and rough surfaces.

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CNT-Ag 복합패드가 Cu/Au 범프의 플립칩 접속저항에 미치는 영향 (Effect of CNT-Ag Composite Pad on the Contact Resistance of Flip-Chip Joints Processed with Cu/Au Bumps)

  • 최정열;오태성
    • 마이크로전자및패키징학회지
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    • 제22권3호
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    • pp.39-44
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    • 2015
  • 이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 $164m{\Omega}$, $141m{\Omega}$$132m{\Omega}$의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 $200m{\Omega}$, $150m{\Omega}$$140m{\Omega}$의 평균 접속저항을 나타내었다.