• 제목/요약/키워드: Bonding pressure

검색결과 392건 처리시간 0.027초

실시간 맥박 및 혈압 측정을 위한 폴리머 기판 압력센서 개발 (Development of Pressure Sensor on Polymer Substrate for Real-time Pulse and Blood Pressure Measurements)

  • 김진태;김성일;정연호
    • 한국전기전자재료학회논문지
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    • 제26권9호
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    • pp.669-676
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    • 2013
  • In this study, we introduce a polymer(polyimide) based pressure sensor to measure real-time heart beat and blood pressure. The sensor have been designed with consideration of skin compatibility of material, cost effectiveness, manufacturability and wireless detection. The designed sensor was composed of inductor coils and an air-gap capacitor which generate self-resonant frequency when electrical source is applied on the system. The sensor was obtained with metalization, etching, photolithography, polymer adhesive bonding and laser cutting. The fabricated sensor was shaped in circular type with 10mm diameter and 0.45 mm thickness to fit radial artery. Resonant frequencies of the fabricated sensors were in the range of 91~96 MHz on 760 mmHg pressurized environment. Also the sensor has good linearity without any pressure-frequency hysteresis. Sensitivity of the sensor was 145.5 kHz/mmHg and accuracy was less than 2 mmHg. Real-time heart beat measurement was executed with a developed hand-held measurement system. Possibility of real-time blood pressure measurement was showed with simulated artery system. After installation of the sensor on skin above radial artery, simple real blood pressure measurement was performed with 64 mmHg blood pressure variation.

초음파 분량법에 의한 레진 내부 결합의 크기 측정에 관한 연구 (Sizing of lnner Flaw in Resin by using Ultrasonic spectroscopy)

  • Han, E.K.;Kim, Y.J.;Park, I.G.
    • 한국정밀공학회지
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    • 제10권3호
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    • pp.182-190
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    • 1993
  • In manufacturing process of semiconductor package, the thermal stress owing to high temperature in moulding and the bubbles generated in chip bonding process become main causes to produce void. On this study we evaluated quantitatively void size by use of ultrasonic spectroscopy method which analyze the reflective pulses with broad band frequency in frequency domain, and after destructive testing we verified effectiv- eness of sizing void by use of ultasonic spectroscopy.

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섬유집합체의 교차구조를 위한 물/초음파 시스템의 응용 (Application of Water/Ultrasonic System for Interlacing Pattern of Fibrous Assemblies)

  • Kang, Jeon-Young;Joo, Chang-Whan
    • 한국섬유공학회:학술대회논문집
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    • 한국섬유공학회 2003년도 가을 학술발표회 논문집
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    • pp.122-125
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    • 2003
  • Ultrasonic wave has three classes of applications such as communication, inspection, imagination and processing. In processing, ultrasonic is used web bonding for nonwovens with applications including floppy disks, medical devices and many automotive Part. The important components of ultrasonic system are power supply, converter, booster, hem, anvil roller, pressure system and hold time controller. (omitted)

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Low Temperature Cure Film Adhesive

  • Liang, Bin;Zhao, Shenglong
    • 접착 및 계면
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    • 제5권2호
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    • pp.1-7
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    • 2004
  • A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

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Effect of tire crumb and cement addition on triaxial shear behavior of sandy soils

  • Karabash, Zuheir;Cabalar, Ali Firat
    • Geomechanics and Engineering
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    • 제8권1호
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    • pp.1-15
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    • 2015
  • This paper presents a series of conventional undrained triaxial compression tests conducted to determine the effect of both tire crumbs and cement addition on Narli sand specimens. The tire crumb contents and cement contents were 3%, 7%, 15%; and 1%, 3%, 5% by dry weight of the sand specimens respectively. Specimens were prepared at about 35% relative density, cured during overnight (about 17 hours) for artificially bonding under a 100 kPa effective stress (confining pressure of 500 kPa with a back pressure of 400 kPa), and then sheared. Deviatoric stress-axial strain, pore water pressure-axial strain behavior, and Young's modulus of the specimens at various mixture ratios of tire crumb/cement/sand were measured. Test results indicated that the addition of tire crumb to sand decreases Young's modulus, deviatoric stress and brittleness, and increase pore water pressure generation. The addition of cement to sand with tire crumbs increases deviatoric stress, Young's modulus, and changes its ductile behavior to a more brittle one. The results suggest that specimen formation in the way used here could reduce the tire disposal problem in not only economically, and environmentally, but also more effectively beneficial way for some geotechnical applications.

스퍼터된 바나듐 산화막의 구조적 특성에 미치는 산소 분압의 효과 (Effects of Oxygen Partial Pressure on the Structural Properties of Sputtered Vanadium Oxide Thin Films)

  • 최복길;최용남;최창규;권광호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.435-438
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    • 2001
  • Thin films of vanadium oxide(VO$\sub$x/) have been deposited by r.f. magnetron sputtering from V$_2$O$\sub$5/ target in gas mixture of argon and oxygen. The oxygen/(oxygen+argon) partial pressure ratio is changed from 0% to 8%. Crystal structure, chemical composition and bonding properties of films sputter-deposited under different oxygen gas pressures are characterized through XRO, XPS, RBS and FTIR measurements. All the films prepared below 8% O$_2$ are amorphous, and those prepared without oxygen are gray indicating the presence of V$_2$O$\sub$$_4$/ phase in the films. V$_2$O$\sub$5/ and lower oxides co-exist in sputter-deposited films and as the oxygen partial pressure is increased the films become more stoichiometric V$_2$O$\sub$5/. The increase of O/V ratio with increasing oxygen gas pressure is attributed to the partial filling of oxygen vacancies through diffusion. It is observed that the oxygen atoms. located on the V-O plane of V$_2$O$\sub$5/ layer participate more readily in the oxidation process.

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채널 형상에 따른 마이크로채널 PCHE의 열전달 및 압력강하 특성 (The Heat Transfer and Pressure Drop Characteristics on Microchannel PCHE with various Configurations)

  • 김윤호;문정은;이규정
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2008년도 동계학술발표대회 논문집
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    • pp.215-220
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    • 2008
  • A microchannel PCHE is manufactured by the two technologies of micro photo-etching and diffusion bonding. In this paper, heat transfer and pressure drop characteristics by applying various configuration for the flow channel in the microchannel PCHE is experimentally investigated. The flow channel configurations are designed three types such as straight, wavy and offset strip channels. The performance experiment of each configuration is performed for Reynolds numbers in ranges of $100{\sim}700$ under various flow conditions for the hot side and the Reynolds number of cold side is fixed at 350. The inlet temperatures of the hot side and cold side are conducted as $40^{\circ}C$ and $20^{\circ}C$, respectively. The heat transfer performance of wavy channel, which was similar to that of offset strip channel, was much higher than that of straight channel. The effectiveness of wavy channel and offset strip channel was evaluated as about $0.5{\sim}0.9$. The pressure drop of wavy channel was highest among configurations and that of offset strip channel was lower than that of straight channel because the round curved surface of each strip edge was reduced the pressure loss.

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저압 MOCVD로 CBr4 가스를 사용하여 탄소 도핑된 GaAs 에피층의 결정학적 방향에 따른 전기적 성질의 의존성 (Crystallographic Orientation Dependence Of Electrical Properties of Carbon-doped GaAs Grown by Low Pressure Metalorganic Chemical Vapor Deposition Using CBr4)

  • 손창식
    • 한국전기전자재료학회논문지
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    • 제15권3호
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    • pp.214-219
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    • 2002
  • In order to elucidate the crystallographic orientation dependence of electrical properties of carbon (C)-doped GaAs epilayers, C incorporation into GaAs epilayers on high-index GaAs substrates with various crystallographic orientations from (100) to (111)A has been performed by a low pressure metalorganic chemical vapor deposition using C tetrabromide ($CBt_4$) as a C source. The hole concentration of C-doped GaAs epilayers rapidly decreases with a hump at (311)A with increasing the offset angle. Although the growth temperature and the V/III ratio are varied, the crystallographic orientation dependence of hole concentration show a same trend. The above behaviors indicate that the bonding strength of As sites on a glowing surface plays an important role in the C incorporation into the high-index GaAs substrates.

초음파 금속 용착기를 이용한 Cu 박판의 용착성 실험 (The Establishment of Bonding Conditions of Cu Using an Ultrasonic Metal Welder)

  • 장호수;박우열;박동삼
    • 한국생산제조학회지
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    • 제20권5호
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    • pp.570-575
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    • 2011
  • Ultrasonic metal welder is consisted of power supply, transducer, booster, and horn. Precise designing is required since each parts' shape, length and mass can affect driving frequency and vibration mode. This paper analyzed Cu sheet deposition characteristics using ultrasonic metal welder and tension tester. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu plates. The Cu sheet welding was done with different amplitude, pressure, and welding time, and its maximum tension was measured with tension tester. Maximum tension of 153.87N was obtained when the pressure was 2.0bar, amplitude was 80%, and welding time was 0.30s. Therefore, excessive welding condition negatively influences maximum tension measurement result.