• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.11
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• pp.751-759
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• 2010

A newly developed type PCHE(Printed Circuit Heat Exchanger), which has a longitudinal corrugation flow channel, was fabricated using etching and diffusion bonding to evaluate its hydraulic performance. The pressure drop characteristics obtained from the experimental results are presented and the local friction factors associated with different hydraulic diameters and inclination angles are discussed. The results of a three-dimensional numerical simulation are presented, conducted using commercial CFD(Computational Fluid Dynamics) software at lower Reynolds number range. The numerical results were validated by experimental data obtained from helium gas experimental apparatus. The results of CFD prediction show fairly good agreement with the experimental data.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.15-19
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• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.567-572
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• 2013

In houses that use heating and cooling system, most of heat loss occurs through the windows, so that low-E glass, double-layered glass, and vacuum glazing are used to minimize the heat loss. In this paper, an encapsulating process that is a final process in manufacturing the vacuum glazing has been studied, and bonding in a vacuum chamber rather than atmospheric bonding was considered. For the efficiency of the encapsulating process, frit-melting temperature and bonding time were optimized with heater temperature, and the glass preheating temperature was optimized to prevent glass breakage due to thermal stress. Thus the vacuum glass was successfully manufactured based on these results and heat transmission coefficient measured was about $5.7W/m^2K$ which indicates that the internal pressure of the vacuum glazing is $10^{-2}$ torr.

• Journal of the Korean Wood Science and Technology
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• v.34 no.5
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• pp.29-41
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• 2006

This study was to investigate the effect of adding additive as tannin, rice husk and charcoal, for reducing the formaldehyde emission level, on the adhesion properties of urea-formaldehyde (UF) resin for particleboard. We controlled the hot-pressing time, temperature and pressure to determine the bonding strength and formaldehyde emission. Blends of various UF resin/additives (tannin, rice husk and charcoal) compositions were prepared. To determine and compare the effect of additives (tannin, rice husk and charcoal) content, 0, 5, 10 and 15%, by weight of UF resin, were used. $NH_4Cl$ as hardener added. To determine the level of formaldehyde emission, we used the desiccator, perforator and 20 L-small chamber method. The formaldehyde emission level decreased with increased additions of additive (except rice husk). Also, increased hot-pressing time decreased formaldehyde emission level. At a charcoal replacement ratio of only 15%, the formaldehyde emission level is under F ✩ ✩ ✩ ✩ grade (emit < $0.3mg/{\ell}$). Curing of the high tannin additive content in this adhesive system indicated that the bonding strength increased. But, in the case of rice husk and charcoal, the bonding strength was much lower due to the inorganic substance. Furthermore, rice husk was poor in bonding strength as well as formaldehyde emission than tannin and charcoal.

• Journal of Korea Foundry Society
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• v.15 no.2
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• pp.138-145
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• 1995

The mechanical properties of $Al/Al_2O_3$ composites have been investigated in relation with manufacturing factors such as applied pressure of casting and binder amount of preform. It was found that tensile strength increases with an increase of applied pressure, but decreases with binder amount. Increase of tensile strength is attributable to refinement of microstructure, improvement of intefacial bonding between $Al_2O_3$ short fiber and matrix, decrease of porosity in the matrix. Due to the high thermal stability of alumina short fiber, tensile strength of composites at $150^{\circ}C$ was superior to matrix alloy at room temperature. To evaluate the strength of composites, modified Kelly-Tyson's equation was introduced. Manufacturing factor M was obtained calculating from experimental data. M values were increased with applied pressure, but decreased with binder amount. The initiation of microcrack appeared to be at interface and reinforcement colony. Amount of micro-dimple was increased with applied pressure, and interfacial debonding phenomenon was remarkable with an increase of binder amount.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.1008-1015
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• 2001

Thin films of vanadium oxide(VO$\_$x/) have been deposited by r.f. magnetron sputtering from V$_2$O$\_$5/ target in gas mixture of argon and oxygen. The oxygen/(oxygen+argon) partial pressure ratio is changed from 0% to 8%. Crystal structure, chemical composition, bonding, optical and electrical properties of films sputter-deposited under different oxygen gas pressures are characterized through XPS, AES, RBS, FTIR, optical absorption and electrical conductivity measurements. V$_2$O$\_$5/ and lower oxides co-exist in sputter-deposited films and as the oxygen partial pressure is increased the films become more stoichiometric V$_2$O$\_$5/. The increase of O/V ratio with increasing oxygen gas pressure is attributed to the partial filling of oxygen vacancies through diffusion. It is observed that the oxygen atoms located on the V-O plane of V$_2$O$\_$5/ layer participate more readily in the oxidation process. With increasing oxygen gas pressure indirect and direct optical band gaps are increased, but thermal activation energies are decreased.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.6
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• pp.57-62
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• 2001

Recently, it has increased that the importance of gas pressure weldment of steel bars in large construction bars. But there has hardly been any studies about it. Therefore we need more research. SD40 steel bar (32mm in diameter) which has been practically used at construction sites are tested about tension, bonding, fatigue, a macro structure and micro structure at foil gitudinal section and hardness to fed out the mechanical property and best welding ranges in some cases of mechanical cut and gas cut before gas pressure welded. It is that a gas-pressure welded zone of steel bar where was cleaned of impurities in way of two-upsetted method is more excellent bending and tension property than the regulation of KD D 0244. Also gas cut bars gained hardness from the heat affected zone so. In conclusion, to improve the weldability of steel bars, it is considered best to clean mechanically cut sutra- faces and then weld them by a method of 2 step upset way.

• Journal of the Korean Geosynthetics Society
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• v.16 no.3
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• pp.41-49
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• 2017

In this study, a series of laboratory and in-situ tests such as FVTs and CPTUs were carried out to evaluate undrained shear strength related to quasi overconsolidated characteristics in the near-surface clay at Busan new port. Using unconfined compression and field vane test results, correlation between undrained shear strength and effective overburden pressure, that is, equation of $10+0.262{\sigma}^{\prime}v_0$ (kPa) was obtained. From oedometer tests, OCR is around 1.9 at depths lower than 7 m and OCR below this depth is very close to unit. As stated by Hanzawa et al. (1983), a natural clay deposit in the near-surface, even in normally consolidated state, is more and less apparently overconsolidated due to aging effects such as chemical bonding. Based on this concept, it can be inferred that intercept of equation is mobilized due to chemical bonding irrespective of effective overburden pressure and strength incremental ratio in normally consolidated state is 0.262. From CPTU results, same trend was confirmed. The further study should be necessary to judge whether upper clay is under overconsolidated state due to chemical bonding or not based on the depositional environment.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.75-81
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• 2018

The effect of $Ar-N_2$ plasma treatment on Cu surface as one of solutions to realize reliable Cu-Cu wafer bonding was investigated. Structural characteristic of $Ar-N_2$ plasma treated Cu surface were analyzed using X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope. Ar gas was used for a plasma ignition and to activate Cu surface by ion bombardment, and $N_2$ gas was used to protect the Cu surface from contamination such as -O or -OH by forming a passivation layer. The Cu specimen under high Ar partial pressure plasma treatment showed more copper oxide due to the activation on Cu surface, while Cu surface after high $N_2$ gas partial pressure plasma treatment showed less copper oxide due to the formation of Cu-N or Cu-O-N passivation layer. It was confirmed that nitrogen plasma can prohibit Cu-O formation on Cu surface, but nitrogen partial pressure in the $Ar-N_2$ plasma should be optimized for the formation of nitrogen passivation layer on the entire surface of Cu wafer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.929-933
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• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.