• The korean journal of orthodontics
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• v.19 no.2
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• pp.155-163
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• 1989

Indirect bonding is done by placing the brackets on a model in the laboratory and using a template or tray to transfer the laboratory positioning to the teeth. The advantages of this technique are 1. decreased chair time 2. less patient discomfort 3. accuracy of a attachment placement 4. good adaptation of attachment to tooth contour 5. occlusal relationship of brackets and opposing teeth can be checked The disadvantages of the technique are 1. complex laboratory procedure 2. sometimes difficult on very short clinical crowns 3. teeth with crowns, large buccal restoration will not bond 4. may not be fitted close, if poor adaptation 5. likely to be disturbed setting Several indirect bonding techniques have proved reliable in clinical practice. However, they differ in the way the brackets are attached temporarily to the model, the type of transfer tray or other mechanism used, the adhesive or sealant employed, whether segmented or full bonding used, and the way the transfer is removed so as not to exert excessive force on a still maturing bond.

• Laser Solutions
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• v.11 no.3
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• pp.1-4
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• 2008

A selective laser micro bonding process using liquid glass (methylsilsesquioxane) was developed and the results are analysed. The liquid glass can be solidified with Nd:YAG laser irradiation and it can be applied for joining two glass substrates. A bonding thickness of a few micrometers can be achieved. The appropriate laser power density (or this process is around 40-60 $kW/cm^2$ and its bonding force is 1000-1200 $gf/mm^2$. This process can be applied for bonding micro devices such as micro bio-sensors or display products. Its advantages and limitations are presented and discussed.

• Composites Research
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• v.33 no.5
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• pp.282-287
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• 2020

In the present study, a high-strength polyethylene terephthalate (PET) sheet was fabricated through a densification process of low melting PET fiber (LMF) combined PET sheet. During the thermal heat treatment process of the combined LMF, individual PET fiber was connected, which in turn leads to the improvement of the interfacial bonding force between the fibers. Also, the densification of the PET sheet leads to reduce macrospore density and in return could enhance the binding force between the overlapped PET networks. Consequently, the asprepared LMF-PET sheet showed about 410% improved tensile strength and the same elongation compared to before compression. Besides, the enhanced bonding force can prevent the shrinkage of the PET fiber network and exhibited excellent dimensional stability.

• Bulletin of the Korean Chemical Society
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• v.30 no.11
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• pp.2595-2602
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• 2009

Hexamer cluster of N,N-dimethylformamide(DMF) based on the crystal structure was investigated for the equilibrium structure, the stabilization energies, and the vibrational properties in the density functional force field. The geometry (point group $C_i$) of fully optimized hexamer clustered DMF shows quite close similarity to the crystal structure weakly intermolecular hydrogen bonded each other. Stretching force constants for intermolecular hydrogen bonded methyl and formyl hydrogen atoms with nearby oxygen atom, methyl C–H${\cdots}$O and formyl C–H${\cdots}$O, were obtained in 0.055 $\sim$ 0.11 and $\sim$ 0.081 mdyn/$\AA$, respectively. In-plane bending force constants for hydrogen bonded methyl hydrogen atoms were in 0.25 $\sim$ 0.33, and for formyl hydrogen $\sim$ 0.55 mdynÅ. Torsion force constants through hydrogen bonding for methyl hydrogen atoms were in 0.038 $\sim$ 0.089, and for formyl hydrogen atom $\sim$ 0.095 mdynÅ. Calculated Raman and infrared spectral features of single and hexamer cluster represent well the experimental spectra of DMF obtained in the liquid state. Noncoincidence between IR and Raman frequency positions of stretching C=O, formyl C–H and other several modes was interpreted in terms of the intermolecular vibrational coupling in the condensed phase.

• Macromolecular Research
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• v.15 no.7
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• pp.688-692
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• 2007

The hydrogen-bonding induced alternating multilayer thin films of dendrimers and block copolymer micelles were demonstrated. The block copolymer micelles derived from amphiphilic poly(2-ethyl-2-oxazoline)block-$poly({\varepsilon}-carprolactone)$ (PEtOz-PCL) in aqueous phase have a core-shell structure with a mean hydrodynamic diameter of 26 nm. The hydrogen bonding between the PEtOz outer shell of micelle and the carboxyl unit of poly(amidoamine) dendrimer of generation 4.5 (PAMAM-4.5G) at pH 3 was utilized as a driving force for the layerby-layer alternating deposition. The multilayer thin film was fabricated on the poly(methyl methacrylate) (PMMA) thin film spin-coated on silicon wafer or glass substrate by the alternate dipping of PEtOz-PCL micelles and PAMAM dendrimers in aqueous solution at pH 3. The formation of multilayer thin film was characterized by using ellipsometry, UV-vis spectroscopy, and atomic force microscopy. The PEtOz outer shell of PEtOz-PCL micelle provided the pH-responsive hydrogen bonding sites with peripheral carboxylic acids of PAM AM dendrimer. The multilayer thin film was reversibly removed after dipping in aqueous solution at $pH{\geq}5.6$ due to dissociation of the hydrogen bonding between PEtOz shell of PEtOz-PCL micelle and peripheral carboxyl units of PAMAM dendrimer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.1
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• Smart Structures and Systems
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• v.1 no.1
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.2
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• pp.382-392
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• 1990

This study investigates the behavior of fatigue crack propagating between holes of holes filled with another materials. When holes of the holes filled with another materials are located symmetrically near a center crack, it is noted that the crack propagation rate is influenced by both the bonding force of the brazing part and the elastic modulus of another material. It is experimentally and analytically confirmed that the center crack stops when its tip reaches near the center line of the holes and a small crack is initiated from the boundaries of holes of the holes filled with another materials and it propagates to final fracture.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1349-1354
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• 2008

In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1181-1186
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• 2008

Insulators which are used in the domestic electrical industries are mostly depended on importation from some advance countries. Even though insulators which are made of ceramic material have been mostly used domestically, the ratio of usage on composite insulators is recently being increased because of difficulties in manufacturing and high cost regarding ceramic stuffs. In this research, we are trying to develop the composite insulators which are very efficient in insulation regardless of the matter of weight. Even though the technique of manufacturing composite insulator are quite generalized worldwide at the moment, one of the most important issue is to keep security on the know-how that an ingredient of insulated material named 'SF6 gas' is included. Therefore, The aim of this paper is to improve the bonding force and air tight property between two components of composite insulator, Flange and FRP Tube.