• Journal of dental hygiene science
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• v.9 no.2
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• pp.153-160
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• 2009

The purposed of this study was to investigate the effect of Gold bonding agent as intermediate layer between metal substrate and ceramic coating. Gold bonding agent used to seal off any surface porosity, to mask the greyish color of the metal, and to provide an underlying bright golden hue to the ceramic coverage. The adhesion between metal substrate and ceramic is related to diffusion of oxygen during ceramic firing. The oxide layer produced on non-precious alloy anti titanium was considered to have a potentially adverse effect on metal-ceramic bonding. The oxidation characteristics of titanium and non-precious alloys are the main problem. Every group were divided into test and control groups. Control groups are carried out process of degassing for product oxide layer. Au coating was applied on each Ni-Cr, Co-Cr alloys and cp-Ti specimens with difference surface condition or degassing. Specimens surfaces and cutting plane was characterized by SEM/EDS. Results suggested that Au coating is effective barriers to protect metal oxidation during ceramic firing.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.238-243
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• 2007

This paper is designed to estimate the adhesion strength of coating layer on galvannealed steel sheet using lap shear test. The single lap shear test is the most commonly used standard test for determining the strength of medium-strength and high strength bonds. The bond strength of bonded single lap joints on subjecting the substrates to loads is determined by lap shear forces in the direction of the bonded joint. In this study, specimen for adhesion strength test was made to attach coated sheet to cold rolled sheet and were heated in temperature of 180 for 20minutes. After test, detached parts of coatings on coated sheet were observed using SEM and EDX to identify substrate and complete detachment. The tested results showed that adhesive strength of coating is unrelated to anisotropy of sheet and is difficult to be extracted using conventional theory because of fine cracks of coating layers which were created during annealing process.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.4
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• pp.581-592
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• 2003

The aim of this study was to evaluate the effect of chemo-mechanical caries removal system($Carisolv^{TM}$, Medi Team, Sweden) for resin adhesion to carious primary and permanent dentin compared with conventional drilling method. The buccal surface of 92 primary molars and 92 permanent molars were used. Exposed dentins were occurred artificial caries. 32 tooth of primary molars and 32 tooth of permanent molars were prepared to observe treated dentin surface with $Carisolv^{TM}$ and conventional drilling method by SEM. Other tooth were prepared to measure resin-dentin shear bonding strength according to caries removal methods and dentin adhesive system. Two adhesive systems and a composite resin were used; single bonding agent(Scotchbond Multi-Purpose Plus, 3M) and self-etching bonding system(Prompt L-pop, 3M ESPE), and a composite resin (Z-250, 3M). The results were as follows : 1. The removal effect of carious dentin on $Carisolv^{TM}$ was stronger on the primary dentin than that to permanent dentin, and dentin surface became rougher with treated $Carisolv^{TM}$ than drilling method. 2. Acid-etched dentin surfaces were showed smoothening without smear layer. 3. In specimen applied single bonding system hybrid layer and adhesive layer were $2-4{\mu}m$ and $10-15{\mu}m$ in thickness, whereas self-etching bonding system were showed only thin hybrid layer($1-2{\mu}m$). 4. The shear bonding strength of group applied single bonding agent was higher than that applied self-etching priming system(P<0.05). 5. The shear bonding strength of group applied $Carisolv^{TM}$ and self-etching priming system were slightly higher than that applied conventional drilling method and self-etching priming system(P>0.05).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.5
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• pp.458-461
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• 2004

In order to improve the adhesion properties of copper, MPS(3-mercaptopropyltrimethoxysilane) organic film were employed. The plasma pretreatment in pure He or $He/O_{2}$ mixed gas environment greatly increased adhesion force. Adhesion force was measured by scratch test with nano indenter. Microstructures and surface roughness were observed with scanning electron microscope(SEM). The characteristics of MPS layer for pretreatment were studied with flourier transform infrared spectroscope(FT-IR) and contact angle tester. The heighest adhesion was achieved in the specimen pretreated with mixed plasma and NPS coating, which was 56mN. Other specimen showed lower value by $20{\%}$ to $30{\%}$. The roughness of substrate was not affected by the bonding strength of copper plating.

• Journal of the Korean institute of surface engineering
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• v.44 no.5
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• pp.190-195
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• 2011

Diamond-like carbon (DLC) has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion on the metal substrates because of weak bonding between DLC film and the metal substrate. The purpose of this study is to enhance an adhesion of DLC film. For improving adhesion, the substrate was treated by active screen plasma nitriding before DLC film deposing. Nitrided substrates were investigated by Glow Discharge Spectrometer (GDS), Micro-Vickers Hardness. DLC films were deposited on several metals by linear ion source, and characteristics of the films were investigated using nano-indentation, Field Emission Scanning Electron Microscope (FESEM). The adhesion was measured by scratch tester. The adhesion of DLC films was increased when nitriding layer was formed before DLC deposition. Therefore, the adhesion of DLC film can be enhanced as increasing the hardness of materials.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.365-368
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• 2002

We investigated the influence of RTP annealing of multi-layered metal films deposited on oxides layer. Two types of oxides, BPSG and P-7205, were used as a bottom layer under multi-layered metal film. The bonding was not good in metal/BPSG/Si samples because adhesion between metal layer and BPSG oxide layer was poor by interfacial reaction during RTP annealing above 650$^{\circ}C$. On the other hand bonding was always good in metal/ P-TEOS /Si samples regardless of annealing temperature. We observed the interface between oxide and metal layers using AES and TEM. The phosphorus and oxygen profile in interface between metal and oxide layers were different in metal/BPSG/Si and metal/P-TEOS/Si samples. We have known that the properties of interface was improved in metal/BPSG/Si samples when the sample was annealed below 650$^{\circ}C$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.1
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• pp.15-20
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• 2004

The interfacial layer between the oxide film and the metal film according to RTP annealing temperature of metal film has been studied. Two types of oxides, BPSG and PETEOS, were used as a bottom layer under multi-layered metal films. We observed the interface between oxide and metal films using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Bonding failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal films above $650^{\circ}C$ RTP anneal. The phosphorus accumulation layer was observed at interface between BPSG oxide and metal films by AES and TEM measurements. On the other hand, bonding was always good in the sample using PETEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal films was improved when the sample was annealed below $650^{\circ}C$.

• The Journal of the Acoustical Society of Korea
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• v.33 no.2
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• pp.102-110
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• 2014

The effect of a bonding layer on the performance of a quarter-wave (${\lambda}/4$) mode PVDF ultrasound transducer having not only a piezoelectric layer but also a non-piezoelectric layer between two electrodes was analyzed. The equivalent circuit of a transmission line model by Kikuchi et al.[Sound of IEICE, 55-A, 331-338 (1981)] was introduced for the analysis. The validity of the model was confirmed by comparison with a KLM model for three postulated adhesion cases of a $80{\mu}m$ thick piezoelectric PVDF film to a copper (Cu) backer. The pulse-echo responses of five PVDF transducers, each fabricated with a different thickness ($5{\mu}m{\sim}20{\mu}m$) of the bonding layer, were measured and the results were compared with those by simulation. The two results were in good agreement with each other and it was noted that the effect of the bonding layer on the performance of the transducer could be analyzed by the Kikuchi model. In detail, the $20{\mu}m$ bonding layer decreased the center frequency and the bandwidth by about 19.7 % and 25.0 %, respectively, and increased the insertion loss by 57.2 %.