• Title/Summary/Keyword: Bonding adhesion layer

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Improvement of Adhesion Strength of DLC Films on Nitrided Layer Prepared by Linear Ion Source

  • Shin, Chang-Seouk;Kim, Wang-Ryeol;Park, Min-Seok;Jung, Uoo-Chang;Chung, Won-Sub
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.177-179
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    • 2011
  • The purpose of this study is to enhance an adhesion between substrate and Diamond-like Carbon (DLC) film. DLC has many outstanding properties such as low friction, high wear resistance and corrosion resistance. However, it is difficult to achieve enough adhesion because of weak bonding between DLC film and the substrate. For improvement adhesion, a layer between DLC film and the substrate was prepared by dual post plasma. DLC film was deposited on nitrided layer by linear ion source. The composed compound layer between substrate and DLC film was investigated by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The synthesized bonding structure of DLC film was analyzed using a micro raman spectrometer. Mechanical properties were measured by nano-indentation. In order to clarify the mechanism for improvement in adhesive strength, it was observed by scratch test.

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Characteristics of the Adhesion Layer for the Flexible Organic Light Emitting Diodes (플렉시블 OLED 소자 제작을 위한 접합층 특성 연구)

  • Cheol-Hee Moon
    • Journal of Adhesion and Interface
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    • v.24 no.3
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    • pp.86-94
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    • 2023
  • To fabricate all-solution-processed flexible Organic Light-Emitting Diodes (OLEDs), we demonstrated a bonding technology using a polyethyleneimine (PEI) as an adhesion layer between the two substrates. As the adhesion layer requires not only a high adhesion strength, but also a high current density, we have tried to find out the optimum condition which meets the two requirements at the same time by changing experimental factors such as PEI concentration, thickness of the layer and by mixing some additives into the PEI. The adhesion strength and the electrical current density were investigated by tensile tests and electron only device (EOD) experiments, respectively. The results showed that at higher PEI concentration the adhesion strength showed higher value, but the electrical current through the PEI layer decreased rapidly due to the increased PEI layer thickness. We added Sorbitol and PolyEthyleneGlycohol (PEG) into the 0.1 wt% PEI solution to enhance the adhesion and electrical properties. With the addition of the 0.5 wt% PEG into the 0.1 wt% PEI solution, the device showed an electrical current density of 900 mA/cm2 and a good adhesion characteristic also. These data demonstrated the possibility of fabricating all-solution-processed OLEDs using two-substrate bonding technology with the PEI layer as an adhesion layer.

The effect of the gold based bonding agents on the bond between Ni-Cr alloys and ceramic restorations (Ni-Cr합금과 도재간의 결합력에 gold-based bonding agent가 미치는 영향)

  • Lee, Jung-Hwan;Joo, Kyu-Ji
    • Journal of Technologic Dentistry
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    • v.29 no.2
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    • pp.213-223
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    • 2007
  • The success of a porcelain fused to metal (PFM) restoration depends upon the quality of the porcelain-metal bond. The adhesion between metal substructure and dental porcelain is related to the diffusion of oxygen to the reaction layer formed on cast-metal surface during firing. The purposed of this investigation was to study the effects of gold based bonding agent on Ni-Cr alloy-ceramic adhesion between porcelain matrix, gold based bonding agent and metal substructure interface. gold based bonding agent have been applied as an intermediate layer between a metal substructure and a ceramic coating. gold based bonding agent(Aurofilm NP, Metalor, Swiss) was applied on Ni-Cr alloy surface by four method. Surfaces only air abraded with 110${\beta}\neq$ Al2O3 particles were used as control. metal ceramic adhesion was evaluated by a biaxial flexure test(N=5) and volume fraction of adherent porcelain was determined by SEM/EDS analysis. Result of this study suggest that the layering sequence of gold based bonding agent is very important and can improve porcelain adherence to PFM.

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Hot AC Anodising as a Cr(VI)-free Pre-treatment for Structural Bonding of Aluminium

  • Lapique, Fabrice;Bjorgum, Astrid;Johnsen, Bernt;Walmsley, John
    • Journal of Adhesion and Interface
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    • v.4 no.2
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    • pp.21-29
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    • 2003
  • Hot AC anodising has been evaluated us pre-treatment for aluminium prior to structural adhesive bonding. Phosphoric and sulphuric acid hot AC anodising showed very promising adhesion promoter capabilities with durability comparable with the best standard DC anodising procedures. AC anodising does not required etching prior to anodising and offers u pre-treatment time down to 20 seconds. The interface/interphase between the aluminium substrate and the adhesive was investigated in order to get a better understanding of the involved adhesion mechanisms and to explain the long-tenn properties. The alkaline medium formed at the oxide layer/adhesive interface has been shown to induce a partial dissolution of the oxide layer leading to the formation of metallic ions which diffuse in the adhesive (EPMA measurements). The effect of diffusion of the Al ions on adhesion and joint durability is still uncertain but studies showed that pre-bond moisture affected the joints durability and to some extent the diffusion length. specially for DC anodised samples. So far no direct correlation could be established between the diffusion length d and the joints durability but new trials with better control over the elapsed time between bonding and adhesive curing are expected to help getting a better understanding of the involved mechanisms.

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Adhesion of Model Molecules to Metallic Surfaces, the Implications for Corrosion Protection

  • de Wit, J.H.W.;van den Brand, J.;de Wit, F.M.;Mol, J.M.C.
    • Corrosion Science and Technology
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    • v.7 no.1
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    • pp.50-60
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    • 2008
  • The majority of the described experimental results deal with relatively pure aluminium. Variations were made in the pretreatment of the aluminum substrates and an investigation was performed on the resulting changes in oxide layer composition and chemistry. Subsequently, the bonding behavior of the surfaces was investigated by using model adhesion molecules. These molecules were chosen to represent the bonding functionality of an organic polymer. They were applied onto the pretreated surfaces as a monolayer and the bonding behavior was studied using infrared reflection absorption spectroscopy. A direct and clear relation was found between the hydroxyl fraction on the oxide surfaces and the amount of molecules that subsequently bonded to the surface. Moreover, it was found that most bonds between the oxide surface and organic functional groups are not stable in the presence of water. The best performance was obtained using molecules, which are capable of chemisorption with the oxide surface. Finally, it was found that freshly prepared relatively pure aluminum substrates, which are left in air, rapidly lose their bonding capacity towards organic functional groups. This can be attributed to the adsorption of contamination and water to the oxide surface. In addition the adhesion of a typical epoxy-coated aluminum system was investigated during exposure to water at different temperatures. The coating was found to quite rapidly lose its adhesion upon exposure to water. This rapid loss of adhesion corresponds well with the data where it was demonstrated that the studied epoxy coating only bonds through physisorptive hydrogen bonding, these bonds not being stable in the presence of water. After the initial loss the adhesion of the coating was however found to recover again and even exceeded the adhesion prior to exposure. The improvement could be ascribed to the growth of a thin oxyhydroxide layer on the aluminum substrate, which forms a new, water-stable and stronger bond with the epoxy coating. Two routes for improvement of adhesion are finally decribed including an interphasial polymeric thin layer and a treatment in boiling water of the substrate before coating takes place. The adhesion properties were finely also studied as a function of the Mg content of the alloys. It was shown that an enrichment of Mg in the oxide could take place when Mg containing alloys are heat-treated. It is expected that for these alloys the (hydr)oxide fraction also depends on the pre-treatment and on the distribution of magnesium as compared to the aluminium hydroxides, with a direct impact on adhesive properties.

A Study on the Joint Performance Change of Self-Admixed Waterproofing Sheet by Induced Bonding of Asphalt Compound (아스팔트 컴파운드 간 접합을 유도한 자착식 방수 시트의 시트 간 접합부 성능 변화 연구)

  • Kim, Dong-Bum;Kim, Sun-Do;Park, Jin-Sang;Ko, Sam Seog;Kim, Byoung-Il;Oh, Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2017.05a
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    • pp.234-235
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    • 2017
  • The bonding of the asphalt-based waterproof sheet is carried out in such a manner that the sheet and the sheet are adhered together and the lower adhesive layer of one sheet is adhered to the upper film layer of the other sheet, and the asphalt layer and the PE or HDPE film layer are bonded. When the joints are formed in the form of junctions between heterogeneous materials and exposed to the concrete joint movements and other deteriorating factors, the integrity of the joints can deteriorate and problems such as lifting and peeling off of the joints can occur. Therefore, this study was carried out to prevent unstable joint adhesion of the asphalt compound and film layer and to prevent defects in the adhesion between self - adhesive waterproof sheets. The self-adhesive waterproof sheet of this study can maximize bond stability by inducing bond between asphalt compounds during sheet-to-sheet bonding, thereby improving bonding strength.

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Adhesive bonding using thick polymer film of SU-8 photoresist for wafer level package

  • Na, Kyoung-Hwan;Kim, Ill-Hwan;Lee, Eun-Sung;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Journal of Sensor Science and Technology
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    • v.16 no.5
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    • pp.325-330
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    • 2007
  • For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

Improved Adhesion of DLC Films by using a Nitriding Layer on AISI H13 Substrate

  • Park, Min-Seok;Kim, Dae-Young;Shin, Chang-Seouk;Kim, Wang Ryeol
    • Journal of the Korean institute of surface engineering
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    • v.54 no.6
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    • pp.307-314
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    • 2021
  • Diamond-like carbon (DLC) is difficult to achieve sufficient adhesion because of weak bonding between DLC film and the substrate. The purpose of this study is to improve the adhesion between substrate and DLC film. DLC film was deposited on AISI H13 using linear ion source. To improve adhesion, the substrate was treated by dual post plasma nitriding. In order to define the mechanism of the improvement in adhesive strength, the gradient layer between substrate and DLC film was analyzed by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The microstructure of the DLC film was analyzed using a micro Raman spectrometer. Mechanical properties were measured by nano-indentation, micro vickers hardness tester and tribology tester. The characteristic of adhesion was observed by scratch test. The adhesion of the DLC film was enhanced by active screen plasma nitriding layer.

Effects of Intermediate Layer in DLC Thin Film on Al2O3 for Improvement of High Temperature Strength

  • Ok, Chul-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.3
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    • pp.125-130
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    • 2007
  • DLC coating on ceramics is very useful for manufacturing the materials with hardness and low friction. Adhesion of DLC thin film on ceramics, on the other hand, is usually very weak. Adhesion of DLC film depends on many parameters such as contamination and chemical bonding between thin film and substrate. In this study, adhesion of DLC film on ceramics was improved by the intermediate layer when the plasma immersion ion deposition (PIID) technique was applied. It is found that the chemical composition and the thickness of intermediate layer have significantly an effect on the adhesion of DLC thin film on $Al_2O_3$.

EFFECT OF COLLAGEN DISSOLUTION IN ACID CONDITIONED DENTIN LAYER ON RESIN-DENTIN ADHESION (산 표면처리된 상아질 표층의 교원섬유 용해가 레진-상아질간 결합에 미치는 영향)

  • Son, Ho-Hyun
    • Restorative Dentistry and Endodontics
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    • v.20 no.2
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    • pp.856-868
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    • 1995
  • The effect of collagen dissolution in acid conditioned dentin layer on resin - dentin adhesion was investigated. 160 freshly extracted human molars were divided into 4 groups randomly and dentin surfaces were exposed. 40 exposed dentin surfaces were not acid conditioned and each 10 of them were applied with bonding agents within dentin bonding systems of All Bond 2, Scotchbond Multipurpose, Clearfil Photobond and Superbond D - Liner respectively. Each 10 of another 40 exposed dentin surfaces were acid conditioned by the acid within the above four bonding systems respectively and applied with corresponding bonding systems. After acid conditioning of the other 40 exposed dentin surfaces as above, they were treated with 5% NaOCl for 2 minutes, and each 10 of them were applied with the above four dentin bonding systems respectively. The remaining 40 dentin surfaces were acid conditioned and treated with 10% NaOCl for 2 minutes, and each 10 of them were applied with corresponding bonding agents as the above. After the procedures were finished, composite resin (Z -100, 3M Dent. Prod., USA) were applied on the dentin surfaces and light cured. Shear bond strength values were measured. Surface changes of fractured dentin specimens were observed using SEM (Hitachi S-2350, Japan). The following results were obtained. 1. In all of dentin bonding systems, shear bond strengths of non - conditioned specimens were significantly lower than those of acid conditioned specimens (P<0.05). 2. A statistically significant difference of bond strengths did not exist between acid conditioned specimens and 5% NaGCI retreated specimens applied with All Bond 2, Scotchbond Multipurpose and Clearfil Photobond (P>0.05). However, strength values of 5% NaOCl retreated specimens applied with Superbond D - Liner were lower than those of acid conditioned specimens (P<0.05). 3. In all the applied dentin bonding systems except Clearfil Photobond, bond strengths of 10% NaOCl retreated specimens were lower than those of acid conditioned and 5% NaOCl retreated specimens (P<0.05). 4. The resin - dentin hybrid layer of 4 - $5{\mu}m$ thickness was formed in the acid conditioned specimens applied with All Bond 2, Scotchbond Multipurpose and Superbond D-Liner. 5. The resin - dentin hybrid layer of 3 - $4{\mu}m$ thickness was still formed in the 5% NaOCl retreated specimens applied with All Bond 2 and Scotchbond Multipurpose. In addition, this layer was not completely removed after the retreatment with 10% NaOCl. Above results indicate that the dissolution of collagen in acid conditioned dentin layer by NaOCl solution can not be achieved completely and the collagens contribute to the resin - dentin adhesion considerably.

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