• Korean Journal of Crystallography
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• v.14 no.1
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• pp.16-23
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• 2003

The electronic structure and chemical bonding of β-MnO₂ were theoretically investigated by DV-X/sub α/ (the discrete variation X/sub α/) method. which is a sort of the first principle molecular orbital method using Hatre-Fock-Slater approximation. The calculations on several cluster models having different sizes were carried out for the determination of a model suited for analyzing bulk state. The Mn/sub 15/O/sub 56/ model was selected as a sufficiently suitable model for the calculation of electronic state and chemical bonding by the comparison of the calculated XPS (X-ray photo-electron spectrum) and experimentally measured XPS. By using this model, the electron energy level, the density of state, the bond overlap population, the charge density distribution, and the net ionic transfer between cations and anions were calculated and discussed.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• International Journal of Advanced Culture Technology
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• v.8 no.2
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• pp.246-251
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• 2020

Dimethyl Ether(DME) engine use a highly efficient alternative fuel having a great quantity of oxygen and has a advantage no polluting PM gas. The existing DME fuel cam material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding piston shoe and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The hardness of specimen and bonding rate were measured using ultrasound equipment. The bonding state of each condition was excellent, and the thickness of mid-layer, temperature and maintaining time were measured. The mid-layer thickness according to bonding temperature and maintaining time were observed with optical microscope. We analyzed the micro-structural analysis, formation of bonding specimen, wafer fabrication and fuel cam abrasion test. Throughout this study, we confirmed that the fuel cam for DME engine which demands high durability against velocity and pressure is excellent.

• Journal of Sensor Science and Technology
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• v.25 no.3
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• pp.173-177
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• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.11a
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• pp.192-193
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• 2020

In reinforced concrete adhesion studies, the demolition of the specimen is inevitably involved, and the studies conducted are limited to the macro load-displacement analysis. In order to establish an elaborate model for concrete bonding reinforced rebars, it is necessary to observe the rebar bonding behavior in the in-situ state. In this study, specially manufactured reinforcing bars, micro-UTM and 𝝁-computer tomography (𝝁CT) are used to observe reinforcing bars in the in-situ state. As a result of the monotonic pullout test of the processed reinforcing bar, maximum bond stress were shown to be 16.7MPa, which is slightly higher than the existing 10 to 12 MPa, and then the empty space inside the specimen in which the pullout test was conducted using 𝝁CT was confirmed. Through additional research, the fracture phenomenon of concrete excluding voids will be studied.

• Structural Engineering and Mechanics
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• v.23 no.1
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• pp.97-113
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• 2006

A simply supported hybrid plate consisting of top and bottom functionally graded elastic layers and an intermediate actuating or sensing homogeneous piezoelectric layer is investigated by an elasticity (piezoelasticity) method, which is based on state space formulations. The general spring layer model is adopted to consider the effect of bonding adhesives between the piezoelectric layer and the two functionally graded ones. The two functionally graded layers are inhomogeneous along the thickness direction, which are approached by laminate models. The effect of interlaminar bonding imperfections on the static bending and free vibration of the smart plate is discussed in the numerical examples.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.363-363
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• 2006

Bonding of composite materials with an adhesive layer is one of the most promising alternatives to classical bonding techniques. The use of several surface treatments may greatly increase this adhesion behavior at the initial state. Then in order to see the influence of the thickness of polymer matrix on the adhesion of composite assembly, different surface treatment, which can reduce or increase this thickness, are used (peel ply, tear ply, excimer laser). The influence of this specific parameter is not only discussed at the initial state but also after thermal ageing of the whole bonded assembly. Results show that the best performances at the initial state are not obviously the best performances after ageing.

• Bulletin of the Korean Chemical Society
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• v.16 no.7
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• pp.574-577
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• 1995

Solvatochromic effect and hydrogen bonding interaction of NPNOH, NPNO- and NPNOR were investigated. Electronic transition energies of the dyes were plotted against empirical solvent polarity parameters, Taft's π* and Reichardt's ET(30). Good correlations were observed when the excitation energies were plotted against the energy calculated by multiple linear regression method which was developed by Taft. There is an intrinsic difference between betaine for ET(30) polarity scale and the azoderivative, which is derived from the specific hydrogen bond incurred with probe molecules and solvents. The hydrogen bonding plays a very important role for stabilization of an excited state molecule by solvents especially when a solute possesses a negative charge as with NPNO-.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.6-13
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• 2022

The electrostatic phenomenon seriously issued in extreme ultraviolet semiconductor cleaning was studied in junction with molecular dynamic aspect. It was understood that two lone pairs of electrons in water molecule were subtly different each other in molecular orbital symmetry, existed as two states of large energy difference, and became basis for water clustering through hydron bonds. It was deduced that when hydrogen bond formed by lone pair of higher energy state was broken, two types of [H₂O]⁺ and [H₂O]^- ions would be instantaneously generated, or that lone pair of higher energy state experiencing reactions such as friction with Teflon surface could cause electrostatic generation. It was specifically observed that, in case of electrolyzed cathode water, negative electrostatic charges by electrons were overlapped with negative oxidation reduction potentials without mutual reaction. Therefore, it seemed that negative electrostatic development could be minimized in cathode water by mutual repulsion of electrons and [OH]^- ions, which would be providing excellences on extreme ultraviolet cleaning and electrostatic control as well.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.