• Journal of Powder Materials
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• v.12 no.1
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• pp.30-35
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• 2005

An aluminum powder compact consolidated by a powder-in sheath rolling (PSR) method was severely deformed by accumulative roll-bonding (ARB) process. The ARB process was performed up to 8 cycles at ambient temperature without lubrication. Optical microscope and transmission electron microscope observations revealed that microstructure of the ARB-processed Al powder compact is inhomogeneous in the thickness direction. The ultra-fine subgrains often reported in the ARB-processed bulky materials were also developed near surface of the Al powder compacts in this study. Tensile strength of the ARB-processed Al powder compact increased at the 1st cycle, but from the 2nd cycle it rather decreased slightly.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.393-396
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• 2005

This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.47-51
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• 2013

Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.240-245
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• 2005

An oxygen free copper was severely deformed by accumulative roll-bonding (ARB) process for improvement of its mechanical properties. Two copper sheets 1 m thick, 30 mm wide and 300 m long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about $50\%$ reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles $(\varepsilon-6.4)$. TEM observation revealed that ultrafine grains were developed after the third cycle, and their size was slightly increased at higher cycles. Tensile strength of the copper increased with the strain at low strain levels, but it hardly increased from 3 cycles $(\varepsilon>2.4)$ due to occurrence of dynamic recovery, even if the imposed strain increased.

• Transactions of Materials Processing
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• v.12 no.1
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• pp.60-65
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• 2003

HIP diffusion bonding of Ni-based superalloys, cast Mar-M247 (MM247) and Udimet 720 (U720) powder, was experimentally and numerically studied. Subsolvus HIP treatment was optimized by investigating the variations of high temperature tensile properties of HIP-bonded specimens with powder size, HIP'ing time, etc. While the tensile strength at high temperatures showed no detectable changes, the tensile elongation and reduction in area were slightly increased as the powder size decreased from -140 mesh to -270 mesh. While as-HIP'ed U720 showed a high tensile strength comparable to that of lorded U720 alloy, the HIP diffusion-bonded specimen showed a strength lower than the forged U720 alloy and the cast MM247 alloy The increase of HIP'ing tune from 2 hours to 3 hours resulted in a rapid risc of tensile strength and elongation due to the disappearence of microvoids in the cast MM247. FEM simulation for HIP process was conducted by applying the McMeeking micromechanical model, which uses power-law creep model as constitutive equations. ABAQUS user subroutine CREEP with an implemented microscopic model was used for the simulation. Numerical simulation was shown to be essential for the near-net shape manufacturing as well as the HIP process optimization.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.592-597
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• 2006

A deoxidized low-phosphorous (DLP) copper was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two copper sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles (${\varepsilon}{\sim}6.3$). TEM observation revealed that ultrafine grains were developed after the 4th cycle, and their size decreased at higher cycles. Tensile strength of the copper increased with the equivalent strain, and it reached 547 MPa which was 3 times higher than that of the initial material. It is concluded that the ARB process is an effective method for high strengthening of the DLP copper.

• Journal of Welding and Joining
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• v.26 no.6
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• pp.74-80
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• 2008

A finite element modeling approach has been described for the simulation and analysis of the micron-scaled solid particle impact behavior in kinetic spraying process, using an explicit code (ABAQUS 6.7-2). High-strain-rate plastic deformation and interface bonding features of the copper, nickel, aluminum, and titanium were investigated via FEM in conjunction with the Johnson-Cook plasticity model. Different aspects of adiabatic shear instabilities of the materials were characterized as a concept of thermal boost-up zone (TBZ), and also discussed based upon energy balance concept with respect to relative recovery energy (RRE) for the purpose of optimizing the bonding process.

• Journal of the Korea Society for Simulation
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• v.17 no.4
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• pp.21-27
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• 2008

In this paper, we design and implement the upstream packet bandwidth allocation algorithm on OPNET-based DOCSIS 3.0 simulator including channel-bonding CM (Cable Modem)s. Previous DOCSIS CM could not support channel bonding, it has problem in upstream bandwidth allocation and determine the contention area. The proposed upstream bandwidth allocation algorithm has been improved the queuing time and success rate. For the simulation, we design the MAC frame structure with channel bonding supported CM and not. And then, this paper design and implement the CMTS node model, CM node model, CMTS process model, and CM process model.

• ETRI Journal
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• v.38 no.6
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.