• Transactions of Materials Processing
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• v.13 no.7
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• pp.623-628
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• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.91-98
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• 2024

This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest "theoretically" possible temperature of 145 ℃. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 ℃, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 ℃. In particular, it is interesting to note that in the pressure sintering bonding process at 145 ℃, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 ℃, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 ℃, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.225-228
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• 2003

This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

• Transactions of Materials Processing
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• v.7 no.1
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• Journal of Welding and Joining
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• v.8 no.3
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• pp.31-38
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• 1990

The bonding mechanism and bond strength were investigated for the cold pressure welding of Al to Al, Cu to Cu and Al to Cu by upsetting. A phenomenon of bonding betweenthe metallic components has been observed by a scanning electron microscope and metallurgical microscope. A modified equation for bond strength with respect to the reduction of height shows reasonably a good agreement with the experimental data. When the values of the hardening factor and threshold deformation for the given materials could be determined, the theoretical bond strength can be calculated.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.19-26
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

• The Journal of Korean Academy of Prosthodontics
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• v.31 no.3
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• pp.385-393
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• 1993

Injection processing of denture base resin was introduced by Pryer in 1942, in an attempt to reduce processing shrinkage. More recently a continuous-pressure injection type technique has been developed (SR-Ivocap, Ivoclar AG, Schaan, Liechtenstein.), and it reduced processing error and increased resin density. The purpose of this study was to compare tensile bond strength of heat-cured, cold-cured, and light-cured denture base resin bonded to continuous-pressure injection type resin. To know it, 60 cylindrical resin specimens were fabricated, and tensile bond strength were measured. The results were as follows : 1. The mean tensile bond strength bonded to continuous-pressure injection type resin was lower than bonded to conventional heat cured resin. But tensile bond strength of conventional heat cured resin bonding with light cured resin was lower than continuous-pressure injection type resin. 2. Of the tensile bond strength bonded to continuous-pressure injection type resin, tensile bond strength bonding with continuous-pressure injection type resin was the greatest(but not significantly different from bonding with conventional heat cured resin), followed by cold-cured, light-cured resin. 3. Of the tensile bond strength bonded to conventional heat cured resin, tensile bond strength bonding with conventional heat cured resin was the greatest and followed by continuous-pressure injection type resin, cold-cured resin, light-cured resin. According to these results, bonding of continuous-pressure injection type resin with conventional heat cured resin or continuous-pressure injection type resin is acceptable, but bonding with light-cured resin is questionable.

• Journal of the Korean Society for Nondestructive Testing
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• v.26 no.5
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• pp.343-352
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• 2006

In the present paper, the nondestructive test method was suggest to establish the bonding status of a motor case assembly composed of a steel motor case, adiabatic rubber layer and an ablative composite tube with strain data, AE(acoustic emission) signals and UT(ultrasonic test) data. And, finite element analysis was conducted to verify quantitatively the bonding status of motor case assembly under inner pressure loading. The bonding status could be judged whether the bonding status is perfect or contact condition by the data correlation study with AE signals and strain data measured from air pressure test. And, to classify the bonding status of motor case and rubber layer among bonding layers, UT method was also applied. From this study, the bonding status could be classified and detected into fourth types for all bonding layers as follows: (1) initial un-bonding, (2) perfect do-bonding during an air pressure test, (3) partially de-bonding during an air pressure test, and (4) perfect bonding.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.