• International Journal of Advanced Culture Technology
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• v.8 no.2
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• pp.246-251
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• 2020

Dimethyl Ether(DME) engine use a highly efficient alternative fuel having a great quantity of oxygen and has a advantage no polluting PM gas. The existing DME fuel cam material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding piston shoe and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The hardness of specimen and bonding rate were measured using ultrasound equipment. The bonding state of each condition was excellent, and the thickness of mid-layer, temperature and maintaining time were measured. The mid-layer thickness according to bonding temperature and maintaining time were observed with optical microscope. We analyzed the micro-structural analysis, formation of bonding specimen, wafer fabrication and fuel cam abrasion test. Throughout this study, we confirmed that the fuel cam for DME engine which demands high durability against velocity and pressure is excellent.

• Transactions of Materials Processing
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• v.28 no.1
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• pp.15-20
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• 2019

The superplastic forming/diffusion bonding process has been developed to fabricate a core frame structure with joint nodes out of tubes, for the development of a titanium high performance bicycle. The hydroforming process has been applied for bulging of a tube in the superplastic condition before, and during the diffusion bonding process. In this experiment, a commercial Ti-3Al-2.5V tube was selected as raw material for the study. The forming experiment has been performed using a servo-hydraulic press with a capacity of 200 ton. Next, nitrogen gas was used to acquire necessary pressure for the bulging and bonding of the tubes to fabricate the joint nodes. The pertinent processing temperature was $870^{\circ}C$ for the superplastic hydroforming/diffusion bonding (SHF/DB) process, using the Ti-3Al-2.5V tube. The bonding quality and the progress of bulging and diffusion bonding have been observed by the investigation of the joining interfaces at the cross section of the joint structure. The control of the nitrogen pressure throughout the SHF/DB process, was an important factor to avoid any significant defects in the joint structure. The whole progress stage of the diffusion bonding could be observed at a joint interface. A core structure with 5 joint nodes to manufacture a titanium bicycle could be obtained in a SHF/DB process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.1
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• pp.9-15
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• 2008

Mokumegane is one of the sophisticated metal craft techniques enabling wood grain surface effect. To embody the mokumegane, an ingot of well-bonded stacked metal plates has been required. Traditionally prepared mokumegane ingots were bonded using charcoal which enables reduction atmosphere, but sometimes end up with collapse of bonding interface due to the lack of reliable process control. We proposed a systematic vacuum direct bonding process for ingots. First, we confirmed copper//copper homogeneous plate bonding at $900^{\circ}C$ by applying uniaxial press of 2.5kg. We observed 80min required to obtain 90%-bonding ratio and the diffusion coefficient would be enhanced up to 100 times due to surface effect. Second, by considering enhanced diffusion behavior, we also obtained optimum bonding condition in copper/silver heterogeneous plates that ensures 90%-bonding ratio at $700^{\circ}C$ for 10min with apply uniaxial press. A 7-layered copper/silver ingot is prepared successfully, and eventually the prototype mokumegane cases for mobile phone were fabricated with these ingot.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.1
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• pp.34-40
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• 2012

In this study, effects of bonding agent, e.g. epoxy, on the behavior of fundamental guided wave modes propagated in FRP plate bonded on a concrete, are investigated. Global matrix model of multilayered FRP-epoxy-concrete system was constructed to obtain the velocity and attenuation dispersion curves of the fundamental A0 and S0 modes. Two variables, thickness and elastic modulus of epoxy layer, were considered in the dispersion analysis. It was found that both the thickness and the elastic modulus of epoxy layer greatly affect the phase velocity and attenuation of S0 mode while those are negligible for A0 mode. Based on the results, it was concluded that S0 mode is more effective than A0 mode for bonding condition assessment for FRP plate bonded concrete.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.76-83
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• 2013

This study investigated the effect of bonding temperature and holding time on microstructures and mechanical properties of diffusion bonded joint of Haynes230. The diffusion bonds were performed at the temperature of 950, 1050, and $1150^{\circ}C$ for holding times of 30, 60, 120 and 240 minutes at a pressure of 4MPa under high vacuum condition. The amount of non-bonded area and void observed in the bonded interface decreased with increasing bonding temperature and holding time. Cr-rich precipitates at the linear interface region restrained grain migration at $950^{\circ}C$ and $1050^{\circ}C$. However, the grain migration was observed in spite of short holding time due to the dissolution of precipitates to base metal in the interface region at $1150^{\circ}C$. Three types of the fracture surface were observed after tensile test. The region where the coalesce and migration of grain occurred much showed high fracture load because of base metal fracture whereas the region where those did less due to the precipitates demonstrated low fracture load because of interface fracture. The expected fracture load could be derived with the value of fracture area of base metal ($A_{BF}$) and interface ($A_{IF}$), $Load=201A_{BF}+153A_{IF}$. Based on this equation, strength of base metal and interface fracture were calculated as 201MPa and 153MPa, respectively.

• Transactions of Materials Processing
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• v.5 no.1
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• pp.37-46
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• 1996

Superplastic forming/diffusion bonding (SPF/DB) processes were analyzed using a rigid visco-plastic finite element method. The optimum pressure-time relationship for a target strain rate and thickness distributions were predicted by two-node line elements based on the membrane approximation for plane strain. Material behavior during SPF/DB of the integral structures having complicated shapes was investigated. The tying condition is employed for the analysis of inter-sheet contact problems. A movement of rib structure is successfully predicted during the forming.

• Journal of Welding and Joining
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• v.10 no.3
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.9
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• pp.718-723
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• 2010

In this paper, the following results were obtained from the experiment in which electrification voltage of silicone rubber specimen for thermal bonding were measured under various time, temperature ($10{\sim}40^{\circ}C$), and humidity (30~90%) conditions and different amount of carbon additives (0~15 phr (per hundred resin)). Electrostatics electrification voltage decreased when carbon is up to 10 phr, and there was no electrification voltage in 15 phr condition. The electrostatics electrification voltage did not change over time. When the temperature was constant, electrostatics electrification voltage sharply dropped when the humidity was around 70%. That means, this condition might be appropriate for prevention of charging. The electrification voltage decreased as humidity and amount of carbon increased.

• Journal of the Korean Society for Heat Treatment
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• v.6 no.1
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• pp.9-16
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• 1993

To investigate the properties of diffusion bonding of 7050 Al alloy, the diffusion bonding joints have been produced in self-made diffusion bonding hot-press which admits a defined application of the bonding pressure during the heating phase and also rapid cooling after the bonding process with various bonding condition. The strength of the bond increases with increasing the bonding time and temperature. Shear test at toom temperature showed that high strength up to 70% that of parent metal (320 MPa), 220 MPa for the specimen bonded 14 hr at $560^{\circ}C$, with 3 MPa. In this case, however, there is large deformation more than 20% reduction in thickness. The results were correlated with joint characteristics found by optical microstructure and by fractography by SEM. When the strengths of the bonds are more than 50% that of parent metal, a great deal of dimples stretched along the direction of shear stress are observed over the fractured surface of the bond. On the microstructure of the bond line, initial mophology of the bond line disapeared for the grain boundary migration with increasing the bonding time.