• 제목/요약/키워드: Bonding -Film

검색결과 522건 처리시간 0.037초

Epoxy bonding film의 phenoxy resin 함량에 따른 특성 변화 (Effect of phenoxy resin content on Properties of Epoxy Bonding Film)

  • 김상현;이우성;강남기;유명재
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.228-228
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    • 2008
  • 본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

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다이오드레이저를 이용한 디스플레이 모듈 내 이방성 전도 필름(ACF) 접합 기술에 관한 연구 (Study on a New ACF Bonding Methods in LCD Module Using a High Power Diode Laser)

  • 류광현;서명희;남기중;곽노흥
    • 한국레이저가공학회지
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    • 제8권3호
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    • pp.21-26
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    • 2005
  • A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

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XRD의 결정구조로 살펴본 GZO 박막의 온도의존성 (Temperature Dependence of Bonding Structure of GZO Thin Film Analyzed by X-ray Diffractometer)

  • 오데레사
    • 반도체디스플레이기술학회지
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    • 제15권1호
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    • pp.52-55
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    • 2016
  • GZO film was prepared on p-type Si wafer and then annealed at various temperatures in an air conditions to research the bonding structures in accordance with the annealing processes. GZO film annealed in an atmosphere showed the various bonding structure depending on annealing temperatures and oxygen gas flow rate during the deposition. The difference of bonding structures of GZO films made by oxygen gas flows between 18 sccm and 22 sccm was so great. The bonding structures of GZO films made by oxygen gas flow of 18 sccm were showed the crystal structure, but that of 22 sccm were showed the amorphous structure in spite of after annealing processes. The bonding structure of GZO as oxide-semiconductor was observed the trend of becoming amorphous structures at the temperature of $200^{\circ}C$. Therefore, the characteristics of oxide semiconductor are needed to research the variation near the annealing at $200^{\circ}C$.

고강력 직물의 열융착 라미네이팅을 통한 충격 완화용 에어쿠션 소재로의 적용 가능성 검토 연구 (Study on the Applicability of the Air Cushion Material for Impact Relief through Thermal Bonding of High Strength Fabrics)

  • 김지연;김훈민;민문홍
    • 한국염색가공학회지
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    • 제32권3호
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    • pp.176-183
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    • 2020
  • In order to study wearable air cushion materials capable of responding to massive impact in high-altitude fall situation, high tenacity woven fabrics were bonded by heat only depending on various type of thermoplastic films and then mechanical properties were measured. Tensile strength, elongation, and 100% modulus measurement results for 4 types of films show that TPU-2 has higher impact resistance and easier expansion than PET-1. After thermal bonding, the combination with the highest tensile strength was a material with a TPU-2 film for nylon and a PET-2 film for PET, so there was a difference by type of fabric. The tear strength of the bonded materials were increased compared to the fabric alone, which shows that durability against damage such as tearing can be obtained through film adhesion. All of the peel strengths exceeded the values required by automobile airbags by about 5 times, and the TPU-2 bonded fabric showed the highest value. The air permeability was 0 L/dm2 /min. For both the film and the bonded material, which means tightness between the fabric and the film through thermal bonding. It is expected to be applied as a wearable air cushion material by achieving a level of mechanical properties similar to or superior to that of automobile airbags through the method of bonding film and fabric by thermal bonding.

Bonding And Anti-bonding Nature of Magnetic Semiconductor Thin Film of Fe(TCNQ:tetracyanoquinodimethane)

  • Jo, Junhyeon;Jin, Mi-jin;Park, Jungmin;Modepalli, Vijayakumar;Yoo, Jung-Woo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.294-294
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    • 2014
  • Developing magnetic thin films with desirable physical properties is a key step to promote research in spintronics. Organic-based magnetic material is a relatively new kind of materials which has magnetic properties in a molecular and microscopic level. These materials have been constructed by the coordination between 3d transition metal and organic materials producing long-range magnetic orders with a relatively high transition temperature. However, these materials were mostly synthesized as a form of powder, which is difficult to study for their physical properties as well as apply for electronic/spintronic devices. In this study, we have employed physical vapor deposition (PVD) to develop a new organic-based hybrid magnetic film that is achieved by the coordination of Fe and tetracyanoquinodimethane (TCNQ). The IR spectra of the grown film show modified CN vibration modes in TCNQ, which suggest a strong bonding between Fe and TCNQ. The thin film has both ferromagnetic and semiconducting behaviors, which is suitable for molecular spintronic applications. The high resolution photoemission (HRPES) spectra also show shift of 1s peak point of nitrogen and the carbon 1s peaks display traces of charge transfer from Fe to TCNQ as well as shake-up features, which suggest strong bonding and anti-bonding nature of coordination between Fe and TCNQ.

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LCD 구동 IC의 실장을 위한 초음파 ACF접합 기술 (Ultrasonic ACF Bonding Technique for Mounting LCD Driver ICs)

  • 정상원;윤원수;김경수
    • 제어로봇시스템학회논문지
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    • 제14권6호
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    • pp.543-547
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    • 2008
  • In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

Flexible DDI Package의 Bonding 기술 발전 (Advancements in Bonding Technologies for Flexible Display Driver IC(DDI) Packaging)

  • 김경태;정예환
    • 마이크로전자및패키징학회지
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    • 제31권3호
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    • pp.10-17
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    • 2024
  • 본 논문은 전자 기기의 소형화와 유연성을 실현하기 위한 플렉시블 패키징 핵심 기술 중 하나인 Chip On Film(COF) 기술에 대해 논의합니다. COF는 Display Driver IC(DDI)를 유연한 폴리이미드(Polyimide) 기판에 직접 부착하여, 고해상도 디스플레이의 경량화와 두께 감소를 가능하게 합니다. COF 기술은 주로 Organic Light Emitting Diode(OLED) 디스플레이와 같은 고성능 디스플레이 패널에서 사용되며, 스마트폰과 웨어러블 기기와 같은 휴대용 전자 장치에서 핵심적인 역할을 합니다. 본 연구에서는 COF의 주요 구성 요소 및 본딩 기술의 발전을 분석합니다. 특히, 열압착(Thermo-Compression Bonding), 초음파 본딩(Thermo-sonic Bonding)과 같은 최신 본딩 기법의 도입으로, 본딩 신뢰성 및 전기적 성능이 크게 향상되었습니다. 이러한 본딩 기술은 미세 피치 구조에서 높은 전기적 연결성을 유지하면서도, COF 패키지의 기계적 안정성을 강화합니다. 또한, COF 본딩 기술의 향후 발전 방향과 그에 따른 도전 과제를 논의하며, 차세대 디스플레이 및 Advanced 패키징 기술로서의 가능성을 조망합니다.

열원 형태에 의한 전자재료의 접합성에 관한 연구 I (A Study on Bondability of Electronic Materials by Different Heat Sources)

  • 신영의;양협;김경섭
    • Journal of Welding and Joining
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    • 제12권4호
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    • pp.110-116
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    • 1994
  • This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

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