• Journal of Astronomy and Space Sciences
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• 제18권3호
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• pp.191-208
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• 2001

We have recently compiled a database of the properties of 192 impact craters, which supercedes previous compilations. Using our database, the impact structures found in North America, Europe and Australia have been examined; these cratonic areas have been relatively stable for considerably long geological periods, and thus have been best preserved. It is confirmed that there is a close correlation between the geological epoch boundaries, the epochs of mass extinctions, antral the "timing" of impacts. In addition, the terrestrial cumulative flux of objects >20km is found to be $1.77{\times}10^{-15}km^{-2}yr^{-1}$, over the last 120 Myr, which is much smaller than the published values in McEwen et al. (1997) and Shoemaker (1998) ($5.6{\pm}2.8{\times}10^{-15}km^{-2}yr^{-1}$. For terrestrial impact structures with D> 50 km, the apparent cumulative flux over the last 2450 Myr is ~50 times smaller than the corresponding value for the Moon. If we assume that the Earth and the Moon suffered the same level of bombardment over this time, this would mean that the actual flux of impacting bodies, capable of making craters with D)50 km, was ~ 50 times larger than the apparent flux estimated from the currently known terrestrial records.

• 한국응용과학기술학회지
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• 제30권4호
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• pp.586-591
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• 2013

본 연구에서는 가속된 이온이 전기장이 걸려있는 freestanding 단결정 실리콘 나노 박막에 충돌했을 때 발생하는 열-전계 전자 방출 특성을 여러 전계 및 열적 조건 아래 체계적으로 분석하였다. 이온 충돌에 의한 열-전계 전자 방출은 쇼트키 효과 (schottky effect)의 선형영역의 특성에 의해 예측된 바와 같이 전계의 세기가 증가할수록 선형적으로 증가했으며, 이온 충돌에 의해 발생하는 열에너지의 제곱에 비례하는 특성을 보여주었다. 이러한 특성들은 실리콘 나노 박막의 질량 분석기용 이온 검출기로의 사용 가능성을 보여준다.

• 한국수산과학회지
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• 제46권6호
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• pp.901-906
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• 2013

We examined the availability of the lacZ gene (${\beta}$-galactosidase gene) as a reporter of foreign gene transfer in the cysts of Artemia franciscana (A. franciscana) to conduct a risk assessment of living genetically modified organisms (LMOs) in the marine ecosystem. The LacZ gene was transferred to decapsulated cysts by particle bombardment, and its insertion and expression were assessed by means of polymerase chain reaction (PCR) and X-gal staining. X-gal staining indicated lacZ expression in all A. franciscana examined (including the control group), which exhibited not only negative but also positive PCR amplification. Endogenous ${\beta}$-galactosidase is highly active in the whole body of A. franciscana during all stages of the life cycle. Thus, the lacZ gene is unsuitable as a reporter for foreign gene transfer in A. franciscana cysts, because it is difficult to discriminate between exogenous and endogenous ${\beta}$-galactosidase activity.

• 한국자기공명학회논문지
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• 제14권2호
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• pp.134-143
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• 2010

We studied the hydrogen-bonded $TlH_2PO_4$ (TDP) ferroelectrics treated with the proton-beam bombardment. The TDP material was irradiated with 1-MeV proton beam at a dose of $10^{15}/cm^2$. In order to analyze the hydrogen environment in TDP, we carried out the $^1H$ high resolution nuclear magnetic resonance (NMR) - i.e., Combined Rotation And Multiple Pulse Spectroscopy (CRAMPS) measurement. The isotropic chemical shift of hydrogen indicates its displacive property is related to the $PO_4$ lattice deformation which occurs throughout the antiferroelectric-, the ferroelastic- and the paraelastic-phase transitions. The temperature dependence of $\sigma_{iso}$ reveals the electronic charge redistribution is induced by the proton-beam irradiation and the elastic property.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.285-288
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• 1997

Generally the high dielectric films, such as PZT(Pb(Z $r^{1-x}$ $Ti_{x}$ ) $O_3$) and BST(B $a_{l-x}$S $r_{x}$ Ti $O_3$) have been formed on the Pt thin films. However it is generally known that the dry etching of Pt is difficult because of its chemical stability. So, the dry etching of Pt remains at the preliminary work. Therefore, in this study, Pt etching mechanism was investigated with Ar/C $l_2$gas plasma by using XPS(X-ray photoelectron spectroscopy) and QMS(Quadrupole mass spectrometry). Ion current density was measured with Ar/C $l_2$gas plasma by using single Langmuir probe. XPS results shoved that the atomic % of Cl element on the etched Pt sample increased with increasing Ar/(Ar+C $l_2$). And QMS results showed that the increase of Ar partial pressure in the plasma resulted in the improvement of C $l_2$dissociation and Cl redical formation and simultaniously the increase of ion bombardment effects.s.s.

• Transactions on Electrical and Electronic Materials
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• 제4권3호
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• pp.1-4
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• 2003

The etching of Au thin films has been performed in an inductively coupled $CF_4 / Cl_2 / Ar$ plasma. The etch properties including etch rate and selectivity were examined as $CF_4$ content adds from o to $30\%$ to $Cl_2/Ar$ plasma. The $Cl_2/(Cl_2 + Ar)$ gas mixing ratio was fixed at $20\%$. Other parameters were fixed at an rf power of 700 W, a dc bias voltage of -150 V, a chamber pressure of 15 mTorr, and a substrate temperature of $30^{\circ}C$. The highest etch rate of the Au thin film was 370 nm/min at a $10\%$ additive $CF_4$ into $Cl_2/Ar$ gas mixture. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. The XPS analysis shows that the intensities of Ail peaks are changed, indicating that there is a chemical reaction between Cl and Au. Au-Cl is hard to remove on the surface because of its high melting point. However, etching products can be sputtered by Ar ion bombardment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.279-282
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• 2001

The IBE(ion beam etching)-induced Schottky barrier variation which depends on various etching history related with ion energy, incident angle and etching time has been investigated using voltage-current, capacitance-voltage characteristics of metal-etched silicon contact and morphology of etched surface were studied using AFM(atomic force microscope). For ion beam etched n-type silicons, Schottky barrier is reduced according to ion beam energy. It can be seen that amount of donor-like positive charge created in the damaged layer is proportional to the ion energy. By contrary, for ion beam etched p-type silicons, the Schottky barrier and specific contact resistance are both increased. Not only etching time but also incident angle of ion beam has an effect on barrier height. Taping-mode AFM analysis shows increased roughness RMS(Root-Mean-Square) and depth distribution due to ion bombardment. Annealing in an N$_2$ ambient for 30 min was found to be effective in improving the diode characteristics of the etched samples and minimum annealing temperatures to recover IBE-induced barrier variation were related to ion beam energy.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.84-87
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• 2001

In this study, $CeO_2$ thin films were etched with a $CF_4/Ar$ gas combination in inductively coupled plasma (ICP), The maximum etch rate of $CeO_2$ thin films is $270{\AA}/min$under $CF_4/(CF_4+Ar)$ of 0.2, 600 W/-200 V, 15 mTorr, and $25^{\circ}C$. The selectivities of $CeO_2$ to PR and SBT are 0.21, 0.25. respectively. The surface reaction of the etched $CeO_2$ thin films was investigated with x-ray photoelectron spectroscopy (XPS). There is a chemical reaction between Ce and F, Compounds such as $Ce-F_x$ are remains on the surface of $CeO_2$ thin films. Those products can be removed by Ar ion bombardment effect, The results of secondary ion mass spectrometer (SIMS) were equal to these of XPS. Scanning electron microscopy (SEM) was used to examine etched profiles of $Ce-F_x$ thin films. The etch profile of over-etched $CeO_2$ films with the $0.5 {\mu}m$ line was approximately $65^{\circ}$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1994년도 제6회 학술발표회 논문개요집
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• pp.35-35
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• 1994

The surface segragation of NiZr, CuZr alloy has been studied wi th X-ray Imotoelectron spectroscopy(XPS), Auger electron spectroscopy(AES) and low energy ion scattering(LEIS). The composition of outmost atomic layer has been determinded by the use of LEIS at several incident energies using Ar+ ion. In the LEIS analysis, the effect of charge exchange has been estimated by a novel measurment of the charge exchange parameters while simul taneous determining the relative concentrations of Ni and Zr and the complementary information obtained will be described. The composition of the clean annealed surface, measured with AES only, will be contrasted wi th the surface concentration of the preferentially sputtered surface. The experimental results has been clearly demonstrated that when the NiZr ruld CuZr alloys are exposed to continuous Ar+ ion bombardment the outermost atomic layer is Zr rich due to preferential sputtering of Ni atoms. where Ni is preferentially sputtered, but the difference in sputtering yields is not sufficient to explain the observed composition. Therefore, it is necessary to consider other processes such as Radiation Induced Segregation(RIS). The surface composition of the heated sample surface predicts that Zr should surface segregate which futher supports the view that part of the Zr enrichment is due to RIS.to RIS.

• 한국세라믹학회지
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• 제31권2호
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• pp.206-212
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• 1994

Effects of the film deposition process parameters on the properties such as deposition rate, etch rate, refractive index, stress and step coverage of plasma enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate glass (TEOS) SiO2 film were investigated and analysed using SEM, FTIR and SIMS techniques. Increasing TEOS flow or decreasing O2 flow increased the deposition rate and the compressive stress of the oxide film but produced a less denser film. The deposition rate decreased owing to the decrease in the sticking coefficient of the TEOS and the O2 molecules onto the substrate Si with increasing the substrate temperature. Increasing the substrate temperature produced a denser film with a lower etch rate and the higher refractive index by lowering SiOH and moisture contents. Increasing the rf power increases the ion bombardment energy. This increase in energy, in turn, increases the deposition rate and tends to make the film denser. No appreciable changes were found in the deposition rate but the refractive index and the stress of the film decreased with increasing the deposition pressure. The carbon content in the plasma TEOS CVD oxide film prepared under our standard deposition conditions were very low according to the SIMS analysis results.