• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.33 no.2
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• pp.215-229
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• 2023

Objectives: To validate the effectiveness of a real-time chemical exposure monitoring system developed by KOSHA (Korea Occupational Safety and Health Agency), we applied the system to a workplace in the electronics industry for 153 days. Methods: The monitoring system consisted of a PID chemical sensor, a LTE communication equipment, and a web-based platform. To monitor chemical exposure, four sets of sensors were placed in two manufacturing tasks - inspection and jig cleaning - which used TCE as a degreasing agent. We reviewed previous reports of work environment measurements and conducted a new work environment measurement on one day during the period. The PID sensor systems detected the chemical exposure levels in the workplace every second and transmitted it to the platform. Daily average and maximum chemical exposure levels were also recorded. Results: We compared the results from the real-time monitoring system and the work environment measurement by traditional methods. Generally, the data from the real-time monitoring system showed a higher level because the sensors were closer to the chemical source. We found that 28% of jig cleaning task data exceeded the STEL. Peak exposure levels of sensor data were useful for understanding the characteristics of the task's chemical use. Limitations and implications were reviewed for the adoption of the system for preventing poisoning caused by chemical substances. Conclusions: We found that the real-time chemical exposure monitoring system was an efficient tool for preventing occupational diseases caused by chemical exposure, such as acute poisoning. Further research is needed to improve the reliability and applicability of the system. We also believe that forming a social consensus around the system is essential.

• Journal of Distribution Science
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• v.11 no.2
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• pp.45-55
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• 2013

Purpose - The development and implementation of OSS (Open Source Software) led to a dramatic change in corporate IT infrastructure, from system server to smart phone, because the performance, reliability, and security functions of OSS are comparable to those of commercial software. Today, OSS has become an indispensable tool to cope with the competitive business environment and the constantly-evolving IT environment. However, the use of OSS is insufficient in small and medium-sized companies and software houses. This study examines the need for OSS Intermediaries in the Software Distribution Channel. It is expected that the role of the OSS Intermediary will be reduced with the improvement of the distribution process. The purpose of this research is to prove that OSS Intermediaries increase the efficiency of the software distribution market. Research design, Data, and Methodology - This study presents the analysis of data gathered online to determine the extent of the impact of the intermediaries on the OSS market. Data was collected using an online survey, conducted by building a personal search robot (web crawler). The survey period lasted 9 days during which a total of 233,021 data points were gathered from sourceforge.net and Apple's App store, the two most popular software intermediaries in the world. The data collected was analyzed using Google's Motion Chart. Results - The study found that, beginning 2006, the production of OSS in the Sourceforge.net increased rapidly across the board, but in the second half of 2009, it dropped sharply. There are many events that can explain this causality; however, we found an appropriate event to explain the effect. It was seen that during the same period of time, the monthly production of OSS in the App store was increasing quickly. The App store showed a contrasting trend to software production. Our follow-up analysis suggests that appropriate intermediaries like App store can enlarge the OSS market. The increase was caused by the appearance of B2C software intermediaries like App store. The results imply that OSS intermediaries can accelerate OSS software distribution, while development of a better online market is critical for corporate users. Conclusion - In this study, we analyzed 233,021 data points on the online software marketplace at Sourceforge.net. It indicates that OSS Intermediaries are needed in the software distribution market for its vitality. It is also critical that OSS intermediaries should satisfy certain qualifications to play a key role as market makers. This study has several interesting implications. One implication of this research is that the OSS intermediary should make an effort to create a complementary relationship between OSS and Proprietary Software. The second implication is that the OSS intermediary must possess a business model that shares the benefits with all the participants (developer, intermediary, and users).The third implication is that the intermediary provides an OSS of high quality like proprietary software with a high level of complexity. Thus, it is worthwhile to examine this study, which proves that the open source software intermediaries are essential in the software distribution channel.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.550-557
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• 2021

With the advent of the fourth industrial revolution, the interest in the internet of things (IoT) in manufacturing is growing, even at foundries. There are several types of process data that can be automatically collected at a foundry, but considerable amounts of process data are still managed based on handwriting for reasons such as the limited functions of outdated production facilities and process design based on operator know-how. In particular, despite recognizing the importance of converting process data into big data, many companies have difficulty adopting these steps willingly due to the burden of system construction costs. In this study, the field applicability of IoT-based devices was examined by manufacturing devices and applying them directly to the site of a centrifugal foundry. For the centrifugal casting process, the temperature and humidity of the working site, the molten metal temperature, and mold rotation speed were selected as process parameters to be collected. The sensors were selected in consideration of the detailed product specifications and cost required for each process parameter, and the circuit was configured using a NodeMCU board capable of wireless communication for IoT-based devices. After designing the circuit, PCB boards were prepared for each parameter, and each device was installed on site considering the working environment. After the on-site installation process, it was confirmed that the level of satisfaction with the safety of the workers and the efficiency of process management increased. Also, it is expected that it will be possible to link process data and quality data in the future, if process parameters are continuously collected. The IoT-based device designed in this study has adequate reliability at a low cast, meaning that the application of this technique can be considered as a cornerstone of data collecting at foundries.

• Journal of Navigation and Port Research
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• v.46 no.6
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• pp.562-569
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• 2022

The alarm monitoring technology applied to existing operating ships manages data items such as temperature and pressure with AMS (Alarm Monitoring System) and provides an alarm to the crew should these sensing data exceed the normal level range. In addition, the maintenance of existing ships follows the Planned Maintenance System (PMS). whereby the sensing data measured from the equipment is monitored and if it surpasses the set range, maintenance is performed through an alarm, or the corresponding part is replaced in advance after being used for a certain period of time regardless of whether the target device has a malfunction or not. To secure the reliability and operational safety of ship engine operation, it is necessary to enable advanced diagnosis and prediction based on real-time condition monitoring data. To do so, comprehensive measurement of actual ship data, creation of a database, and implementation of a condition diagnosis monitoring system for condition-based predictive maintenance of auxiliary equipment and piping must take place. Furthermore, the system should enable management of auxiliary equipment and piping status information based on a responsive web, and be optimized for screen and resolution so that it can be accessed and used by various mobile devices such as smartphones as well as for viewing on a PC on board. This update cost is low, and the management method is easy. In this paper, we propose CBM (Condition Based Management) technology, for autonomous ships. This core technology is used to identify abnormal phenomena through state diagnosis and monitoring of pumps and purifiers among ship auxiliary equipment, and seawater and steam pipes among pipes. It is intended to provide performance diagnosis and failure prediction of ship auxiliary equipment and piping for convergence analysis, and to support preventive maintenance decision-making.