• Title/Summary/Keyword: Board Level Testing

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New IEEE 1149.1 Boundary Scan Architecture for Multi-drop Multi-board System (멀티 드롭 멀티 보드 시스템을 위한 새로운 IEEE 1149.1 경계 주사 구조)

  • Bae, Sang-Min;Song, Dong-Sup;Kang, Sung-Ho;Park, Young-Ho
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.49 no.11
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    • pp.637-642
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    • 2000
  • IEEE 1149.1 boundary scan architecture is used as a standard in board-level system testing. The simplicity of this architecture is an advantage in system testing, but at the same time, it it makes a limitation of applications. Because of several problems such as 3-state net conflicts, or ambiguity issues, interconnect testing for multi-drop multi-board systems is more difficult than that of single board systems. A new approach using IEEE 1149.1 boundary scan architecture for multi-drop multi-board systems is developed in this paper. Adding boundary scan cells on backplane bus lines, each board has a complete scan-chain for interconnect test. This new scan-path insertion method on backplane bus using limited 1149.1 test bus less area overhead and mord efficient than previous approaches.

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COMPONENT TEST STRATEGY FOR COMS ON-BOARD SOFTWARE USING ATTOL

  • Park, Su-Hyun;Kang, Soo-Yeon;Yang, Koon-Ho;Choi, Seong-Bong
    • Proceedings of the KSRS Conference
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    • 2007.10a
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    • pp.175-178
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    • 2007
  • COMS (Communication Ocean Meteorological Satellite) is the geostationary satellite being developed by Korea Aerospace Research Institute for multi-mission: experimental communication, ocean monitoring and meteorological observations. The COMS operation is controlled by the on-board software running on the spacecraft central computer. The software is written in ADA language and developed under the software life cycle: Requirement analysis, Design, Implementation, Component test and Integration test. Most functional requirements are tested at component level on a software component testing tool, ATTOL. ATTOL provides a simple way to define the test cases and automates the test program generation, test execution and test analysis. When two or more verified components are put together, the integration test starts to check the non-functional requirements: real-time aspect, performance, the HW/SW compatibility and etc. This paper introduces the COMS on-board software and explains what to test and how to test the on-board software at component level using ATTOL.

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COMPONENT TEST STRATEGY FOR COMS ON-BOARD SOFTWARE USING ATTOL

  • Park, Su-Hyun;Kang, Soo-Yeon;Yang, Koon-Ho;Choi, Seong-Bong
    • Proceedings of the KSRS Conference
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    • 2007.10a
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    • pp.460-463
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    • 2007
  • COMS (Communication Ocean Meteorological Satellite) is the geostationary satellite being developed by Korea Aerospace Research Institute for multi-mission: experimental communication, ocean monitoring and meteorological observations. The COMS operation is controlled by the on-board software running on the spacecraft central computer. The software is written in ADA language and developed under the software life cycle: Requirement analysis, Design, Implementation, Component test and Integration test. Most functional requirements are tested at component level on a software component testing tool, ATTOL. ATTOL provides a simple way to define the test cases and automates the test program generation, test execution and test analysis. When two or more verified components are put together, the integration test starts to check the non-functional requirements: real-time aspect, performance, the HW/SW compatibility and etc. This paper introduces the COMS on-board software and explains what to test and how to test the on-board software at component level using ATTOL.

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A Study on the/ Correlation Between Board Level Drop Test Experiment and Simulation

  • Kang, Tae-Min;Lee, Dae-Woong;Hwang, You-Kyung;Chung, Qwan-Ho;Yoo, Byun-Kwang
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.35-41
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    • 2011
  • Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

Board Governance and Bank's Performance: Does Size Matter?

  • ALAM, Atia;ABBAS, Syeda Fizza;HAFEEZ, Ameena
    • The Journal of Asian Finance, Economics and Business
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    • v.7 no.11
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    • pp.817-825
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    • 2020
  • Over the last few decades, corporate frauds have highlighted the significance of corporate governance in deriving firm performance. By using different sample data, extensive research has examined how corporate governance structure influences firm's profitability, but limited research was undertaken on the banking sector of Pakistan. This research adds to the literature by testing how board structure derives bank's performance by using sample data of 19 banks for the period from 2010 to 2017. In addition, the study analyzes the controlling part of size on the link between board governance and bank performance. Findings reveal that banks having small board size, fewer non-executive directors and minimum activity level perform better. Analysis related to bank size illustrates that board size has value in increasing benefits in large size banks in contrast to small size one, while higher participation by board members enhances performance of small size banks more. The correlation results and findings showed that there existed no multicollinearity issue between independent variables. Board size showed positive correlation with the market variable, while board activity tended to correlated negatively with the market performance. Inverse correlation between board size and independent directors indicated that Pakistani banks with greater board size had fewer independent directors.

The Relationship Between Corporate Governance and Underpricing: A Case Study in Ho Chi Minh Stock Exchange

  • TRAN, Khang Hoang;NGUYEN, Diep Thi Ngoc;KNAPKOVA, Adriana;ALIU, Florin
    • The Journal of Asian Finance, Economics and Business
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    • v.8 no.7
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    • pp.375-381
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    • 2021
  • Underpricing signifies that IPO share prices do not reflect the fundamental value of the listed company. Corporate governance plays an essential role in IPOs where the board of directors, the independent board of directors, and the board of supervisors are significant elements of accurate share pricing. The study investigates the underpricing phenomena and short-term performance of the IPO companies during the listing process in the Ho Chi Minh Stock Exchange (HOSE). The work outcomes illustrate the role of the corporate organizational structure in the period of the IPO process that may attract potential investors. The hypothesis testing is conducted with a multiple regression model including 100 observations from enterprises doing IPO listed on HOSE. The study results generate signals for the investors and regulators that the board of directors holds a strong negative influence on the underpricing process. Secondly, the level of the independent board of directors and stock exchange in itself has no significant impact on the underpricing process. Underpricing is one of the many anomalies of the stock exchanges that provide wrong signals for the market participants. Identifying stock prices that reflect their intrinsic value is an ongoing debate among scholars, investors, and other market participants.

Factors Affecting Voluntary Information Disclosure on Annual Reports: Listed Companies in Ho Chi Minh City Stock Exchange

  • NGUYEN, Thi Mai Huong;NGUYEN, Ngoc Tien;NGUYEN, Hong Thu
    • The Journal of Asian Finance, Economics and Business
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    • v.7 no.3
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    • pp.53-62
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    • 2020
  • The study aims to provide some plausible explanation for why Vietnamese listed companies only stop at the level of truthful presentation of information related to accounting data through the opinion of independent auditors. The information is only at the level of compliance with the requirements of Circular 155/2015/TT-BTC in form, but in essence is sketchy. What factors affect the level of voluntary disclosure of listed companies in Vietnam? In order to identify the factors affecting voluntary information disclosure on annual reports of listed companies, the study collected data on annual reports of 122 companies listed on the stock market in Ho Chi Minh City in the period 2015-2018 and uses regression analysis methods. The research presents 8 factors affecting the level of voluntary information disclosure including: Firm size, Listed time, Profitability, Solvency, Separation of board of directors and executive director, Board size, Organizational ownership and Foreign ownership. Next, the study conducted descriptive statistical analysis correlation coefficient analysis to examine the correlation and relevance of independent variables measured by the scale ratio, testing multiple linear regression model. The results of the study show that factors listed time, profitability and organizational ownership affecting voluntary information disclosure on annual reports of listed companies in Vietnam.

Autonomous evaluation of ambient vibration of underground spaces induced by adjacent subway trains using high-sensitivity wireless smart sensors

  • Sun, Ke;Zhang, Wei;Ding, Huaping;Kim, Robin E.;Spencer, Billie F. Jr.
    • Smart Structures and Systems
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    • v.19 no.1
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    • pp.1-10
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    • 2017
  • The operation of subway trains induces secondary structure-borne vibrations in the nearby underground spaces. The vibration, along with the associated noise, can cause annoyance and adverse physical, physiological, and psychological effects on humans in dense urban environments. Traditional tethered instruments restrict the rapid measurement and assessment on such vibration effect. This paper presents a novel approach for Wireless Smart Sensor (WSS)-based autonomous evaluation system for the subway train-induced vibrations. The system was implemented on a MEMSIC's Imote2 platform, using a SHM-H high-sensitivity accelerometer board stacked on top. A new embedded application VibrationLevelCalculation, which determines the International Organization for Standardization defined weighted acceleration level, was added into the Illinois Structural Health Monitoring Project Service Toolsuite. The system was verified in a large underground space, where a nearby subway station is a good source of ground excitation caused by the running subway trains. Using an on-board processor, each sensor calculated the distribution of vibration levels within the testing zone, and sent the distribution of vibration level by radio to display it on the central server. Also, the raw time-histories and frequency spectrum were retrieved from the WSS leaf nodes. Subsequently, spectral vibration levels in the one-third octave band, characterizing the vibrating influence of different frequency components on human bodies, was also calculated from each sensor node. Experimental validation demonstrates that the proposed system is efficient for autonomously evaluating the subway train-induced ambient vibration of underground spaces, and the system holds the potential of greatly reducing the laboring of dynamic field testing.

Development of Embedded Board for Construction of Smart Factory (스마트 팩토리 구축을 위한 임베디드 보드 개발)

  • Lee, Yong-Min;Lee, Won-Bog;Lee, Seung-Ho
    • Journal of IKEEE
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    • v.23 no.3
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    • pp.1092-1095
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    • 2019
  • In this paper, we propose the development of an embedded board for construction of smart factory. The proposed embedded board for construction of smart factory consists of main module, ADC module, I/O module. Main module is a main calculating device which includes communication pard that allows interface with external device with using industrial protocol and is ported operating system makes board operating into. ADC module takes part in transferring digital signal has converted from electrical signal to the main module from the external sensor which is installed on the field. I/O module is an input and output module which transfers to the main module about a status, alarm, command signal of field device and it has a function that blocks external noises from field device with isolation circuit into it. In order to evaluate the performance of the proposed embedded board for construction of smart factory, it has been tested by an authorized testing institute. As a result, quantity of interacting protocol was 5, speed of hardware clock synchronization was under 10us and operating time of battery without source power was over 8 hours. It produced the same result as the world's highest level.