• Proceedings of the KIEE Conference
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• 1998.11a
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• pp.156-158
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• 1998

This paper presents parallel operation of two 3-phase PWM converters whose Power and control schemes can be directly applied to a large capacity system. This paper describes power circuit, dc voltage regulation, input power factor correction and balancing load control of two converters. Switching device Is IGBT and CPU of control is 32-bit floating point DSP for real time instantaneous control. Simulations and experimental results for 20kw model conform the validity of proposed schemes.

• Journal of Sensor Science and Technology
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• v.30 no.4
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• pp.223-228
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• 2021

This work presents a low-power CMOS image sensor (CIS) with a multi-column-parallel (MCP) readout structure while focusing on improving its performance compared to previous works. A delta readout scheme that utilizes the image characteristics is optimized for the MCP readout structure. By simply alternating the MCP readout direction for each row selection, additional memory for the row-to-row delta readout is not required, resulting in a reduced area of occupation compared to the previous work. In addition, the bias current of a pre-amplifier in a successive approximate register (SAR) analog-to-digital converter (ADC) changes according to the operating period to improve the power efficiency. The prototype CIS chip was fabricated using a 0.18-㎛ CMOS process. A 160 × 120 pixel array with 4.4 ㎛ pitch was implemented with a 10-bit SAR ADC. The prototype CIS demonstrated a frame rate of 120 fps with a total power consumption of 1.92 mW.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.1
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• pp.22-28
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• 2015

This paper proposes column-parallel three step Single Slope Analog-to-Digital Converter (SS-ADC) for high frame rate VGA CMOS Image Sensors (CISs). The proposed three step SS-ADC improves the sampling rate while maintaining the architecture of the conventional SS-ADC for high frame rate CIS. The sampling rate of the three-step ADC is increased by a factor of 39 compared with the conventional SS-ADC. The proposed three-step SS-ADC has a 12-bit resolution and 200 kS/s at 25 MHz clock frequency. The VGA CIS using three step SS-ADC has the maximum frame rate of 200 frames/s. The total power consumption is 76 mW with 3.3 V supply voltage without ramp generator buffer. A prototype chip was fabricated in a $0.13{\mu}m$ CMOS process.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.2
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• pp.29-35
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• 1998

This paper describes architectures and design of a SIMD type parallel image processing chip called SliM-II. The chiphas a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives at least 1.92 GIPS. In contrast to existing array processors, such as IMAP, MGAP-2, VIP, etc., each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simulataneously in a single instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel move between the register file and on-chip memory as in DSP chips, SliM-II can greatly reduce the inter-PE communication overhead, due to the idea a sliding, which is a technique of overlapping inter-PE communication with computation. Moreover, the bandwidth of data I/O and inter-PE communication increases due to bit-parallel data paths. We used the COMPASS$^{TM}$ 3.3 V 0.6.$\mu$m standrd cell library (v8r4.10). The total number of transistors is about 1.5 muillions, the core size is 13.2 * 13.0 mm$^{2}$ and the package type is 208 pin PQ2 (Power Quad 2). The performance evaluation shows that, compared to a existing array processors, a proposed architeture gives a significant improvement for algorithms requiring multiplications.s.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.1
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• pp.110-119
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• 2017

This paper describes a CMOS image sensor (CIS) with dual correlated double sampling (CDS) and column-parallel analog-to-digital converter (ADC) and its measurement method using a field-programmable gate array (FPGA) integrated module. The CIS is composed of a $320{\times}240$ pixel array with $3.2{\mu}m{\times}3.2{\mu}m$ pixels and column-parallel 10-bit single-slope ADCs. It is fabricated in a $0.11-{\mu}m$ CIS process, and consumes 49.2 mW from 1.5 V and 3.3 V power supplies while operating at 6.25 MHz. The measured dynamic range is 53.72 dB, and the total and column fixed pattern noise in a dark condition are 0.10% and 0.029%. The maximum integral nonlinearity and the differential nonlinearity of the ADC are +1.15 / -1.74 LSB and +0.63 / -0.56 LSB, respectively.

• Journal of the Institute of Convergence Signal Processing
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• v.5 no.1
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• pp.40-45
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• 2004

This paper presents the parallel distributed control scheme for shaping of the bent glass. The designed system consists of a PC, a main controller and 11 servo-controllers, the precision motion controllers. Each elements are connected by using RS-232C and 8-bit data bus. In order to guarantee the stability and the control performance, we use a precision PID motion controller and a H-bridge on the servo-drivers. PC calculates position values of 11 DC motors by using the pre-determined curvature value and offers the user interface environment operator. The main controller provides the control instructions and parameter values to 11 servo-controllers by chip enable signal, simultaneously. Using the received commands and parameter values, the servo-controllers control the positions of the DC motors based on PID control scheme.

• ETRI Journal
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• v.30 no.4
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• pp.576-586
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• 2008

In most parallel loops of embedded applications, every iteration executes the exact same sequence of instructions while manipulating different data. This fact motivates a new compiler-hardware orchestrated execution framework in which all parallel threads share one fetch unit and one decode unit but have their own execution, memory, and write-back units. This resource sharing enables parallel threads to execute in lockstep with minimal hardware extension and compiler support. Our proposed architecture, called multithreaded lockstep execution processor (MLEP), is a compromise between the single-instruction multiple-data (SIMD) and symmetric multithreading/chip multiprocessor (SMT/CMP) solutions. The proposed approach is more favorable than a typical SIMD execution in terms of degree of parallelism, range of applicability, and code generation, and can save more power and chip area than the SMT/CMP approach without significant performance degradation. For the architecture verification, we extend a commercial 32-bit embedded core AE32000C and synthesize it on Xilinx FPGA. Compared to the original architecture, our approach is 13.5% faster with a 2-way MLEP and 33.7% faster with a 4-way MLEP in EEMBC benchmarks which are automatically parallelized by the Intel compiler.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.54 no.9
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• pp.531-538
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• 2005

This paper proposes an expert system which is able to enhance the accuracy and productivity by determining the test strategy based on heuristic rules for test of the hybrid electronic circuit board producted massively in production line. The test heuristic rules are obtained from test system designer, test experts and experimental results. The guarding method separating the tested device with circumference circuit of the device is adopted to enhance the accuracy of measurements in the test of analog devices. This guarding method can reduce the error occurring due to the voltage drop in both the signal input line and the measuring line by utilizing heuristic rules considering the device impedance and the parallel impedance. Also, PSA(Parallel Signature Analysis) technique Is applied for test of the digital devices and circuits. In the PSA technique, the real-time test of the high integrated device is possible by minimizing the test time forcing n bit output stream from the tested device to LFSR continuously. It is implemented in Visual C++ computer language for the purpose of the implementation of the inference engine using the dynamic memory allocation technique, the interface with the electronic circuit database and the hardware direct control. Finally, the effectiveness of the builded expert system is proved by simulating the several faults occurring in the mounting process the electronic devices to the surface of PCB for a typical hybrid electronic board and by identifying the results.

• ETRI Journal
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• v.35 no.1
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• pp.154-157
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• 2013

This letter proposes a memory-based parallel string matching engine using the compressed state transitions. In the finite-state machines of each string matcher, the pointers for representing the existence of state transitions are compressed. In addition, the bit fields for storing state transitions can be shared. Therefore, the total memory requirement can be minimized by reducing the memory size for storing state transitions.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1017-1020
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• 1998

We propose an algorithm which processes the floating-point $n_{addition}$traction and rounding in parallel. It also processes multiplication and rounding in the same way. The hardware model is presented that minimizes the delay time to get results for all the rounding modes defined in the IEEE Standards. An unified method to get the three bits(L, G, S)for the rounding is described. We also propose an unified guide line to determine the 1-bit shift for the post-normalization in the Floating-point $n_{addition}$traction and multiplication.