• Journal of Adhesion and Interface
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• v.22 no.1
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• pp.8-15
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• 2021

In this study, a polyol was prepared using Jeffamine D-400 as a propylene glycol-based diamine to impart flexibility to the urethane-modified epoxy, and a urethane-modified epoxy was synthesized using the polyol. Urethane-modified epoxy synthesized with existing Bisphenol A diglycidyl ether (BADGE) epoxy, a curing agent, and a curing accelerator are mixed to prepare an epoxy adhesive, and shear strength is measured by measuring adhesion strength. As a result, shear strength and shear elongation tended to increase. These results are due to the high crosslinking density. It is believed that it can be applied to structural adhesives that are restricted in use.

• Polymer(Korea)
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• v.24 no.4
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• pp.571-577
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• 2000

A new type of filler for epoxy-clay nanocomposites has been prepared by the reaction of octadecyltrimethylammonium bromide and layered sodium montmorillonite (MMT) via an ion-exchange reaction. The gallery space was further modified by grafting the aminopropyl groups via a reaction between a octadecyltrimethylammonium-MMT and 3-aminopropyltriethoxysilane (APS). The interlayer modification of MMT was confirmed by XRD, IR, and solid-state $^{29}$ Si CP/MAS NMR. Furthermore, clay-polymer nanocomposites have been synthesized by the polymerization of diglycidyl ether of bisphenol A(DGEBA) and $C_{18}$ H$_{37}$ N($CH_3$)$_3$-APS-MMT. The resulting hybrid nanocomposites were characterized by XRD, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The results proved that the organomontmorillonite could be exfoliated and uniformly dispersed in the epoxy matrix.

• Journal of the Korean Applied Science and Technology
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• v.33 no.4
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• pp.615-626
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• 2016

In the paper, mild solvent soluble alkyl group modified epoxy resins were prepared via a three-step method; (1) the condensation reaction of dodecyl phenol (DP) and formaldehyde, (2) the crosslinking reaction of dodecyl phnol novolac compound (DPC) and bisphenol A diglycidyl ether, (3) the dodecyl phenol novolac epoxy resins containing fatty acid (DPFA) was prepared by introducing fatty acid to DPC. Equivalent ratios of DP and formaldehyde were 1.25~1.333/1.0. Equivalent ratio of DPC and bisphenol A diglycidyl ether (YD-128) was 1.0/2.0. Reactivity, viscosity, molecular weight, solvent solubility, and physical properties of DPFA were investigated. The result show that as the number of aromatic ring of DPFA increased, viscosity increased and solvent solubility improved. When we test the properties of coatings by blending the synthesized DPFA with a white pigment, DPFAC-5 using triphenylphosphine (TPP) as a ring-open catalyst showed optical performance for drying time, adhesion, hardness, impact resistance, acid resistance and storage stability.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Polymer(Korea)
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• v.31 no.6
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• pp.526-531
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• 2007

This paper reports the first results of a series of planarization film study for the stainless steel (SS) substrates for flexible displays. Diglycidyl ether of bisphenol A (DGEBA) and octa(dimethylsiloxypropylglycidylether) silsesquioxane (OG) were chosen for the organic and the hybrid epoxies respectively and diaminodiphenylmethane (DDM) was used as a curing agent at 1:2 stoichiometric ratio. These materials were spin-coated on SS substrates and thermal-cured. TGA study indicated that both the pristine and the cured OG were more thermally stable than DGEBA. AFM study showed that the smooth surfaces of $1{\sim}2\;nm$ roughness can be prepared for both DGEBA and OG when the films were thick ($>\;1\;{\mu}$). The electrical properties such as dielectric constant, capacitance and the leakage current with respect to the applied voltage were all stable even after the stress of $100\;V/100^{\circ}C$ was applied for $0{\sim}10000$ seconds indicating that the insulating properties of DGEBA and OG films were very reliable.

• Applied Chemistry for Engineering
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• v.7 no.2
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• pp.387-392
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• 1996

Natural zeolite/epoxy resin composites were prepared and the cure kinetics was studied by dynamic DSC analysis. With the increments of natural zeolite content, the reaction starting temperature and the exothermic peak temperature were decreased. When diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/malononitrile(MN, 10phr) was filled with 20phr of zeolite, DSC thermogram had one peak and when it was filled with 30phr of zeolite, a shoulder appeared on the DSC thermogram. With the filling of 40phr of zeolite, DSC thermogram was separated into two peaks and the activation energy of the first peak, $Ea_1$ was 12.30 kJ/mol and that of the second peak, $Ea_2$ was 12.70 kJ/mol.

• Polymer(Korea)
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• v.25 no.5
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• pp.691-698
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• 2001

Nanocomposites based on epoxy acid nanoclay were prepared employing organically modified mica type silicate (OMTS), diglycidyl ether of bisphenol A (DGEBA) type epoxy. curing agent (dicyandiamide; DICY), and catalyst (benzyl dimethyl amine; BDMA). Both melt mixing and solution mixing were und for the sample preparation and structural developments with curing reaction were analyzed using X-ray diffractometer (XRD) and small angle X-ray scattering (SAXS). Because of the different curing rate between extra-gallery and intra-gallery reactions of epoxy mixtures, only intercalated structure was observed for the sample prepared by melt mixing while fully exfoliated structure was observed for the sample prepared by solution mixing. Mechanical properties of exfoliated epoxy nanocomposite were investigated using a dynamic mechanical analyzer (DMA). The dynamic storage modulus of the nanocomposite in both glass and rubbery plateau regions were increased with increasing OMTS contents, but glass transition temperatures ($T_g$) remained unchanged. Thermal properties of epoxy nanocomposite were investigated using thermogravimetric (TGA) and limit oxygen index (LOI) methods. Thermal decomposition onset points and LOI values were increased with increasing OMTS contents due to barrier effects of OMTS sheets.

• Applied Chemistry for Engineering
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• v.5 no.3
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• pp.517-523
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• 1994

The effects of cure kinetics and mechanism of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline) with SN(succinonitrile) and HQ(hydroquinone) as an additive and accelerator were investigated. Cure kinetics was evaluated by Kissinger equation and fractional-life method through DSC analysis. The activation energy has hydroxyl group as an accelerator, the activation energy and the starting cure-temperature were lower than those of DGEBA/MDA/SN system. Cure mechanism of those systems was investigated through FT-IR according to the various SN contents. The ratio was SN : HQ = 4 : 1. It has been known that the cure reactions of an epoxy-diamine system are composed of primary amine-epoxy reaction, secondary amino-epoxy reaction and epoxy-hydroxyl group reaction. But in DGEBA/MDA/SN system, primary amino-CN group reaction and CN group-hydroxyl group reaction were added to the above mentioned reactions. These reactions attributed to the long main chain and the low crossliking density. And in DGEBA/MDA/SN/HQ system, hydroxyl group of HQ formed a transition state with epoxide group and amime group and also opened the ring of the epoxide group rapidly, then amino-epoxy reaction took place easily.

• Polymer(Korea)
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• v.38 no.6
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• pp.787-790
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• 2014

In this work, the epoxy specimens were prepared from diglycidyl ether of bisphenol F (DGEBF) with silane coupling agents (3-glycidoxypropyl trimethoxysilane (GPTMS)) in different ratios. Thermal stability was studied in terms of polymer decomposition temperature (PDT), temperature of maximum rate of weight loss ($T_{max}$), integral procedural decomposition temperature (IPDT), and decomposition activation energy ($E_a$) using TGA analysis. Adhesion properties of epoxy composite specimens were measured by UTM (universal testing machine) at atmosphere temperature. In this result, the adhesion properties of DGEBF were improved by addition of silane coupling agents compared to non-treated epoxy resin. However, when the content of GPTMS agent is more than 10 phr, adhesion properties decreased with increasing GPTMS agent.

• Polymer(Korea)
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• v.29 no.3
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• pp.231-236
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• 2005

Amino terminated polyetherimide (AP-PEI) has been synthesized using 2,2'-bis [4-(3,4-dicarboxyphenoxy)-phenyl]propane dianhydride (BPADA) and m-phenylenediamine. Polyetherimide containing pendant carboxy group (CP-PEI) has also been synthesized by the reaction of BPADA, m-phenylenediamine and 3,5-diaminobenzoic acid. The modified PEIs were used as toughening agent for diglycidyl ether of bisphenol-A epoxy resin which was cured with nadic methyl anhydride (NMA). Thermal properties, fracture toughness ($K_{IC}$) and solvent resistance of toughened epoxy resin were measured. The $K_{IC}$ of epoxy resin containing 20 phr of AT-PEI was 2.88$MPa{\cdot}m^{0.5}$ without sacrificing thermal properties. The $K_{IC}$ of epoxy resin which contained 20 phr of CP-PEI was 2.82$MPa{\cdot}m^{0.5}$.