• Title/Summary/Keyword: Binder burnout

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Effects of Binder Burnout Temperatures on Sintering Shrinkage of Multilayer Ceramics (다층 세라믹스의 소결 수축율에 대한 Binder Burnout 온도의 영향)

  • 성재석;구기덕;윤종광
    • Journal of the Korean Ceramic Society
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    • v.33 no.12
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    • pp.1373-1379
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    • 1996
  • Change of sintering shrinkage in alumina-based multilayer ceramics was observed in various lamination condi-tions and binder burnout (BBO) temperatures. It was found that the linear shrinkages in X and Y directions were nearly the same with the BBO temperatures but a large shrinkage difference in Z direction was observed. However this phenomenon was diminished when BBO temperature was increased. A linear relationship between the laminated density and the sintering shrinkage was found and the slope was independant on the BBO temperature but dependant on the shrinkage direction.

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The Effect of Binder Burnout Time and Heating Rate on the Electrical Properties of Multilayer Ceramic Capacitors (소결과정에 있어서 Bindex Burnout 온도 및 소결온도까지의 가열속도가 MLC의 전기적 특성에 미치는 영향)

  • 김호기;오창섭;김용혁
    • Journal of the Korean Ceramic Society
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    • v.24 no.3
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    • pp.207-214
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    • 1987
  • This paper is to determine the effect of binder burnout time and heating rate on the electrical propertries of type II multilayer ceramic capacitors(MLC). The quality of multilayer ceramic capacitor depends suitable on the binder burnout time, which is determined for at least 24 hours in the PVB-binder system. It is suggested that theelectrical properties of multilayer ceramic capacitor is due to the control of heating rate, with the dipole moment density from grain size distributiion. Comparing the fast firing with slow, we observed a small but consistent improvement in the electrical properties.

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Optimization of Binder Burnout for Reaction Bonded Si3N4 Substrate Fabrication by Tape Casting Method

  • Park, Ji Sook;Lee, Hwa Jun;Ryu, Sung Soo;Lee, Sung Min;Hwang, Hae Jin;Han, Yoon Soo
    • Journal of the Korean Ceramic Society
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    • v.52 no.6
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    • pp.435-440
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    • 2015
  • It is a challenge from an industrial point of view to fabricate silicon nitride substrates with high thermal conductivity and good mechanical properties for power devices from high-purity Si scrap powder by means of thick film processes such as tape casting. We characterize the residual carbon and oxygen content after the binder burnout followed by nitridation as a function of the temperature in the temperature range of $300^{\circ}C-700^{\circ}C$ and the atmosphere in a green tape sample which consists of high-purity Si powder and polymer binders such as polyvinyl butyral and dioctyl phthalate. The optimum condition of binder burnout is suggested in terms of the binder removal temperature and atmosphere. If considering nitridation, the burnout of the organic binder in air compared to that in a nitrogen atmosphere could offer an advantage when fabricating reaction-bonded $Si_3N_4$ substrates for power devices to enable low carbon and oxygen contents in green tape samples.

Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies : I, Effects of Binder Burnout Process on the Formation of Electrode Line (고주파용 저온 동시소성 세라믹(LTCC)칩 커플러 제조: I. 전극형성에 대한 결합제 분해공정의 영향)

  • 조남태;심광보;이선우;구기덕
    • Journal of the Korean Ceramic Society
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    • v.36 no.6
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    • pp.583-589
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    • 1999
  • In the fabrication of ceramic chip couples for high frequency application such as the mobile communication equipment the formation of electrode lines and Ag diffusion were investigated with heat treatment conditions for removing organic binders. The deformation and densification of the electrode line greatly depended on the binder burnout process due to the overlapped temperature zone near 400$^{\circ}C$ of the binder dissociation and the solid phase sintering of the silver electrode. Ag ions were diffused into the glass ceramic substrate. The Ag diffusion was led by the glassy phase containing Pb ions rather than by the crystalline phase containing Ca ions. The fact suggests that the Ag diffusion could be controlled by managing the composition of the glass ceramic substrate.

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The Influence of CuO on Bonding Behaviors of Low-Firing-Substrate and Cu Conductor (저온소성 기판과 Cu와의 동시소성에 미치는 CuO의 첨가효과)

  • 박정현;이상진
    • Journal of the Korean Ceramic Society
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    • v.31 no.4
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    • pp.381-388
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    • 1994
  • A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

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Microstructures and Drying of the Alumina Green Body by the Gel-Casting Method (Gel-Casting으로 제조한 알루미나 성형체의 건조와 미세구조)

  • 오창준;이홍림
    • Journal of the Korean Ceramic Society
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    • v.31 no.12
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    • pp.1467-1474
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    • 1994
  • The effects of the dispersion, drying, and binder burning-out on the green-microstructures of gelcasted alumina were studied. The slip consisting of 55 vol% alumina powder and 5 wt% organic materials was well-dispersed by adding 0.28 wt% polyelectrolyte polymer. Green bodies were dried at >85% relative humidity at room temperature. Green-microstructures were observed to be depended on the heating rate during binder burnout. Constant drying rate was not observed in drying process of gelcasted alumina. Sintered body showed its relative density higher than 99% when it was sintered at 1$600^{\circ}C$ for 2 hours.

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Fabrication and Characterization of Thermal Battery using Porous MgO Separator Infiltrated with Li based Molten Salts

  • Kim, Kyungho;Lee, Sungmin;Im, Chae-Nam;Kang, Seung-Ho;Cheong, Hae-Won;Han, Yoonsoo
    • Journal of Powder Materials
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    • v.24 no.5
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    • pp.364-369
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    • 2017
  • Ceramic powder, such as MgO, is added as a binder to prepare the green compacts of molten salts of an electrolyte for a thermal battery. Despite the addition of a binder, when the thickness of the electrolyte decreases to improve the battery performance, the problem with the unintentional short circuit between the anode and cathode still remains. To improve the current powder molding method, a new type of electrolyte separator with porous MgO preforms is prepared and characteristics of the thermal battery are evaluated. A Spherical PMMA polymer powder is added as a pore-forming agent in the MgO powder, and an organic binder is used to prepare slurry appropriate for tape casting. A porous MgO preform with $300{\mu}m$ thickness is prepared through a binder burnout and sintering process. The particle size of the starting MgO powder has an effect, not on the porosity of the porous MgO preform, but on the battery characteristics. The porosity of the porous MgO preforms is controlled from 60 to 75% using a pore-forming agent. The batteries prepared using various porosities of preforms show a performance equal to or higher than that of the pellet-shaped battery prepared by the conventional powder molding method.

Fabrication of a Complex-Shaped Silicon Nitride Part with Aligned Whisker Seeds Using LOM Technique

  • Park, Dong-Soo;Cho, Byung-Wook
    • Journal of the Korean Ceramic Society
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    • v.40 no.10
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    • pp.931-935
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    • 2003
  • A complex-shaped part was successfully fabricated by Laminate Object Manufacturing (LOM) technique using silicon nitride tape with aligned silicon nitride whisker seeds. The ceramic tape was cut using a commercial cutting plotter according to the cross section drafts generated by slicing a 3-D model, and then the tapes were stacked sequentially. In order to improve adhesion between the tapes, stacking was performed under vacuum. After binder burnout, the part was encapsulated using latex emulsion and was cold isostaically pressed under 250 ㎫. It was sintered to 98.5% TD at 2148 K for 4 h under 2 ㎫ nitrogen pressure.