• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.39-43
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• 2002

48 $\mu$BGA 패키지에 Sn-37Pb 공정 솔더와 Sn-0.7Cu, Sn-3.5 Ag, Sn-2.0Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi 4종류의 무연 솔더를 적용하여, 미세 솔더 볼의 경도와 조성에 따른 솔더 접합부의 전단강도에 대해서 연구하였다. 실험 결과, 솔더 볼의 짖눌림은 Sn-2.0Ag-0.7Cu-3.0Bi에서 0.043mm로 큰 경도값을 얻었다. 또한 전단 강도 값은 무연 솔더가 Sn-37Pb 솔더보다 높았으며, Sn-2.0Ag-0.7Cu-3.0 Bi에서 최대 52% 높은 값을 나타내었다.

• 한국분말재료학회지
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• 제29권1호
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• pp.41-46
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• 2022

In this study, we report the microstructure and characteristics of Ag-SnO₂-Bi₂O₃ contact materials using a controlled milling process with a subsequent compaction process. Using magnetic pulsed compaction (MPC), the milled Ag-SnO₂-Bi₂O₃ powders have been consolidated into bulk samples. The effects of the compaction conditions on the microstructure and characteristics have been investigated in detail. The nanoscale SnO₂ phase and microscale Bi2O3 phase are well-distributed homogeneously in the Ag matrix after the consolidation process. The successful consolidation of Ag-SnO₂-Bi₂O₃ contact materials was achieved by an MPC process with subsequent atmospheric sintering, after which the hardness and electrical conductivity of the Ag-SnO₂-Bi₂O₃ contact materials were found to be 62-75 HV and 52-63% IACS, respectively, which is related to the interfacial stability between the Ag matrix, the SnO₂ phase, and the Bi₂O₃ phase.

• Journal of Ceramic Processing Research
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• 제19권5호
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• pp.388-393
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• 2018

Sublimation of $Bi_2O_3$-based materials is an important degradation issue for the long-term applications of many electronic devices. A series of $SnO_2$-doped $Bi_2O_3$ materials (SBO), was synthesized, densified, and then tested in air or strong reducing atmosphere. The $SnO_2$-doping effects and sublimation kinetics of the SBO materials were studied by X-ray diffraction (XRD), scanning electron microscope (SEM) and precise mass loss measurement. The results show that formation of $Bi_2Sn_2O_7$ phase greatly retards the mass loss of SBO. The SBO samples show a surface sublimation in an energy of $52.6kJ{\cdot}mol^{-1}$. However, the sublimation is also controlled by surface microstructure as the amount of vaporizing species (the Bi or gaseous Bi-oxides) is more than 0.1 mass%. The evaporation is retarded on the rough surface and the mechanism of surface evaporation is changed to diffusional control.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.47-52
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• 2005

전세계 전자패키지 산업에서 납(Pb) 사용에 대한 환경규제 움직임이 본격화되고 있어 새로운 무연솔더의 개발이 활발히 이루어지고 있다. 게다가 무연솔더의 신뢰성에 대한정보가 아직까지 많이 부족한 실정이다 무연솔더의 신뢰성에 영향을 줄수 있는 것 중의 하나가 Sn pest라고 알려진 동소체 변태이다. Sn pest가 형성될 때 동반되는 부피의 증가는 솔더 조인트의 신뢰성을 저하시킨다. 이미 보고된 바에 따르면, Sn 고용도가 있는 원소(Pb, Bi, Sb)들을 첨가시킬 경우 Sn pest가 효과적으로 억제된다. 그러나 Sn pest를 억제하는 합금에 대한 기계적인 특성에 연구가 거의 이루어지지 않았다. 본 연구에서는 Sn과 Sn-0.7Cu를 기반으로 하여 Bi, Sb을 첨가한 솔더 합금을 사용하여 lap shear크리프 실험을 하였다. 본 연구에서 사용한 합금들의 변형율은 전체적으로 Sn-3.5Ag를 기반으로 하는 합금들보다 높았다. 파괴까지 이르는 변형량은 Sn-0.5Bi가 가장 크고 Sn-0.7Cu-0.5Sb 합금이 가장 작았는데 이러한 경향은 Sn-0.5Bi 합금의 파단면에 Sn globules이 길게 늘어나 있고 Sn-0.7Cu-0.5Sb 합금에서는 더 짧은 Sn globules 이 관찰되는 결과와 일치하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1989년도 춘계학술대회 논문집
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• pp.52-55
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• 1989

The properties of sintered Ag-SnO$_2$contacts which contain the second oxide were investigated with hardeness, workability, electrical conductivity and are erosion. Ag-SnO$_2$contacts containing ZnO or Bi$_2$O$_3$have most excellent workability and arc erosion endurance.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.28-31
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• 2001

Recently, in order to satisfy the consumer's demand the life cycle and the lead-time of a product is to be shortened. It is thus important to reduce the time and cost in manufacturing trial products. Several techniques have been developed and successfully commercialized in the market RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome this problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP process. HisRP is a combination process using high-speed machining technology with automatic filling. In filling process, Bi58-Sn alloy is chosen because of the properties of los-melting point, low coefficient of thermal expansion and enviromental friendship. Also the use of filling wire is of advantage in term of simple and flexible mechanism. Then the rapid manufacturing product, for example a skull, is machined for aluminum material by HisRP process with an automatic set-up device of 4-faces machining.

• 한국정밀공학회지
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• 제19권3호
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• pp.88-94
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• 2002

Recently, the life cycle and the lead-time of a product are to be shortened in order to satisfy consumer's demand. It is thus important to reduce the time and cost in manufacturing trial products. Several technique have been developed and successfully commercialized in the market of RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome these problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP(High-Speed RP) process. HisRP is a new RP process that is combined high-speed machining with automatic filling. In filling process, Bi58-Sn alloy is chosen as filling material because of the properties of low-melting point, low coefficient of thermal expansion and no harm to environment. Also the use of filling wire it if advantage since it needs simple and flexible mechanism. Then the rapid product, for example a skull, is manufactured for aluminum material by HisRP process with an automatic set-up device thor 4-faces machining.

• 한국표면공학회지
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• 제52권6호
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• pp.334-341
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• 2019

Organometal halide perovskite materials have attracted much attention in the photovoltaic and light emitting devices due to the compositional flexibility with AMX₃ formula (A is an organic amine cation; M is a metal ion; X is a halogen atom). The addition of homovalent or heterovalent metal cations to the bulk organohalide perovskites has been performed to modify their energy band structure and the relevant optoelectronic properties by ligand-assisted ball milling. Here, we report CH₃NH₃Pb_1-xM_xBr₃ nanocrystals substituted by metallic cations (M is Sn²⁺, In³⁺, Bi³⁺; x = 0, 0.01, 0.02, 0.05, 0.1, 0.2). Photoluminescence and quantum yield was significantly reduced with increasing metallic cations content. These quenching effect could be resulted from the metal cations that behave as a non-radiative recombination center.

• 한국초전도ㆍ저온공학회논문지
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• 제14권3호
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• pp.1-4
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• 2012

Effects of artificial holes on the cooling efficiency of single grain YBCO bulk superconductors were studied. Single grain YBCO bulk superconductors without artificial holes, with six 2.4 mm holes and six holes filled with Bi-Pb-Cd-Sn metal solder were fabricated by a top-seeded melt growth process for powder compacts with/without holes. Simulation for the cooling rate to a liquid nitrogen temperature (77 K) of YBCO samples was carried out using a finite element method (FEM) and the results are compared with the actual cooling rates of samples in liquid nitrogen. The simulated cooling times for the YBCO sample without holes, with six holes and with six holes filled with the metal solder were 80, 47 and 75 sec. respectively, which are similar to the actual cooling times of 84, 52 and 78 sec. estimated for the same samples cooled in liquid nitrogen. The shorter cooling time of the sample with artificial holes are attributed to the increased surface areas associated with the presence of artificial holes. The metal filling into the holes did not give any remarkable effect on the cooling efficiency.