• 센서학회지
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• 제5권6호
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• pp.51-59
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• 1996

실리콘기판과의 스트레스균형이 이루어진 150 nm-$Si_{3}N_{4}$/300 nm-$SiO_{2}$/150 nm-$Si_{3}N_{4}$ 다이아프레임위에 백금 박막히터 및 Bi-Sb 열전대배열을 형성하여 히터에서 실리콘기판으로 전달되는 열량의 차단효과가 현저히 개선된 유체센서를 제작하였다. 백금 박막히터는 유전체 다이아프레임의 열차단 효과때문에 비선형 전류-전압 특성을 나타내었고, 이 히터의 저항온도계수는 약 $0.00378\;/^{\circ}C$였으며, 또한 Bi-Sb 열전대의 Seebeck계수는 약 $97\;{\mu}V/K$였다. 기체의 열전도도가 증가할수록 유체센서가 나타내는 열기전력은 감소하였으며, 히터온도가 증가하거나 히터와 열전대사이의 거리가 감소할수록 센서의 감도는 증가하였다. 히터전압을 약 2.5V로 하였을 때 유체센서의 $N_{2}$유량에 대한 감도는 약 $1.27\;mV{\cdot}(sccm)^{-1/2}$였고, 열응답시간은 약 0.13 초였다.

• Tribology and Lubricants
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• 제35권6호
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• pp.350-355
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• 2019

Surface energy is an important factor in determining the performance of application components in terms of preventing adhesion failure between thin films. In this regard, numerous attempts have been made to acquire the desired surface energy through chemical treatment or by using micro/nanostructures. However, such approaches are expected to provide extreme values of surface energy, which may not be suitable in achieving the enhanced performance of applications. In this study, we propose a method to control surface energy by using bilayer metallic film heterostructures. We measure the water contact angle of incompatible (Ni/Ag) and compatible (Zn/Ag) metal pairs under several experimental factors, including thickness, time, and temperature. Furthermore, we conduct Auger electron spectroscopy measurements to investigate the atomic concentration with respect to depth after the change in the water contact angle. The experimental results reveal that three parameters, namely, compatibility, film thickness, and environmental temperature, are major factors in controlling the water contact angle. Thus, we experimentally demonstrate that controlling these three parameters can provide the approximate desired water contact angle. This result is expected to aid in the performance enhancement of a wide range of application components, where control of surface energy is required.

• Tribology and Lubricants
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• 제33권3호
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• pp.119-125
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• 2017

In this study, we perform a numerical analysis to predict the film thickness and lubrication regions for a thrust ball bearing under different operating conditions. Film thinning and replenishment affect the film thickness in starved lubrication. As the inlet meniscus position is brought to the edge of the Hertz contact, the thin film thickness is calculated as starved equation. We use a film replenishment model to determine the recovery film thickness between rolling elements. We use a hydrodynamic model to describe film recovery, that results from the effects of surface tension. In this model, we consider the surface tension gradient in fluid depression as the driving force for fluid recovery. We use Fourier transform method to determine the time-dependent depth of depressed oil. We calculate the change in the central film thickness graphically by using the recovery equation in starved elastohydrodynamic lubrication(EHL) under operating conditions that include numbers of balls, sliding velocity, applied force, and ambient film thickness. We evaluate the degree of starvation by using the distance from the center of the contact area to the meniscus position. Parched lubrication, a phenomenon where the film thickness decreases consistently, occurs at the severe condition. We determine optimal values with respect to the numbers of balls, and sliding velocity. The investigation can contribute to the design operating conditions for proper lubrication.

• 열처리공학회지
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• 제28권6호
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• pp.310-314
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• 2015

We have considered the influence of electron irradiation on the optical and electrical properties of $In_2O_3/Ti$ bi-layered films prepared with RF and DC magnetron sputtering. The $In_2O_3/Ti$ thin films irradiated at 600 eV shows the lowest resistivity of $6.9{\times}10^{-4}{\Omega}cm$. The optical transmittance in a visible wave length region also influenced with the electron irradiation energy. The film that electron irradiated at 600 eV shows 82.9% of optical transmittance in this study. By comparison of figure of merit, it is concluded that the opto-electrical performance of $In_2O_3/Ti$ bi-layered film is improved with electron irradiation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.529-532
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• 2003

Quench behavior of resistive superconducting fault current limiters (SFCLs) with various pattern shapes was investigated. The pattern shapes employed were meander, bi-spiral, and spiral shapes of identical line width, gap and margin. SFCLs were fabricated from YBCO thin films grown on two-inch diameter $Al_2O_3$ substrates under the same conditions. Resistance rise of current limiting elements was low at a spiral shape before the whole quench completion, which may act as a disadvantage for simultaneous quench in serial connection between current limiting elements, but the temperature tended to have similar values at higher voltages. On the other hand, bi-spiral shape was severe at insulation level between current limiting lines. When these aspects were considered, we concluded that a meander shape was appropriate to design for a resistive SFCL based on thin films except the concentration of electric field at edge areas of strip lines.

• 한국결정성장학회지
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• 제13권2호
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• pp.56-62
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• 2003

졸-겔법을 이용하고 금속 나프테네이트를 출발원료로 사용하여 $SrTiO_3$(100), $LaA1O_3$(100) 및 MgO(100) 기판 위에 에피탁샬 $Bi_4Ti_3O_{12}$ 박막을 제조하였다. 코팅된 전구막은 $500^{\circ}C$에서 10분간 전열처리 하였고, $750^{\circ}C$에서 30분간 최종 열처리를 행하였다. 박막의 결정화도는 X-선회절 분석법 ($\theta$-2$\theta$ 스캔과 $\beta$ 스캔)으로 조사하였고, 표면 미세구조와 거칠기를 field emission-scanning electron microscope와 atomic force microscope를 이용하여 각각 분석하였다. MgO(100) 기판 위에 제조한 박막은 모든 기판 중에서 가장 낮은 결정화도와 면내 배향성을 보였다. 가장 낮은 결정화도와 배향성을 보인 MgO(100) 기판위의 박막은 침상 형태로 성장한 반면, 결정성과 배향성이 좋은 $LaA1O_3$(100)과 $SrTiO_3$(100) 기판위의 박막들은 원형의 입자 성장 형태를 보이고 있었다.

• 한국전기전자재료학회논문지
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• 제15권7호
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• pp.570-575
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• 2002

$SrBi_2Ta_2O_9$ thin films were etched in $Cl_2/CF_4/Ar$ inductively coupled plasma (ICP). The maximum etch rate was 1300 ${\AA}/min$ at 900 W ICP power in Cl$_2$(20%)/$CF_4$(20%)/Ar(60%). As RF source power increased, radicals (F, Cl) and ion ($Ar^+$) increased. The influence of plasma induced damage during etching process was investigated in terms of P-E hysteresis loops, chemical states on the surface, surface morphology and phase of X-ray diffraction. The chemical states on the etched surface were investigated with X-ray spectroscopy and secondary ion mass spectrometry. After annealing $700^{\circ}C$ for 1 h in $O_2$ atmosphere, the decreased P-E hysteresises of the etched SBT thin films in Ar and $Cl_2/CF_4/Ar$ plasma were recovered.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.204-204
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• 2010

본 연구에서는 Glass 기판 위에 우수한 광 투과도를 갖는 ZnO 기반의 Thin Film Transistor (TFT)를 제작하였으며, 이에 대한 전기적 및 광학적 특성을 분석하였다. 소자 구조의 제작은 Maskless Aligner를 이용한 Optical lithograph법을 이용하였다. 채널층은 ZnO로 하였고 Source/Drain 영역은 GaZnO로 하여 전체구조가 ZnO 기반의 homogeneity를 유지하게 하였다. 이때 Gate 절연막은 Bi1.5Zn1Nb1.5O7와 SiO2 두가지 종류로 하여 각각의 특성을 비교하였다. 본연구에서 TFT구조의 각 층은 모두 r. f. 마그네트론 스퍼터법으로 증착하였다. 제작된 TFT들은 채널층 및 절연막 형성 등에 관여된 세부적 실험변수의 변화에 관계없이 약 75% 이상의 우수한 광투과도 특성을 보였다. 전기적 특성 평가에서, 제작된 TFT들은 전반적으로 비교적 낮은 문턱전압과 높은 이동도를 보였다. 하지만, 트랜지스터의 전기적 전송 특성의 주요 인자들인 채널-이동도, 스위칭, 누설 및 이력 등은 ZnO 채널층 혹은 Bi1.5Zn1Nb1.5O7 절연막 형성 시 주입되는 O2 가스의 분압에 의존하는 것이 관측되었다. 이를 통하여 트랜지스터의 각 세부 영역의 구조 및 형성 조건이 트랜지스터의 전기적 특성에 미치는 영향과 상관관계에 대하여 논의한다.

• 한국자기학회지
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• 제8권2호
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• pp.74-78
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• 1998

LPE법으로 양질의 단결정 Bi, Gd:YIG 막을 GCMZGG 기판상에 성장시켜 자기, 광자기 및 센서특성을 조사했다. 제조한 막은 히스테리시스가 거의 없는 직선성이 양호한 연자성 특성을 나타냈고, 상온에서의 포화 Faraday 회전각은 45$^{\circ}$, 포화자장은 약 1.1kOe, 베르데 상수는 5.6$^{\circ}$/(cm,Oe0이었으며, 베르데상수의 온도의존성은 $0^{\circ}C$-10$0^{\circ}C$에서 약0.0056$^{\circ}$/(Oe, cm, $^{\circ}C$)로 우수한 특성을 나타냈다. 또한, 제조한 막을 사용하여 센서특성을 특정한 결과 전류의 세기가 3A-300A에서 양호한 적선성이 얻었졌다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.236-236
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• 2008

(Bi,La)$Ti_3O_{12}$(BLT) thin film is one of the most attractive materials for ferroelectric random access memory (FRAM) applications due to its some excellent properties such as high fatigue endurance, low processing temperature, and large remanent polarization [1-2]. The authors firstly investigated and reported the damascene process of chemical mechanical polishing (CMP) for BLT thin film capacitor on behalf of plasma etching process for fabrication of FRAM [3]. CMP process could prepare the BLT capacitors with the superior process efficiency to the plasma etching process without the well-known problems such as plasma damages and sloped sidewall, which was enough to apply to the fabrication of FRAM [2]. BLT-CMP characteristics showed the typical oxide-CMP characteristics which were related in both pressure and velocity according to Preston's equation and Hernandez's power law [2-4]. Good surface roughness was also obtained for the densification of multilevel memory structure by CMP process [3]. The well prepared BLT capacitors fabricated by CMP process should have the sufficient ferroelectric properties for FRAM; therefore, in this study the electrical properties of the BLT capacitor fabricated by CMP process were analyzed with the process parameters. Especially, the effects of CMP pressure, which had mainly affected the removal rate of BLT thin films [2], on the electrical properties were investigated. In order to check the influences of the pressure in eMP process on the ferroelectric properties of BLT thin films, the electrical test of the BLT capacitors was performed. The polarization-voltage (P-V) characteristics show a decreased the remanent polarization (Pr) value when CMP process was performed with the high pressure. The shape of the hysteresis loop is close to typical loop of BLT thin films in case of the specimen after CMP process with the pressures of 4.9 kPa; however, the shape of the hysteresis loop is not saturated due to high leakage current caused by structural and/or chemical damages in case of the specimen after CMP process with the pressures of 29.4 kPa. The leakage current density obtained with positive bias is one order lower than that with negative bias in case of 29.4 kPa, which was one or two order higher than in case of 4.9 kPa. The high pressure condition was not suitable for the damascene process of BLT thin films due to the defects in electrical properties although the better efficiency of process. by higher removal rate of BLT thin films was obtained with the high pressure of 29.4 kPa in the previous study [2].