• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.126-129
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• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of Information Technology Services
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• v.17 no.3
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• pp.77-100
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• 2018

As the importance of R&D has recently become more important, the budget for national R&D projects has continued to grow. Along with, there is a growing awareness to use and manage R&D funds transparently. This study examines the relationship among attitude toward the behavior (ATT), subjective norm (SN), perceived behavioral control (PBC) and behavioral Intention (BI) deriving from TPB (Theory of planned Behavior). To empirically prove the hypothesis, the statistical analysis were conducted based on the response from the 2,021 RCMS users, using SPSS 21.0 and AMOS 21.0. The research model variable consists of ATT, SN, PBC, BI, person type, RCMS characteristics. The results of study can be summarized as follows. First, ATT, SN, PBC have the positive effect on BI. Second, According to the type of person (Director, R&D supporter), there is no difference in ATT on BI but there is a difference in SN (or PBC) on BI. Third, The type of person have moderating effects in the relationship between ATT and BI. Finally, All RCMS characteristics have moderating effects in the relationship between ATT and BI. Some RCMS characteristics have moderating effects in the relationship between PBC and BI.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.109-109
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• 1999

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.251-254
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• 1999

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.61-62
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• 1999

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.34-36
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• 2003

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.05a
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• pp.55-55
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• 1994

• Korean Journal of Materials Research
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• v.4 no.1
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• pp.97-106
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• 1994

The dependence of the electrical resistivity on the eutectic composition and growth rates was investigated in the unidirectionally solidified Sb-InSb and Sn-Bi eutectic alloy systems, which were generally classified into the groups of f-f and nf-f eutectic system. Sb-InSb alloys containing 26-34wt.% In and Sn-Bi alloys containing 53-65wt.%Bi were prepared in vacuum sealed in a silica tube, and then these were unidirectionally solidified. Electrical resistivity of the specimens prepared by cutting the crystal section in parallel with the transverse direction and by cutting in longitudinal direction was measured. As the growth rate increased, the Sb-InSb and Sn-Bi eutectic alloys showed that the resistivity of longitudinal to the growth direction was increased but that of transverse to the growth direction was decreased. In the case of Sb-InSb eutectic alloy, increas~ng the phase boundary area and decreasing the fiber directionallity caused to increase the $p \; \parallel$ , while increasing the phase boundary area increased the $p \; \\perp$ As expected, the eutectic microstructure could be analysed well in terms of electrical resistivity.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.270-274
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• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.168-170
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• 2007

Sn-Bi eutectic solder alloy have is good wetting and physical properties. The results of solder paste properties test, melting point is about $139^{\circ}C$ and spread test is represent spread properties of $7{\sim}16%$. The results of shear strength after as reflowed, thermal shock test, high temperature storage test of 500hr and 1000hr at $100^{\circ}C$. The shear strength value range is from 6000 to 11000gf, pull strength value range is from 2200 to 3300gf.