• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.301-306
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• 2005

Aging characteristics of newly developed Sn-1.8Bi-0.7Cu-0.6In solder was evaluated by shear strength and microstructure. Stencil printing was applied to form solder. The shear strength of Sn-1.8Bi-0.7Cu-0.6In at $150^{\circ}C$ showed the highest values through aging. Intermetallic compounds formed on the interface between solder and Au/Cu/Ni/Al UBM were $(Cu,\;Ni)_6Sn_5$ Furthermore, it was found that Spatting of Intermetallic compounds started before 500h aging at $150^{\circ}C$.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.211-220
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• 2011

To improve the low ductility and high strain-rate sensitivity in Sn-Bi based solder alloys, the influences of the minor additions of alloying elements (Ag, Mn, In) were investigated. The strain-stress curves of various Sn-40Bi(-X) alloys, including a pre-suggested Sn-40Bi-0.1Cu composition were measured using a tensile testing machine. As a result, the elongation and ultimate tensile strength (UTS) values were compared. The small addition (0.5 wt.%) of Ag significantly enhanced the ductility and high strain-rate sensitivity of the alloys at strain rates of $10^{-4}$ to $10^{-2}\;s^{-1}$ mainly due to the increase and refinement of eutectic lamellar structures. The microstructure change increased the area of grain boundaries, thus ameliorating the grain boundary sliding mode. It was also found that Mn is an effective element in enhancing the ductility, especially at the strain rates of $10^{-3}$ to $10^{-2}\;s^{-1}$ The enhancement is likely attributed to the fine and homogeneous microstructure in the alloys containing Mn.

• Korean Journal of Materials Research
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• v.12 no.12
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• pp.911-917
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• 2002

0.5 at% $Na_2$Te-doped ($Pb_{0.7}Sn_{0.3}$)Te and ($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ powders were fabricated by mechanical alloying process. 0.5 at% Na$_2$Te-doped ($Pb_{0.7}Sn_{0.3}$)Te powders were charged at one end of mold and ($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ powders were charged at the other end of a mold. Then these powders were hot-pressed to form p-type ($Pb_{0.7}Sn_{0.3}$)Te/($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ functional gradient materials with the segment ratios (the ratio of ($Pb_{0.7}Sn_{0.3}$)Te to ($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ ) of 1:2, 1:1, and 2:1. Power generation characteristics of the ($Pb_{0.7}Sn_{0.3}$)Te/($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ were measured. When the temperature difference ΔT at both ends of the specimen was larger than $300^{\circ}C$, the ($Pb_{0.7}Sn_{0.3}$)Te/($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ with the segment ratios of 1:2 and 1:1 exhibited larger output power than those of the ($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ and 0.5 at% $Na_2$ Te-doped ($Pb_{0.7}Sn_{0.3}$)Te alloys. The maximum output power of the ($Pb_{0.7}Sn_{0.3}$)Te/($Bi_{0.2}Sb_{0.8}$)$_2$$Te_3$ predicted with the measured Seebeck coefficient and the estimated electrical resistivity was in good agreement with the measured maximum output power.

• Korean Journal of Materials Research
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• v.8 no.3
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• pp.238-244
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• 1998

Sn-rich합금의 석출 현상을 조사하였다. 첫째, 대기중과 진공 중에서 용해된 90Sn-o10Bi(wt%)합금을 $140^{\circ}C$에서 용체화 처리한 후 석출반응을 조사하였다. 90Sn-10Bi(wt%)합금은 불연속 석출(DP)현상을 나타냈다. 공기 중에서 용융된 시료의 DP반응이 진공 중에서 용융된 시료보다 빠르게 진행되었다. 이것은 공기 중에서 용융하는 과정에서 시료에 용존된 산소에 의해 입계 에너지가 감소한 것에 기인하는 것으로 판단된다. 둘째, 용융 후 서냉 응고된 Sn-Bi(-In)합금을 $140^{\circ}C$이하의 온도에서 열처리하여 미세조직 변화를 조사하였다. 명확한 고경각 입계가 존재하지 않는 응고조직에서, 편석영역으로부터 DP반응이 진행되어 석출셈이 형성되었다. DP반응선단에는 반응계면이 관찰되었다. 이 현상은, 이제까지 알려진 바와는 다르게, DP반응이 반응 전에 존재하는 고경각 입계뿐만 아니라 재결정현상에 의해 새로운 석출계면이 생성될 수 있음을 의미한다. 이러한 재결정 현상은 확산에 의한 정합변형(coherency strain)으로 설명된다.

• Journal of Korea Foundry Society
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• v.17 no.3
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• pp.245-251
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• 1997

Solderability, interfacial reaction and mechanical properties of joint between Sn-Bi-Ag base solder and Cu-substrate were studied. Solders were subjected to aging treatments to see the change of mechanical properties for up to 30 days at $100^{\circ}C$, and then also examined the changes of microstructure and morphology of interfacial compound. Sn-Bi-Ag base solder showed about double tensile strength comparing to Pb-Sn eutectic solder. Addition of 0.7wt%Al in the Sn-Bi-Ag alloy increase spread area on Cu substrate under R-flux and helps to reduce the growth of intermetallic compound during heat-treatment. According to the aging experiments of Cu/solder joint, interfacial intermetallic compound layer was exhibited a parabolic growth to aging time. The result of EDS, it is supposed that the soldered interfacial zone was composed of $Cu_6Sn_5$.

• Journal of Ceramic Processing Research
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• v.19 no.5
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• pp.388-393
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• 2018

Sublimation of $Bi_2O_3$-based materials is an important degradation issue for the long-term applications of many electronic devices. A series of $SnO_2$-doped $Bi_2O_3$ materials (SBO), was synthesized, densified, and then tested in air or strong reducing atmosphere. The $SnO_2$-doping effects and sublimation kinetics of the SBO materials were studied by X-ray diffraction (XRD), scanning electron microscope (SEM) and precise mass loss measurement. The results show that formation of $Bi_2Sn_2O_7$ phase greatly retards the mass loss of SBO. The SBO samples show a surface sublimation in an energy of $52.6kJ{\cdot}mol^{-1}$. However, the sublimation is also controlled by surface microstructure as the amount of vaporizing species (the Bi or gaseous Bi-oxides) is more than 0.1 mass%. The evaporation is retarded on the rough surface and the mechanism of surface evaporation is changed to diffusional control.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.139-141
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.94-98
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• 2003

The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.189-192
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• 2002

Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi, 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~222$^{\circ}C$, 응고온도범위는 20~37$^{\circ}C$로 중.고온계 솔더로서 적용이 가능하다. 실험 조성별 솔더 합금중 실용적, 경제적인 면을 고려하여 Sn-0.7%(Cu+Ni)-3.5%Bi-2%In이 최적의 합금조성으로 판단된다. 이 합금은 융점이 22$0^{\circ}C$정도이며 응고범위는 $25^{\circ}C$, 강도 면에서는 타 합금에 비해 상당히 우수한 값을 나타내었으며 연신율은 비교적 낮은 값을 나타내었다. 다른 기계적, 전기적 특성은 타 솔더 합금과 유사하거나 우수한 편이었으며 젖음특성도 양호하였다.