• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.917-918
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.555-556
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• 2010

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.915-917
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• 1999

We investigated the effects of doping elements on the Bi system superconductor. The doping elements can be classified into two groups depending on their supeconducting characteristics in the Bi-Sr-Ca-Cu-O structure. The first group of doping elements(P and K) have a tendency to decompose the superconducting phase and reduce the optimal sintering temperature. The second group of doping elements(B, Si, Sn and Ba) almost uneffected the superconductivity of the 2223 and 2212 phase.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.3
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• pp.247-253
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• 2000

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive-and superconducting-joint methods. For resistive-joint. filler materials of wood metal Pb/Sn. In and silver paste were used whereas for superconductive-joint lap joint method was used. In the resistive joint tape. critical transport property(CCR) n-value and contact resistance were observed to be in the range of 10-85% 1-8,9. and 0.71x10$\^$-6/-0.13x10$\^$-6/Ω, respectively. depending on their filler materials. Specifically it is believed that the electrical properties of resistive joint tape are significantly related to the resistivity of filler materials. On the other hand the CCR of superconductin joint type was varied 55 to 85% with uniaxial pressure probably due to the irregular microstructure in the transition region.

• Conservation Science in Museum
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• v.10
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• pp.1-13
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• 2009

A part of the bronze bell from Goryeo (918-1392) in the collection of Buyeo National Museum was missing, and it was noted to retain corrosion products and burial accretions. Chemical analysis showed that the chemical composition of the bronze bell is Cu (74.18%), Sn (9.58%), Pb (15.77%), and very small amounts of As, Fe, Sb, Bi, and Ag. It was noted that the microstructure of the bronze bell was mainly made up of α phase and α+δ eutectoid phase, and gray (S) and black (Pb segregation) prevailed. Conservation treatment has been done for the preservation of this bronze bell.

• Journal of the Korean Chemical Society
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• v.15 no.2
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• pp.49-54
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• 1971

It is shown that the impurities of Cu(II), Pb(II), Zn(II) and Ag(I) in Bismuth metal and the components of Pb(II), Zn(II) and Sn(IV) in Bismuth alloy are separated into their components from each other by elutions through $3.14cm^2{\times}10cm$ cation exchange resin, $Dowex\;50w\;{\times}\;8$ (100~200 mesh), column with the mixed solutions of HAc and NaAc as the eluents. The elution curve of Fe(III) has a long tailing and is not separated quantitatively from Bi(III). The eluents used for this separation are as follows; 1M HAc + 0.1M NaAc (pH 3.36) for Fe(III) and Bi (III). 0.3M HAc + 0.3M NaAc (pH 4.70) for Cu(II), Pb(II) and Zn(II). 0.5M HAc + 0.5M NaAc (pH4.70) for Ag(I) and Sn(IV). The analysis of cations eluted are carried out by spectrophotometry and EDTA titrimetry. Their recoveries are more than 99%.

• ETRI Journal
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• v.38 no.6
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• pp.1179-1189
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• 2016

A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of $86^{\circ}C$) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of $130^{\circ}C$ was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperature-dependent kinetic parameters were identified within a temperature range of $125^{\circ}C$ to $135^{\circ}C$. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.

• Resources Recycling
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• v.20 no.2
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• pp.60-66
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• 2011

Solvent extraction experiments were carried out to recover and separate Ru(III) from aqueous hydrochloric acid media using TBP and Cyanex923. The efficiency of the extraction was studied under various experimental conditions, such as concentration of HCl and NaCl, concentration of extractant in the organic phase and temperature. The extraction behavior of metal impurities, such as Pt, Bi, Sn, Fe, Pb and Cu in mixed solutions was examined. From the experimental studies, it was found that the Cyanex923 resulted in higher extraction percentage of Ru than TBP. However TBP was more effective for the separation of Ru and Pt, Bi, Sn in mixed solutions than Cyanex923.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.206-207
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• 2005

Display 소재로서 유전체나 격벽재 실링재로 사용되고 있는 frit는 PbO를 주성분으로 갖는 유리가 사용되고 있다. PbO 성분이 함유된(50$\sim$85%) 구성소재는 최근 RoHS 나 WEEE 등의 환경규제 실행에 직면해 있으며, 대체재료의 개발을 위한 많은 연구가 진행되고 있다 PbO 성분을 대체할 성분으로는 $Bi_2O_3$ 계, BaO-ZnO 계, $P_2O_5$ 계 등의 성분이 주요성분으로 이루어져 있으며, PbO 성분을 함유한 유리의 저융점, 저유전율, 고 투과율, 내산성, 내전압, 팽창계수 matching 등의 특성들에 부합되는 재료를 개발하기 위해 많은 노력을 기울이고 있다. 본 연구에서는 SnO-$P_2O_5$ 계 유리 조성을 선택하여 $R_2O_3$의 치환 및 용융분위기의 조절에 따른 저융점 유리로서의 특성과 효과에 대하여 고찰하였다.