• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• Journal of the Korean Wood Science and Technology
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• v.44 no.5
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• pp.776-784
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• 2016

In this study, green Larix kaempferi lumber was heat-treated by using superheated steam (SHS) at a pilot scale and then various physico-mechanical properties of the heat-treated wood were evaluated and compared with the properties of conventional hot air (HA) heat-treated wood. Decay resistance of brown rot fungi and compressive strength parallel to the grain of the SHS heat-treated wood without occurrence of drying check from green lumber were increased. On the other hand, density, equilibrium moisture content, shrinkage, and bending strength of the SHS heat-treated wood were lower than those of the conventional HA heat-treated wood. Because heat transfer and thermal hydrolysis of SHS heat treatment was accelerated by a large amount of water, the effect of SHS heat treatment on the physico-mechanical properties was higher than that of HA heat treatment at the similar conditions of temperature and time. From the results of this study, because green lumber can be heat-treated without occurrence of cracks or checks by using SHS and similar heat treatment effect on the physico-mechanical properties of wood can be produced despite a low temperature or short time of heat treatment, it is expected that heat time and energy consumption could be reduced by using SHS.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1427-1435
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• 2010

A mixed finite element model was developed using the classical plate theory to analyze the nonlinear bending of a plate. The appropriate weight functions for the constraints integrated over the domain were determined by the Lagrange multiplier method by using the principle of minimum virtual energy; which provides the constitutive relations between force-like variables and strains. All of detail terms of element wise coefficient matrices and associate tangent matrices to be used in the Newton iterative method are presented. Then, the linear solutions of the current model and those of the traditional displacement model under the SS (simple support) boundary conditions were compared with the existing analytical solution. The post-processed images of the nonlinear results of the force-like variables are presented to show the continuity of the solutions at the joint of the element boundaries. Finally, the converged nonlinear finite element solutions of the current model are compared with those of existing traditional displacement model.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.5
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• pp.611-617
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• 2018

The application of health monitoring, including a fault detection technique, is needed to secure the structural safety of large structures. A 2-step crack identification method for detecting the crack location and size of the beam structure is presented. First, a crack occurrence region was estimated using the modified Laplacian operator for the strain mode shape obtained from the distributed local strain data. The crack location and size were then identified based on the natural frequencies obtained from the acceleration data and the neural network technique for the pre-estimated crack occurrence region. The natural frequencies of a cracked beam were calculated based on an equivalent bending stiffness induced by the energy method, and used to generate the training patterns of the neural network. An experimental study was carried out on an aluminum cantilever beam to verify the present method for crack identification. Cracks were produced on the beam, and free vibration tests were performed. A crack occurrence region was estimated using the modified Laplacian operator for the strain mode shape, and the crack location and size were assessed using the natural frequencies and neural network technique. The identified crack occurrence region agrees well with the exact one, and the accuracy of the estimation results for the crack location and size could be enhanced considerably for 3 damage cases. The presented method could be applied effectively to the structural health monitoring of large structures.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.149-152
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• 2012

$Cu(In,Ga)Se_2$ (CIGS) is one of the most promising photovoltaic materials because of large conversion efficiency which has been achieved with an optimum Ga/(In+Ga) composition in $CuIn_{1-x}Ga_xSe_2$ (X~0.3). The Ga/(In+Ga) content is important to determine band gap, solar cell performances and carrier behaviors at grain boundary (GB). Effects of Ga/(In+Ga) content on physical properties of the CIGS layers have been extensively studied. In previous research, it is reported that GB is not recombination center of CIGS thin-film solar cells. However, GB recombination and electron-hole pair behavior studies are still lacking, especially influence of with different X on CIGS thin-films. We obtained the GB surface potential, local current and I-V characteristic of different X (00.7 while X~0.3 showed higher potential than 100 mV on GBs. Higher potential on GBs appears positive band bending. It can decrease recombination loss because of carrier separation. Therefore, we suggest recombination and electron-hole behaviors at GBs depending on composition of X.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.1
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• pp.21-26
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• 2011

Ni-YSZ (Yttria Stabilized Zirconia) composite powders were fabricated by glycine nitrate process. The prepared powders were sintered at $1300{\sim}1400^{\circ}C$ for 4 h in air and reduced at $1000^{\circ}C$ for 2 h in a nitrogen and hydrogen atmosphere. The microstructure, electrical conductivity, thermal expansion and mechanical properties of the Ni-YSZ cermets have been investigated with respect to the volume contents of Ni. A porous microstructure consisting of homogeneously distributed Ni and YSZ phases together with well-connected grains was observed. It was found that the open porosity, electrical conductivity, thermal expansion and bending strength of the cermets are sensitive to the volume content of Ni. The Ni-YSZ cermet containing 40 vol% Ni was ascertained to be the optimum composition. This composition offers sufficient open porosity of more than 30 %, superior electrical conductivities of 917.4 S/cm at $1000^{\circ}C$ and a moderate average thermal expansion coefficient of $12.6{\times}10^{-6}^{\circ}C^{-1}$ between room temperature and $1000^{\circ}C$.

• Macromolecular Research
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• v.10 no.1
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• pp.2-12
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• 2002

The small-angle X-ray scattering (SAXS) beamline BL4C1 at the 2.5 GeV storage ring of the Pohang Accelerator Laboratory (PAL) has been in its first you of operation since August 2000. During this first stage it could meet the basic requirements of the rapidly growing domestic SAXS user community, which has been carrying out measurements mainly on various polymer systems. The X-ray source is a bending magnet which produces white radiation with a critical energy of 5.5 keV. A synthetic double multilayer monochromator selects quasi-monochromatic radiation with a bandwidth of ca. 1.5%. This relatively low degree of monochromatization is sufficient for most SAXS measurements and allows a considerably higher flux at the sample as compared to monochromators using single crystals. Higher harmonics from the monochromator are rejected by reflection from a flat mirror, and a slit system is installed for collimation. A charge-coupled device (CCD) system, two one-dimensional photodiode arrays (PDA) and imaging plates (IP) are available its detectors. The overall performance of the beamline optics and of the detector systems has been checked using various standard samples. While the CCD and PDA detectors are well-suited for diffraction measurements, they give unsatisfactory data from weakly scattering samples, due to their high intrinsic noise. By using the IP system smooth scattering curves could be obtained in a wide dynamic range. In the second stage, stating from August 2001, the beamline will be upgraded with additional slits, focusing optics and gas-filled proportional detectors.

• Journal of the Korean Society of Food Science and Nutrition
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• v.34 no.2
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• pp.298-305
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• 2005

Antimicrobial packaging paper was prepared with a powder-type botanical antimicrobial agent from grapefruit seed extract (BAAG) and zeolite according to TAPPI standard method. The functional fillers containing BAAG fixed to CaCO$_3$ and zeolite were well retained in the fiber network by a retention aid such as cationic polyacrylamide, which was ascertained by the ash contents of paper and the SEM microphotographs. With addition of the functional fillers to paper, tensile strength and burst strength of the paper decreased by interference of the functional fillers with interfiber bonding but bending stiffness and tear strength increased by improved elastic modulus of paper and delayed transfer of tearing energy. Finally, it was confirmed that the antimicrobial packaging paper might be able to be used to make packaging bags and corrugated containers due to the minor deterioration of strength properties.