• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.1-9
• /
• 2013

Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.

• Electronics and Telecommunications Trends
• /
• v.27 no.1
• /
• pp.1-18
• /
• 2012

미래 사회는 나노기술(NT)을 바탕으로 IT-ET-BT 기술이 융합된 유비쿼터스 사회로 진화하고 있으며, 미래 산업 사회로의 전환을 위해서는 성능개선이 아닌 성능한계 돌파의 패러다임 전환이 가능한 임계성능의 나노 소재/신소자의 개발이 절실히 요구되고 있다. 또한 차세대 단말기는 휴대성의 편리함, 융복합화/다기능화, 인간 친화형이 요구되고, flexible/stretchable/bendable한 형태로 발전하고 있는 상황이다. 나노 피에조트로닉스(nanopiezotronics) 기술은 역학적 에너지를 전기적 에너지로 변환하는 나노 발전 소자(nanogenerator)의 원리를 기반으로 하며 나노선, 나노벨트와 같은 1차원적 나노구조 소재의 압전성과 반전도성이 결합된 특성을 이용한 신기능의 미래 IT 융합 나노 전자/에너지 소자를 구현하는 기술로서 미래 유망 기술로 부각되고 있다. 현재 기술 수준은 압전 전계 효과 트랜지스터, 압전-다이오드, 압전 센서, 압전 나노 발전 소자 등과 같은 prototype 소자를 제작하는 수준에 머무르고 있으나 향후 초고감도 압전 센서, 자가발전 MEMS/NEMS 및 나노 시스템, 스마트 웨어러블 시스템, 건강 모니터링 시스템, 인체 삽입형 소자, portable 및 투명 유연 전자소자 등의 다양한 미래 융합 나노 소자 및 시스템에 광범위한 활용이 가능하며, 향후 신기능의 소자/부품/시스템 창출을 위한 기술로 자리매김할 것으로 전망된다. 본고에서는 압전 나노선, 나노튜브, 나노섬유 등의 1차원적 나노구조체 기반의 nanopiezotronics 기술과 최근의 연구결과들을 소개한다.

• Journal of Welding and Joining
• /
• v.31 no.3
• /
• pp.84-88
• /
• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Journal of Welding and Joining
• /
• v.31 no.3
• /
• pp.4-10
• /
• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Journal of the Korean Society for Precision Engineering
• /
• v.28 no.4
• /
• pp.513-520
• /
• 2011

The NIL processes have been studied to implement low cost, high throughput and high resolution application. A RNIL(roller NIL) is an alternative approach to flat nanoimprint lithography. RNIL process is necessary to transfer patterns on flexible substrates. Compared with flat NIL, RNIL has the advantages of better uniformity, less pressing force, and the ability to repeat the patterning process continuously on a large substrate. This paper studies the design, construction and verification of a thermal RNIL system. The proposed RNIL system can easily adopt the flat shaped hot plate which is one of the most important technologies for NIL. The NIL system can be used to transfer patterns from a flexible stamp to a flexible substrate, from a flexible stamp to a Si substrate, and from a roller stamp to a flexible substrate, etc. Patterning on flexible substrates is one of the key technologies to produce bendable displays, solar cells and other applications.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.432-432
• /
• 2011

Dry adhesion caused by Nanoscale contact comes up to important scientific issue. Herein, we introduce bendable nanohairy locking fastener system with high shear strength and mechanically flexible backing. The polymeric patches like velcro are composed of an array of straight nanohairs with 100 nm diameter and $1{\mu}m$ height. To fabricate high aspect vertical nanohairs, we used UV molding method with appropriately flexible and rigid polyurethane acrylate material on PET substrate. Two identical nanohairy patches are easily merged and locked each other induced by van der Waals force. Because nanohairs can be arrayed with high density ${\sim}4{\times}10^8/cm^2$, we can obtain high shear adhesion force on flat surface (~22 N/$cm^2$). Furthermore, we can obtian nanohairy locking system with maximum shear adhesion ~48 N/$cm^2$ of curved surface due to flexibility of PET substrate. We confirm the tendency that shear adhesion force increases, as radius of curvature increases.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2018.06a
• /
• pp.34-34
• /
• 2018

레이저를 통한 플라스틱 일체형 회로형성 기술은 레이저 직접 성형 (Laser Direct Structuring, LDS) 기술과 도금기술을 이용하여 기판 표면에 전도성 회로 패턴을 형성하고 소자를 집적하여 부품을 제작하는 기술이다. 종래에는 PCB 기반의 평면기판을 기반으로 하여 제작된 소자와 부품이 전자제품의 주를 이루었으나, 최근 소자의 집적화와 제품 디자인의 유연화(flexible)로 굽힘(bendable) 형태의 스마트 시계와 같은 웨어러블(wearable) 전자 제품이 출시되었으며, 레이저를 통한 플라스틱 일체형 회로형성 기술은 미래 사회의 주를 이룰 웨어러블 형태의 제품의 상용화를 가능하게 할 뿐만 아니라 회로 집적이 가능하여 제품 혁신을 주도할 기술로 주목 받고 있다. 본 연구에서는 LDS 부품의 미세 회로 구현을 위한 공정 기술 개발에 있어서 고생산성 무전해 동도금액 및 부품 실장을 위한 표면처리 기술 개발에 대한 결과를 보고한다. 미세 회로 패터닝 기술의 상용화를 위해서는 도금액의 안정성뿐만 아니라 고속 공정기술이 필요하다, 현재 국내 무전해 동 도금의 석출 속도는 시간 당 $4{\sim}5{\mu}m$ 내외이기 때문에, 생산성을 향상시키기 위해서는 시간 당 $10{\mu}m$ 정도의 고속 무전해 동 도금 공정 개발 필요하다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.998-1001
• /
• 2009

A new flexible TFT backplane structure with improved mechanical reliability is proposed. Amorphous indium-gallium-zinc-oxide (a-IGZO) thin film transistors based on this structure have been fabricated on a polyimide substrate, and the resultant mechanical durability has been evaluated in a cyclic bending test. The panel can withstand 10,000 bending cycles at a bending radius of 5 mm without any noticeable TFT degradation. After 10K bending cycles, the change of threshold voltage, mobility, sub-threshold slope, and gate leakage current were only -0.22V, -0.13$cm^2$/V-s, -0.05V/decade, and $-3.05{\times}10^{-13}A$, respectively.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.20 no.3
• /
• pp.245-250
• /
• 2011

An UV/thermal hybrid nanoimprint lithography system was designed and implemented for the pattern transfer to flexible substrates. This system can utilize a plate stamp, roll stamp, and film stamp. For all cases of using those stamps, this system is also switchable an UV or thermal nanoimprint lithography mode. This paper shows how to design the heating and UV curing plates and proposes how to change them easily. Because the pressure condition and the speed of the press roller varies by the characteristics of the stamp and substrate, all the parameters related to the nanoimprint lithography have to adjustable. Some transferred patterns are shown in this paper to verify the performance of the hybrid nanoimprint lithography system. The flexible substrates with nano-scale patterns on them will be key components for next generation technologies such as flexible displays, bendable semi-conductors, and solar cells.

• Journal of Sensor Science and Technology
• /
• v.29 no.6
• /
• pp.394-398
• /
• 2020

In this paper, we report the sensing performance of H₂ gas sensors composed of Pd/carbon nanotube (CNT) buckypaper at room temperature. The CNT buckypaper was made using a simple filtration process and subsequently deposited with Pd as the sensing material. The sensitivity of the sensor increased with respect to the gas concentration. To investigate the effect of Pd thickness, Pd layers of different thickness were deposited on the buckypaper, and the response of the sensor was evaluated. The proposed sensor exhibits excellent sensing properties with optimized Pd thickness at room temperature (25℃). Pd nanoparticles significantly impact the sensitivity and selectivity of the sensor because of the spillover effect. In addition, the sensor is highly suitable for bendable and wearable devices owing to its structural flexibility.