• Title/Summary/Keyword: Band-Gap

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Theoretical analysis of transient wave propagation in the band gap of phononic system

  • Lin, Yi-Hsien;Ma, Chien-Ching
    • Interaction and multiscale mechanics
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    • v.6 no.1
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    • pp.15-29
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    • 2013
  • Phononic system composed of periodical elastic structures exhibit band gap phenomenon, and all elastic wave cannot propagate within the band gap. In this article, we consider one-dimensional binary materials which are periodically arranged as a 20-layered medium instead of infinite layered system for phononic system. The layered medium with finite dimension is subjected to a uniformly distributed sinusoidal loading at the upper surface, and the bottom surface is assumed to be traction free. The transient wave propagation in the 20-layered medium is analyzed by Laplace transform technique. The analytical solutions are presented in the transform domain and the numerical Laplace inversion (Durbin's formula) is performed to obtain the transient response in time domain. The numerical results show that when a sinusoidal loading with a specific frequency within band gap is applied, stress response will be significantly decayed if the receiver is away from the source. However, when a sinusoidal force with frequency is out of band gap, the attenuation of the stress response is not obvious as that in the band gap.

Application of Taguchi Methodology for Optimization of Parameters of CVD Influencing Formation of a Desired Optical Band Gap of Carbon Film

  • Mishra, D.K.;Bejoy, N.;Sharon, Maheshwar.
    • Carbon letters
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    • v.6 no.2
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    • pp.96-100
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    • 2005
  • Taguchi methodology has been applied to get an idea about the parameters related to the chemical vapour deposition technique, which influences the formation of semiconducting carbon thin film of a desired band gap. L9 orthogonal array was used for this purpose. The analysis based on Taguchi methodology suggests that amongst the parameters selected, the temperature of pyrolysis significantly controls the magnitude of band gap (46%). Sintering time has a small influence (30%) on the band gap formation and other factors have almost no influence on the band gap formation. Moreover this analysis suggests that lower temperature of pyrolysis (${\leq}$ $750^{\circ}C$) and lower time of sintering (${\leq}$ 1 h) should be preferred to get carbon thin film with the desired band gap of 1.2eV.

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Electroluminescent Devices Using a Polymer of Regulated Conjugation Length and a Polymer Blend

  • Zyung, Tae-Hyoung;Jung, Sang-Don
    • ETRI Journal
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    • v.18 no.3
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    • pp.181-193
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    • 1996
  • A blue light emitting device has been successfully fabricated using a polymer with regulated conjugation length containing trimethylsilyl substituted phenylenevinylene units. Electroluminescence from the device has an emission maximum at 470 nm. The device shows typical diode characteristics with operating voltage of 20 V and the light becomes visible at a current density of less than $0.5;mA/cm^2$. The electroluminescence spectrum is virtually identical with the photoluminescence spectrum, indicating that the radiation mechanisms are the same for both. A light emitting device using the blend of a large band gap polymer and a small band gap polymer was also fabricated. Light emission from the small band gap polymer shows much improved quantum efficiency, but there is no light emission from the large band gap polymer. Quantum efficiency of the blend increases up to about two orders of magnitude greater than that of the small band gap polymer with increasing proportion of the large band gap polymer. The improvement in quantum efficiency is interpreted in terms of exciton transfer and the hole blocking behaviour of the large band gap polymer. Finally, we have fabricated a patterned flexible light emitting device using the high quantum efficiency polymer blend system.

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Wide Band-gap FETs for High Power Amplifiers

  • Burm, Jin-Wook;Kim, Jae-Kwon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.6 no.3
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    • pp.175-181
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    • 2006
  • Wide band-gap semiconductor electron devices have made great progresses to produce very high power amplifiers for various wireless standards. The advantages of wide band-gap electronic devices and their progresses are summarized in this paper.

NNO memory device's characteristics (NNO 메모리 소자의 특성)

  • Lee, Joon-Nyung;Son, Hyuk-Joo;Yi, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.133-134
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    • 2008
  • 이 논문에서는 $SiN_x$의 band gap 차이를 이용하여 MIS 구조의 메모리 소자를 제작하고 이를 분석하였다. $SiN_x$ 박막은 증착 가스비에 따라 다양한 band gap을 가지게 된다. 본 실험에서는 n-type 단결정 실리콘 기판위에 $SiH_4/NH_3$ 가스를 혼합하여 $SiN_x$ 박막을 증착하고, UV-Vis Spectrophotometer 장비를 이용하여 band gap을 구하였다. 큰 band gap을 갖는$SiN_x$ 박막을 블로킹 층에, 작은 band gap을 작는 $SiN_x$ 박막을 전하 저장 층에 사용하였다. 제작된 NNO 구조일 소자는 7.6 V의 hysteresis roof 폭과 1000초 후에 88.6 %의 retention 값을 갖는 우수한 메모리 특성을 보였다.

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Synthesis and Band Gap Analysis of Meso-Arylporphyrins Containing Exclusively Electron Donating or Withdrawing Groups

  • Min Su Kang;Kwang-Jin Hwang
    • Journal of the Korean Chemical Society
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    • v.67 no.3
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    • pp.175-180
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    • 2023
  • Tetra-aryl substituted A4-type porphyrins (TP, TD, TA) and trans-A2B2 porphyrins (DDP1, AAP1) with electron-donating or withdrawing groups were synthesized. The band gap energy of those porphyrins was calculated from their UV-Vis spectra and CV data. With an electron-withdrawing group, the band gap energy of porphyrin TA increased via the LUMO energy up. Meanwhile, the introduction of an electron-donating group decreased the band gap of porphyrin by HOMO level up as as in the case of porphyrin TD. The band gap (2.19-2.28 eV) of metalloporphyrin PP-Ni was greater than those (1.81-2.06 eV) of non-metalloporphyrins PP due to the LUMO level up.

Effects of Ohmic Area Etching on Buffer Breakdown Voltage of AlGaN/GaN HEMT

  • Wang, Chong;Wel, Xiao-Xiao;Zhao, Meng-Di;He, Yun-Long;Zheng, Xue-Feng;Mao, Wei;Ma, Xiao-Hua;Zhang, Jin-Cheng;Hao, Yue
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.3
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    • pp.125-128
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    • 2017
  • This study is on how ohmic area etching affects the buffer breakdown voltage of AlGaN/GaN HEMT. The surface morphology of the ohmic metal can be improved by whole etching on the ohmic area. The buffer breakdown voltages of the samples with whole etching on the ohmic area were improved by the suppression of the metal spikes formed under the ohmic contact regions during high-temperature annealing. The samples with selective etching on the ohmic area were investigated for comparison. In addition, the buffer leakage currents were measured on the different radii of the wafer, and the uniformity of the buffer leakage currents on the wafer were investigated by PL mapping measurement.

A Study on the Optical Properties of Diamod-Like Carbon Film (Diamond-Like Carbon 박막의 광학적 특성에 관한 연구)

  • 권도현;박성계;남승의;김형준
    • Journal of the Korean Vacuum Society
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    • v.10 no.2
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    • pp.194-200
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    • 2001
  • In this study, the optical properties of diamond-like carbon(DLC) films, which was synthesized by 13.56 MHz rf plasma enhanced chemical vapor deposition system(PECVD), were investigated. We observed the variation of the transmittance and optical band gap with respect to deposition condition. The change of the transmittance and optical band gap of the DLC films were investigated as a function of RF power, working pressure, and additional gas. The optical band gap decreased with the increase of RF power and working pressure. We could verify the bond structures change of DLC films by observing the content of hydrogen using FT-IR spectroscopy. And the addition of hydrogen and nitrogen decreased the optical band gap by the breakage of C-H bond of DLC films during the deposition.

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Two-dimensional modelling of uniformly doped silicene with aluminium and its electronic properties

  • Chuan, M.W.;Wong, K.L.;Hamzah, A.;Rusli, S.;Alias, N.E.;Lim, C.S.;Tan, M.L.P.
    • Advances in nano research
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    • v.9 no.2
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    • pp.105-112
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    • 2020
  • Silicene is a two-dimensional (2D) derivative of silicon (Si) arranged in honeycomb lattice. It is predicted to be compatible with the present fabrication technology. However, its gapless properties (neglecting the spin-orbiting effect) hinders its application as digital switching devices. Thus, a suitable band gap engineering technique is required. In the present work, the band structure and density of states of uniformly doped silicene are obtained using the nearest neighbour tight-binding (NNTB) model. The results show that uniform substitutional doping using aluminium (Al) has successfully induced band gap in silicene. The band structures of the presented model are in good agreement with published results in terms of the valence band and conduction band. The band gap values extracted from the presented models are 0.39 eV and 0.78 eV for uniformly doped silicene with Al at the doping concentration of 12.5% and 25% respectively. The results show that the engineered band gap values are within the range for electronic switching applications. The conclusions of this study envisage that the uniformly doped silicene with Al can be further explored and applied in the future nanoelectronic devices.

Band Alignment at CdS/wide-band-gap Cu(In,Ga)Se2 Hetero-junction by using PES/IPES

  • Kong, Sok-Hyun;Kima, Kyung-Hwan
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.5
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    • pp.229-232
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    • 2005
  • Direct characterization of band alignment at chemical bath deposition $(CBD)-CdS/Cu_{0.93}(In_{1-x}Ga_x)Se_2$ has been carried out by photoemission spectroscopy (PES) and inverse photoemission spectroscopy (IPES). Ar ion beam etching at the condition of the low ion kinetic energy of 400 eV yields a removal of surface contamination as well as successful development of intrinsic feature of each layer and the interfaces. Especially interior regions of the wide gap CIGS layers with a band gap of $1.4\~1.6\;eV$ were successfully exposed. IPES spectra revealed that conduction band offset (CBO) at the interface region over the wide gap CIGS of x = 0.60 and 0.75 was negative, where the conduction band minimum of CdS was lower than that of CIGS. It was also observed that an energy spacing between conduction band minimum (CBM) of CdS layer and valance band maximum (VBM) of $Cu_{0.93}(In_{0.25}Ga_{0.75})Se_2$ layer at interface region was no wider than that of the interface over the $Cu_{0.93}(In_{0.60}Ga_{0.40})Se_2$ layer.