• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.1-4
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• 2006

Recently, Ball Grid Arrays(BGAs) are getting used more frequently for a package type. The connectors on a BGA consist of a large number of small solder balls in a grid shape on its bottom side. However, since balls of BGAs mounted on PCBs are not visible, inspection before mounting them is indispensable. High speed non-contact 3D measurement technologies are necessary far real-time measurement of ball height, the most important inspection item. In this paper, an accurate 3D data acquisition system for BGAs is proposed that can acquire 3D profile at high speed using a 3D smart camera and laser slit ray projection. Some clipping and morphological filtering operations are employed to remove spiky error data, which occur due to reflections from some ball area to camera direction.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• Journal of Welding and Joining
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• v.18 no.4
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.524-527
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• 2000

In this paper, we have studied minimization of the burr which occurred after $\mu$-BGA(ball grid array) singulation process, singulation of the multilayer with a pulsed Nd:YAG(266, 532 nm) laser is used to cut the metal layer which doesn't well absorb laser beam. Especially, the photoresist and $N_2$blowing is effective to minimize of the surface demage and burr. In this experiment, the $N_2$ blowing reduces a laser energy loss by debris and suppress a surface oxidation. The SEM(scanning electron microscopes) and non-contact 3D inspector are used to measure cutting line-width and surface demage. The $\mu$-BGA singulation threshold energy is 75.0 J/cm$^2$at 30 ${\mu}{\textrm}{m}$/s scan speed.

• Journal of Korean Institute of Industrial Engineers
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• v.25 no.2
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• pp.204-216
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• 1999

Failure physics and statistical lifetime analysis constitute the two extreme ends of the reliability engineering spectrum, and studies that relate failure mechanisms to failure distributions have been near non-existent. This paper is an attempt to stimulate interest to fill the gap between the two extremes and proposes an approach of combining them through i) developing a failure mechanism model, ii) generating failure times by Monte Carlo simulation with the model, iii) deriving the failure time distribution and evaluating the product reliability, and iv) improving the product reliability by the sensitivity analysis. An application of the proposed approach to the BGA(Ball Grid Array) surface mount package is also provided.

• Journal of Information Processing Systems
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• v.16 no.6
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• pp.1271-1280
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• 2020

The yield and quality of a micromanufacturing process are important management factors. In real-world situations, it is difficult to achieve a high yield from a manufacturing process because the products are produced through multiple nanoscale manufacturing processes. Therefore, it is necessary to identify the processes and equipment that lead to low yields. This paper proposes an analytical method to identify the processes and equipment that cause a defect in the plastic ball grid array (PBGA) during the manufacturing process using logistic regression and stepwise variable selection. The proposed method was tested with the lot trace records of a real work site. The records included the sequence of equipment that the lot had passed through and the number of faults of each type in the lot. We demonstrated that the test results reflect the real situation in a PBGA manufacturing process, and the major equipment parameters were then controlled to confirm the improvement in yield; the yield improved by approximately 20%.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Proceedings of the Korean Information Science Society Conference
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• 2001.10b
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• pp.481-483
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• 2001

최근 전자제품의 초소형화에 따라, PCB 기판위의 부품의 집적도를 높이기 위해, 기존의 리드대신 부품 밑면에 볼(ball)이 격자형태로 배열되어 있는 BGA(Ball Grid Array) 형태의 팩키지가 많이 사용되고 있다. 하지만, BGA의 구조상 한번 장착되면 외관검사가 불가능하므로, 장착전 BGA의 검사가 필수적이다. BGA의 검사항목중 가장 중요한 항목인 볼 높이검사를 실시간으로 하기 위해서는 고속 비접촉 3차원 측정기술이 요구된다. 본 논문에서는 일반카메라보다 100배이상 높이 프로파일 취득속도가 빠른 3D smart camera와 레이저 슬릿광(slit ray)을 이용하여 고속으로 BGA 볼의 3D 프로파일을 얻은 후, clipping과 morphological filter를 사용하여 인접한 볼표면에서의 난반사로 인한 에러 데이터를 보정하여 정확한 3D 영상을 취득할 수 있는 시스템을 소개한다.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.04b
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• pp.1237-1240
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• 2001

최근 제품의 초소화와 반도체의 고집적화로, 작은 크기로 많은 리드를 제공하기 위해, 부품 밑면에 격자형태로 볼이 배열되어 있는 BGA나 CSP부품들이 최근 많이 이용되고 있다. 하지만, BGA는 한번 PCB에 장착되면, 볼 외관검사가 원천적으로 불가능하므로, 부품을 장착하기 전에 볼 품질의 검사와 부품의 정밀한 위치 및 각도의 측정이 요구된다. 본 논문에서는 BGA부품의 위치 및 각도를 추출하기 위한 방법과 볼을 검사하기 위한 알고리즘을 소개한다.