An Approach of Combining Failure Physics and Lifetime Analysis for Product Reliability Improvement: An Application to BGA(Ball Grid Array) Package

고장물리와 수명분석을 이용한 제품신뢰도 개선: BGA(Ball Grid Array) 패키지에 대한 사례연구를 중심으로

Failure physics and statistical lifetime analysis constitute the two extreme ends of the reliability engineering spectrum, and studies that relate failure mechanisms to failure distributions have been near non-existent. This paper is an attempt to stimulate interest to fill the gap between the two extremes and proposes an approach of combining them through i) developing a failure mechanism model, ii) generating failure times by Monte Carlo simulation with the model, iii) deriving the failure time distribution and evaluating the product reliability, and iv) improving the product reliability by the sensitivity analysis. An application of the proposed approach to the BGA(Ball Grid Array) surface mount package is also provided.