• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.865-868
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• 2002

This study investigated the shape deformation of ball projectile(5.56mn) under the low energy impact by the use of the drop weight impact tester. ball projectile(5.56mm) consisted of the copper face with a lead core. The impact conditions were changed with the variations of the mass and the drop height of the impact tup. Shape deformation of ball projectile(5.56mm) after low velocity impact was measured using a video microscope and CCD camera. The test result showed that impact energy by changing of drop height of the impact tup affected shape deformation of ball projectile(5.56mm). So, it is important to study the relativity between shape deformation of ball projectile(5.56mm) and ballistic protection of plate(such as hybrid composite laminates) under the high velocity impact.

• Journal of Auto-vehicle Safety Association
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• v.7 no.3
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• pp.14-18
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• 2015

Toughened glass is known to have about four times larger external impact resistance than that of original glass. This study is aimed to verify that ceramic-printed toughened glass does not meet of GTR(Global Technical Regulations) No. 6 and its strength is lower than that of original glass through tests. The tests were conducted on the test pieces of original glass, toughened glass, and ceramic-printed toughened glass from five glass manufacturers. In Test 1, a 227g steel ball was dropped from a height of 2 meters, and damage was checked according to the test method of GTR No. 6. In Test 2, a steel ball was freely dropped from different heights and limited damage height was determined. In the result of Test 1 according to the test method of GTR No. 6, while all five test pieces of toughened glasses were not damaged, all the ceramic-printed toughened glass from the five manufacturers were damaged. In the result of Test 2, none of the five test pieces of toughened glass were damaged by a 10m ball drop, meanwhile, the original glasses were damaged by an average of 3m ball drop. And the results of the tests show that the ceramic-printed toughened glass does not have the features of toughened glass due to its very low strength. Therefore, this study contributes to the safety of consumers by considering the GTR No. 6, and by revising the toughened glass test method.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.20 no.7
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• pp.658-664
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• 2010

A control element drive mechanism(CEDM) is a reactor regulating system, which inserts, withdraws or maintains a control rod containing a neutron absorbing material within a reactor core to control the reactivity of the core. The ball-screw type CEDM for the integral reactor has a spring-damper system to reduce the impact force due to the scram of the CEDM. This paper describes the experimental results to obtain the drop and damping characteristics of the CEDM. The drop tests are performed by using a drop test rig and a facility. A drop time and a displacement after an impact are measured using a LVDT. The influences of the rod weight, the drop height and the flow area of hydraulic damper on the drop and damping behavior are also estimated on the basis of test results. The drop time of the control element is within 4.5s to meet the design requirement, and the maximum displacement is measured as 15.6 mm. It is also found that the damping system using a spring-hydraulic damper plays a good damper role in the CEDM.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Tribology and Lubricants
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• v.27 no.3
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Explosives and Blasting
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• v.29 no.1
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• pp.41-47
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• 2011

In order to estimate blast damage zone and control rock fragmentation in blasting, it is important to obtain information regarding blast hole pressure. In this study, drop impact tests of acrylic, aluminium, steel sensors were performed to investigate the dynamic response characterizations of the sensors through the strain signals. As a result, the strain signals obtained from the steel sensors showed less sensitivity to impact force level and experienced small changes with various length of the sensors. The steel sensors were applied to measure the impact force of an electric detonator.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.3
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• pp.623-630
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• 1995

The impulse response functions (force-strain relations) for Euler-Bernoulli and Timoshenko beams are considered. The response of a beam to a transverse impact force is numerically obtained with the convolution approach using the impulse response function obtained by Laplace transform. Using this relation, the impact force history is determined in the time domain and results are compared with those from Hertz's contact law. The parameters of timpact force model are identified using the recovered force and compared with the Hertz's contact model. In order to verify the proposed algorithm, measurements were done using an impact hammer and a steel ball drop test and these results are also compared with the simulated values.

• Journal of Welding and Joining
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• v.5 no.1
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• pp.57-63
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• 1987

A method which can be used for evaluating slag detachability is proposed in this study. The proposed method was intended to get an absolute value for slag detachability, to give consistent value for a given welded joint, and finally to be simple to test. With a test fig made in this study, an impact by dropping a steel ball (13Kg in weight) is applied on the back side of an as-welded plate having a slag layer on the weld bead. Such impact applied forces the slag to drop off from the bead surface. In order to make a quantitative evaluation the amount of slag removed was measured with increasing the number of drops. Using this method six kinds of fluxes were evaluated in terms of the effects of flux type, basicity and weding variables on the slag detachability. As an initial result of this test, it was found that welding heat input affects the detachability significantly. Most importantly the evaluation made using the presently proposed method gives the same order of ranking as that of the actual practice done by a welder.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.