• Bulletin of the Korean Chemical Society
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• v.32 no.12
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• pp.4347-4351
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• 2011

The nucleophilic substitution reactions of ethylene phosphorochloridate (2) with X-pyridines are investigated kinetically in acetonitrile at $-20.0^{\circ}C$. The free energy correlations for substituent X variations in the nucleophiles exhibit biphasic concave upwards with a break point at X = 3-Ph. Unusual positive ${\rho}_X$ (= +2.49) and negative ${\beta}_X$ (= -0.41) values are obtained with the weakly basic pyridines, and rationalized by the isokinetic relationship with isokinetic temperature at $t_{ISOKINETIC}=6.6^{\circ}C$. The pyridinolysis rate of 2 with a cyclic five-membered ring is forty thousand times faster than its acyclic counterpart (3: diethyl chlorophosphate) because of great positive value of the entropy of activation of 2 (${\Delta}S^{\neq}$ = +49.2 eu) compared to negative value of 3 (${\Delta}S^{\neq}$ = -44.1 eu) over considerably unfavorable enthalpy of activation of 2 (${\Delta}H^{\neq}=28.4\;kcal\;mol^{-1}$) compared to 3 (${\Delta}H^{\neq}=6.3\;kcal\;mol^{-1}$). Great enthalpy and positive entropy of activation are ascribed to sterically congested transition state (TS) and solvent structure breaking in the TS. A concerted mechanism involving a change of nucleophilic attacking direction from a frontside attack with the strongly basic pyridines to a backside attack with the weakly basic pyridines is proposed.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• Journal of the Korean Solar Energy Society
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• v.32 no.4
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• pp.24-33
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• 2012

Recently, finishing materials at spandrel area, a part of curtain-wall system, are gradually forced to improve thermal insulation performance in order to enhance the building energy efficiency. Also, Building Integrated Photovoltaics(BIPV) systems have been installed in the exterior side of the spandrel area, which is generally composed of windows. Those BIPVs aim to achieve high building energy efficiency and supply the electricity to building. However, if transparent BIPV module is combined with high insulated spandrel, it would reduce the PV efficiency for two major reasons. First, temperature in the air space, located between window layer and finishing layer of the spandrel area, can significantly increase by solar heat gain, because the space has a few air density relative to other spaces in building. Secondly, PV has a characteristics of decreased Voltage(Voc and Vmp) with the increased temperature on the PV cell. For these reasons, this research analyzed a direct interrelation between PV Cell temperature and electricity generation performance under different insulation conditions in the spandrel area. The different insulation conditions under consideration are 1) high insulated spandrel(HIS) 2) low insulated spandrel(LIS) 3) PV stand alone on the ground(SAG). As a result, in case of 1) HIS, PV temperature was increased and thus electricity generation efficiency was decreased more than other cases. To be specific, each cases' maximum temperature indicated that 1) HIS is $83.8^{\circ}C$, 2) LIS is $74.2^{\circ}C$, and 3) SAG is $66.3^{\circ}C$. Also, each cases yield electricity generation like that 1) HIS is 913.3kWh/kWp, 2) LIS is 942.8kWh/kWp, and 3) SAG is 981.3kWh/kWp. These result showed that it is needed for us to seek to the way how the PV Cell temperature would be decreased.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.188.1-188.1
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• 2014

Aluminum is widely used as a material for electrode on silicon based devices. Especially, aluminum films are used as backside and front-side electrodes in silicon quantum dot (QD) solar cells. In this point, the diffusion of aluminum is very important for the enhancement of power conversion efficiency by improvement of contact property. Aluminum was deposited on a Si (100) wafer and a Si QD layer by ion beam sputter system with a DC ion gun. The Si QD layer was fabricated by $1100^{\circ}C$ annealing of the $SiO_2/SiO_1$ multilayer film grown by ion beam sputtering deposition. Cs ion beam with a low energy and a grazing incidence angle was used in SIMS depth profiling analysis to obtain high depth resolution. Diffusion behavior of aluminum in the Al/Si and Al/Si QD interfaces was investigated by secondary ion mass spectrometry (SIMS) as a function of heat treatment temperature. It was found that aluminum is diffused into Si substrate at $450^{\circ}C$. In this presentation, the effect of heat treatment temperature and Si nitride diffusion barrier on the diffusion of Al will be discussed.

• Fire Science and Engineering
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• v.27 no.3
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• pp.8-13
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• 2013

In case of fire in a high-rise building fire can be easily spread along the building external walls dramatically if the flame comes out through broken windows. There are a few effective methods to prevent the fire spread at the moment. One is using a fire resistance window, and the other is using a window sprinkler that discharges water to resist flame in case of fire. In this study a window sprinkler which is installed on top of windows and prevents fire by discharging water when its heat-responsive element opens was tested using a large scale furnace in accordance with the standard temperature-time graph. Test result showed that one window sprinkler was able to protect a 2,400 mm wide window from fire for 2 hours and the window backside's temperature locally increased up to $126^{\circ}C$ but kept stable around $100^{\circ}C$ for the test duration.

• Journal of the Korean Recycled Construction Resources Institute
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• v.11 no.4
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• pp.560-567
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• 2023

This study is part of the research on fire-resistant materials to prepare for changing fire behavior, oyster shell and egg shell, which are natural calcium carbonate materials, were substituted as fine aggregates. The purpose of this study was to evaluate the strength and fire resistance performance according to the substitution rate, and to provide data for use as fire resistance material. Oyster shells and egg shells were substituted with 10~50 % of the fine aggregate, respectively, and tested for strength and Simplified heating according to the KS test method. Although the strength of OS was measured to be higher than that of ES, the backside temperature was also measured to be higher. As a result, it is recommended to use fireproof boards with OS where strength performance is required, such as explosive fires, Where high fire resistance performance is required, such as high-temperature fires over 1000 ℃, fireproof boards with ES can be selected according to the application.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.3
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• pp.149-158
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• 2005

This paper describes design, fabrication, and application of the silicon based temperature controllable micro reactor. In order to achieve fast temperature variation and low energy consumption, reaction chamber of the micro reactor was thermally isolated by etching the highly conductive silicon around the reaction chamber. Compared with the model not having thermally isolated structure, the thermally isolated micro reactor showed enhanced thermal performances such as fast temperature variation and low energy consumption. The performance enhancements of the micro reactor due to etched holes were verified by thermal experiment and numerical analysis. Regarding to 42 percents reduction of the thermal mass achieved by the etched holes, approximately 4 times faster thermal variation and 5 times smaller energy consumption were acquired. The total size of the fabricated micro reactor was $37{\times}30{\times}1mm^{3}$. Microchannel and reaction chamber were formed on the silicon substrate. The openings of channel and chamber were covered by the glass substrate. The Pt electrodes for heater and sensor are fabricated on the backside of silicon substrate below the reaction chamber. The dimension of channel cross section was $200{\times}100{\mu}m^{2}$. The volume of reaction chamber was $4{\mu}l$. The temperature of the micro reactor was controlled and measured simultaneously with NI DAQ PCI-MIO-16E-l board and LabVIEW program. Finally, the fabricated micro reactor and the temperature control system were applied to the thermal denaturation and the trypsin digestion of protein. BSA(bovine serum albumin) was chosen for the test sample. It was successfully shown that BSA was successfully denatured at $75^{\circ}C$ for 1 min and digested by trypsin at $37^{\circ}C$ for 10 min.

• Journal of Power System Engineering
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• v.16 no.4
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• pp.30-36
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• 2012

A scroll expander has been designed to produce a shaft power from a R134a Rankine cycle for electricity generation. Heat was supplied to the Rankine cycle through a heat exchanger, which received heat from another cycle of water. In the water cycle, water was heated up in a boiler using biogenic solid fuel. The designed scroll expander was a horizontal type, and a trochoidal oil pump was employed for oil supply to bearings and Oldham-ring keys. For axial compliance, a back pressure chamber was created on the backside of the orbiting scroll base plate. Numerical study has been carried out to estimate the performance of the designed scroll expander. The expander was estimated to produce the shaft power of about 2.9 kW from a heat supply of 36 kW, when the temperature of R134a was $80^{\circ}C$ and $35^{\circ}C$ at the evaporator and condenser of the Rankine cycle, respectively. The expander efficiency was about 70.5%. When the amount of heat supply varied in the ranges of 7.5~55 kW, the expander efficiency changed in the range of 45.6~70.5%, showing a peak efficiency of 70.5% at the design shaft speed.

• Journal of Sensor Science and Technology
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• v.7 no.2
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• pp.103-110
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• 1998

Pyroelectric infrared detectors based on La-modified $PbTiO_{3}$ (PLT) thin films have been fabricated by RF magnetron sputtering and rnicrornachining technology. The detectors form $Pb_{l-x}La_{x}Ti_{1-x/4}O_{3}$ (x=0.05) thin film ferroelectric capacitors epitaxially grown by RF magnetron sputtering on Pt/MgO (100) substrate. The sputtered PLT thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency. Polymide is coated on top of the sensing elements to support the fragile structure and the backside of the MgO substrate is selectively etched to reduce the heat loss. The sensing element exhibited a very high detectivity D* of $8.5{\times}10^{8}cm{\cdot}\sqrt{Hz}/W$ at room temperature and it is about 100 times higher than the case of micromachining technology is not used. A sensing system that detects the position as well as the existence of a human body is realized using the array sensor.