• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1148-1151
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• 2009

A self-designed, written in labview, Organic Light-Emitting Diode junction temperature measuring program was used to calculate the internal junction temperature for devices during operation, and an infrared thermometer was used to measure the backside temperature of the device substrate, to discuss the effects of the junction and substrate temperature difference to the characteristics of the device.

• Proceedings of the Korea Concrete Institute Conference
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• 2003.05a
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• pp.305-310
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• 2003

Recently, gypsum boards are widely used as interior finishing boards for constructions because of their features of absorbing heats and little temperature rising at the early stage of fire. Therefore, in this research, basic data were suggested to secure fireproof stability by investigating interior processing features, which change together with the backside temperature of test materials from Flash Over (within 30 minutes after firing), at which temperature reaches its highest point, to survey the features of materials due to rising temperature in the chase of gypsum boards (general and fireproof gypsum boards)

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.68-71
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• 2000

In this paper, we have measured the oxygen contents by FTIR in silicon wafer various process technology(slicing, lapping, polishing). The measured data are also compared with the data of etching process(KOH, Bright etching). Also we have measured the surface morpology in backside silicon wafer after etching treatment and etch pit density due to OISF after 4 step high temperature annealing process with optical microscope.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.114-117
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• 2009

The performance of PV module applying the photovoltaic effects of the semiconductor is affected by temperature. Until now, most of PV module show that the power and efficiency falls at a rate of ${\sim}0.5%/^{\circ}C$ and ${\sim}0.05%/^{\circ}C$ respectively as increase of ambient temperature. In this study, the effect of fins attached to the backside of PV module was investigated through a thermal analysis program and simulation model. The result shows that the inner temperature of PV module with fin falls about $10^{\circ}C$ compare to that of ordinary PV module.

• New & Renewable Energy
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• v.2 no.2 s.6
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• pp.9-15
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• 2006

The application of photovoltaics into building as integrated building components has been paid more attention worldwide. Photovoltaics or solar electric modules are solid state devices, directly converting solar radiation into electricity; the process does not require fuel and any moving parts, and produce no pollutants. And the prefab building method is very effective because the pre- manufactured building components is simply assembled to making up buildings in the construction fields especially the sandwich panel. So, the purpose of this research is to integrated prefab building materials depending on the cooling type of PV modules. It is concluded that the prediction of BIPV system's performance should be based on the more accurate PV module temperature. From the basis of these results on the correlation of temperature and irradiation were obtained.

• 한국신재생에너지학회:학술대회논문집
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• 2006.06a
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• pp.138-141
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• 2006

The application of photovoltaics into building as integrated building components has been paid more attention worldwide. Photovoltaics or solar electric modules are solid state devices, directly converting solar radiation into electricity; the process does not require fuel and any moving parts, and produce no pollutants. And the prefab building method is very effective because the pre-manufactured building components is simply assembled to making up buildings in the construction fields especially the sandwich panel. So, the purpose of this research is to integrated prefab building materials depending on the cooling type of PV modules. It is concluded that the prediction of BIPV system's performance should be based on the more accurate PV module temperature. From the basis of these results on the correlation of temperature and irradiation were obtained.

• 한국태양에너지학회:학술대회논문집
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• 2008.04a
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• pp.263-268
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• 2008

Building Integrated PV(BIPV) is one of the best fascinating PV application technologies. To apply PV module in building, various factors should be reflected such as installation position, shading, temperature, and so on. Especially a temperature should be considered, for it affects both electrical efficiency of a PV module and heating/cooling load in a building. This study investigates a semitransparent PV module that is designed as finished material for windows. Therefore it needs to considerate about the optical characteristics of the transparent module. It reports the effect of thermal and optical characteristics of the PV module on generation performance. The study was performed by measuring sun spectrum and luminance through the PV modules and by monitoring the temperature and experiment. The results showed that 1 degree temperature rise reduced about 0.48% of output power.

• Fire Science and Engineering
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• v.32 no.1
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• pp.46-56
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• 2018

The paper relates to a study on the conduction heat transfer characteristics according to the heating temperature of lightweight panel wall material. Plywoods, marbles, heat resistant glasses, as well as general gypsum board and fire-proof gypsum board, which have been widely used for lightweight panel wall material, were selected as experiment samples, and heating temperatures were set as $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$ and $600^{\circ}C$. Next, each of the heating temperatures were introduced on the bottom part of the wall material for 30 minutes, and analyses were made on the heat transfer characteristics to the backside part on the top part through conduction. As results of the experiment, the maximum backside temperatures were measured up to $190^{\circ}C$ for a general gypsum board, $198^{\circ}C$ for a fire-proof gypsum board, $189^{\circ}C$ for a plywood, $321^{\circ}C$ for a marble, and $418^{\circ}C$ for a heat resistant glass as heating temperatures were introduced maximum of $600^{\circ}C$. In addition, the maximum change rate of conduction heat transfer were measured up to 85 W for a general gypsum board, 95 W for a fire-proof gypsum board, 67 W for a plywood, 1686 W for a marble, and 3196 W for a heat resistant glass as the maximum heating temperatures were introduced up to $600^{\circ}C$. Also, carbonization characteristics of the wallpapers were measured to visually check the danger of conduction heat transfer, and the results showed that smokes were first generated on the attached wallpapers for the heating temperature $600^{\circ}C$, which were 1021 s for a general gypsum board, 978 s for a fire-proof gypsum board, 1395 s for a plywood, 167 s for a marble, and 20 s for a heat resistant glass, and that the first generation of carbonization were 1115 s for a general gypsum board, 1089 s for a fire-proof gypsum board, 1489 s for a plywood, 192 s for a marble, and 36 s for a heat resistant glass.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2022.11a
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• pp.33-34
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• 2022

The purpose of this study was to provide basic data for applying oyster shells and egg shells as fireproof cladding materials by substituting fine aggregates for oyster shell powder and egg shell powder, and comparing strength and fire resistance performance. The reason for the high strength was thought to be that the oyster shell had higher strength than the egg shell itself, and both ESP and OSP were measured at a backside temperature of less than 500℃, so it was judged that it could be used as a fireproof coating for steel structures.