• Title/Summary/Keyword: BN

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Boron Nitride Films Grown by Low Energy Ion Beam Assisted Deposition

  • Park, Young-Joon;Baik, Young-Joon;Lee, Jeong-Yong
    • The Korean Journal of Ceramics
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    • v.6 no.2
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    • pp.129-133
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    • 2000
  • Boron nitride films were synthesized with $N_2$ion flux of low energy, up to 100 eV, at different substrate temperatures of no heating, 200, 400, 500, and $800^{\circ}C$, respectively. Boron was supplied by e-beam evaporation at the rate of $1.5\AA$/sec. For all the conditions, hexagonal BN (h-BN) phase was mainly synthesized and high resolution transmission electron microscopy (HRTEM) showed that (002) planes of h-BN phase were aligned vertical to the Si substrate. The maximum alignment occurred around $400^{\circ}C$. In addition to major h-BN phase, transmission electron diffraction (TED) rings identified the formation of cubic BN (c-BN) phase. But HRTEM showed no distinct and continuous c-BN layer. These results suggest that c-BN phase may form in a scattered form even when h-BN phase is mainly synthesized under small momentum transfer by bombarding ions, which are not reconciled with the macro compressive stress model for the c-BN formation.

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Improved Thermal Conductivities of Epoxy Resins Containing Surface Functionalized BN Nanosheets

  • Weng, Ling;Wang, HeBing;Zhang, Xiaorui;Liu, Lizhu;Zhang, Hexin
    • Nano
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    • v.13 no.11
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    • pp.1850133.1-1850133.9
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    • 2018
  • The hexagonal boron nitride nanosheets (BN) were firstly treated by silane coupling agents 3-aminopropyltriethoxysilane (KH550) and 3-glycidoxypropyl-trimethoxysilane (KH560) to introduce some amino and epoxy (EP) groups on the BN surface. These modified BN nanosheets were incorporated into an EP matrix to prepare BN@KH560/EP composites with excellent thermal conductivity and electrical insulation properties. Results showed that the thermal conductivity of BN@KH560/EP composite with 20 vol% BN dosage was found to be 0.442 W/($m{\cdot}K$), which was 81% higher than that of pure EP resin. Both BN/EP composites treated by KH550 and KH560 showed rather good electrical insulation properties, although the dielectric constant of BN@KH550/EP composites were slightly higher than BN@KH560/EP composites. Moreover, BN@KH560/EP composites also showed better thermal and mechanical properties than that of BN@KH550/EP composites.

Molecular Mapping of the Blast Resistance Loci in the Durable Resistance Japonica Rice Cultivar, Palgong (도열병 내구 저항성 자포니카 벼품종 팔공의 저항성 관련 유전좌위 분석)

  • Baek, Man-Kee;Cho, Young-Chan;Park, Hyun-Su;Jeong, Jong-Min;Kim, Woo-Jae;Nam, Jeong-Kwon;Kim, Choon-Song;Kwon, Soon-Wook;Kim, Bo-Kyeong
    • Korean Journal of Breeding Science
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    • v.51 no.4
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    • pp.395-403
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    • 2019
  • Rice blast caused by the fungus Magnaporthe grisea (anamorphic: Pyricularia oryzae) is an important disease in rice and development of resistant varieties to blast is one of the most important goals in rice breeding programs. A japonica rice variety, Palgong, has shown resistance to the Korean blast pathogen since it was developed in 1996. Nine blast resistance quantitative trait loci (QTLs) in Palgong alleles were identified on chromosomes 2, 4, 7, and 11. Four QTLs of qBn2.3, qBn4.2, qBn11.1, and qBn11.2 explained 28-56.7% of total phenotypic variation, while five QTLs of qBn2.2, qBn2.4, qBn4.1, qBn7.1, and qBn7.2 explained 9.7-18.8%. In a previous study, one to four resistance genes were located on the loci qBn2.2, qBn2.3, qBn4.2, qBn11.1, and qBn11.2, however, resistance genes were not located on the loci qBn2.4, qBn4.1, and qBn7.1. A major QTL, qBn11.2, explaining 56.7% of total phenotypic variation was related to the durable resistance of Palgong. Additionally, rice stripe virus resistance of Palgong was assumed to be based on the Stvb-i gene, which is located on a major QTL qBn11.2.

BN 코팅층의 광학 특성에 관한 연구

  • 김경태;이성훈;이건환
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2002.05a
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    • pp.12-12
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    • 2002
  • hexagonal Boron Nitride (hBN), rhombohedral Boron Nitride (rBN)과 고밀도의 wurzitic Boron N Nitride (wBN), cubic Boron Nitride (cBN) 등의 다양한 상을 갖는 Boron nitride는 그 결정구조에 따라 저밀도, 고밀도 박막으로 분류되며 이중 hBN과 rBN은 층간 결합이 약한 $sp^2$ 결합특성을 가지고, wBN 과 cBN은 강한 $sp^3$ 결합특성을 가지고 있다. 현재까지 $sp^3$결합을 갖는 BN의 우수한 특성을 응용하기 위한 수 많은 연구들이 있어왔다. 특히 cBN은 다이아몬드에 버금가는 높은 경도뿐만 아니라 높은 화 학적 안정성 및 열전도성 등 우수한 물리화학적 특성을 가지고 있어 마찰.마모, 전자, 광학 등의 여러 분야에서의 산업적 응용이 크게 기대되고 있다. 그러나 이와 같이 BN박막의 기계적 물성과 관련한 연 구는 많이 진행되어 왔으나 전기.전자적, 광학적 특성에 관한 연구는 미비한 실정이다. 따라서 본 연구에서는 BN박막의 또 다른 웅용 분야를 탐색하고자 ME - ARE (Magnetically Enhanced A Activated Reactive Evaporation)법 에 의 해 합성 된 BN박막의 광학적 특성 에 관하여 조사하였다. BN박 막합성 은 전자총에 의 해 증발된 보론과 질소.아르곤 플라즈마의 활성 화반응증착(Activated Reactive E Evaporation)에 의해 이루어졌다. 기존의 ARE장치와 달리 열음극(hot cathode)과 양극(anode)사이에 평 행자기장을 부가하여 플라즈마의 증대시켜 반웅효율을 높였다. 합성실험용 모재로는 기본적인 특성 분 석을 위해 p-type으로 도핑된 (100) Si웨이퍼를 $30{\times}40mm$크기로 절단 후, 10%로 희석된 완충불산용액 에 10분간 침적하여 표면의 산화층을 제거한 후 사용하였으며, 광학특성 분석을 위해 $30{\times}30mm$의 glass를 아세톤으로 탈지.세척한 후 사용하였다. 박막합성실험에서 BN의 광학적 특성에 미치는 공정변수의 영향을 파악하기 위하여, 기판바이어스 전압, discharge 전류, $Ar/N_2$가스 유량비 등을 달리하여 증착하였다. 증착된 박막은 FTIR 분석을 통하 여 결정성을 확인하였으며, AFM 분석을 통하여 코팅층의 두께를 측정하였고, UV - VIS spectormeter를 이용하여 투광특성을 평가하였다.

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Stabilization of cubic-BN/hexagonal-BN Mixed Films by Post-Annealing (후 열처리에 의한 cubic-BN 상과 hexagonal-BN상 혼합 막의 안정성 향상)

  • 박영준;최제형;이정용;백영준
    • Journal of the Korean Vacuum Society
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    • v.9 no.2
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    • pp.155-161
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    • 2000
  • BN films composed of c-BN(70%) and h-BN(30%) phases have been synthesized by the ion beam assisted deposition (IBAD) process and stabilized by post-annealing. Boron was e-beam evaporated at 1.2 $\AA$/sec and nitrogen was ionized and accelerated at about 100 eV by the end-hall type ion gun. Substrates were negatively biased by DC 400 and 500 V, respectively, and heated at $700^{\circ}C$. Synthesized BN films were in-situ post-annealed at 700 or $800^{\circ}C$, respectively, for 1 hr without breaking vacuum. BN films without post-annealing were peeled off from substrates immediately when they were exposed to the air while those with post-annealing at $800^{\circ}C$ were stabilized. Post annealing reduced the film stress from 4.9 GPa to 3.4 GPa, but no considerable stress release in the c-BN phase was observed, contrary to previous reports that the stress relaxation in the c-BN phase is the main mechanism for the stabilization. Structural and chemical relaxation of non c-BN phase is supposed to be responsible for the film stress reduction and, in turn, stabilization, especially when the c-Bn content of the film is not high.

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Boron Nitride Dispersed Nanocomposites with High Thermal Shock Resistance

  • Kusunose, T.;Sekino, T.;Choa, Y.H.;Nakayama, T.;Niihara, K.
    • Journal of Powder Materials
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    • v.8 no.3
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    • pp.174-178
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    • 2001
  • The microstructure and mechanical properties of $Si_3N_4/BN $nanocomposites synthesized by chemical processing were investigated. The nanocomposites containing 15 vol% hexagonal BN (h-BN) were fabricated by hot-pressing $\alpha-Si_3N_4$powders covered with turbostratic BN (t-BN). The t-BN coating on $\alpha-Si_3N_4$particles was prepared by heating $\alpha-Si_3N_4$ particles covered with a mixture of boric acid and urea in hydrogen gas. TEM observations of this nanocomposite revealed that nano-sized h-BN particles were homogeneously dispersed within $Si_3N_4$grains as well as at grain boundaries. The strength and thermal shock resistance were significantly improved in comparison with the $Si_3N_4/BN$ microcomposites.

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High Efficient Cylindrical Grinding of Ferrous Materials Using Electrolytic In-process Dressing Method(ELID) (전해 인프로세스 드레싱법(ELID)을 이용한 철강재료의 고능률 원통연삭)

  • Lee, Deug Woo;Takahashi, I.;Ohomori, H.;Nakagawa, T.
    • Journal of the Korean Society for Precision Engineering
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    • v.12 no.8
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    • pp.99-105
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    • 1995
  • This paper provides a highly efficient grinding for ferrous materials using ELID-grinding method. The grinding efficiency using ELID gring method with CIFB-cBN wheel and CB-cBN wheel is compared with general grinding method with V-cBN wheel. This paper measured grinding ratio for plunge grinding and grinding resistance for traverse grinding in order to investigate grinding ability. The results show that ELID grinding methods is useful for the high efficient grinding of ferrous materials.

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Various Biological Activities of Ramie (Boehmeria nivea)

  • Lee, Ah Young;Wang, Xiaoning;Lee, Dong Gu;Kim, Young-Mi;Jung, Yong-Su;Kim, Ho Bang;Kim, Hyun Young;Cho, Eun Ju;Lee, Sanghyun
    • Journal of Applied Biological Chemistry
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    • v.57 no.3
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    • pp.279-286
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    • 2014
  • The purpose of this study was to evaluate the biological activities of extracts of ramie (Boehmeria nivea (L.) Gaud.), hereafter referred to as Bn. Bn extracts from various collecting area were extracted with methanol. Two extracts from our study, Bn-13 and -82, showed significant antioxidant properties, likely due to their ability to scavenge free radicals. In addition, Bn extracts showed stronger anti-bacterial activity against Escherichia coli (Bn-40), Stapylococcus aureus (Bn-33), and Helicobacter pylori (Bn-05). In addition, this study was conducted to evaluate the anti-inflammatory effects of Bn extracts in lipopolyssacharide (LPS)- and interferon-${\gamma}$ (IFN-${\gamma}$)-stimulated RAW 264.7 macrophages cells. Bn-37 significantly inhibited the production LPS/IFN-${\gamma}$-induced nitric oxide. The most noteworthy anti-cancer effect was found in Bn-23. Bn-08 showed inhibition of aldose reductase. This study provides basic information for the development of functional foods.

Ab Initio Investigations of Shapes of the h-BN Flakes on Copper Surface in Relation to h-BN Sheet Growth

  • Ryou, Junga;Hong, Suklyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.210.1-210.1
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    • 2014
  • The hexagonal boron nitride (h-BN) sheet, a 2D material like graphene sheet, is comprised of boron and nitrogen atoms. Similar to graphene, h-BN sheet has attractive mechanical properties while it has a wide band gap unlike graphene. Recently, many experimental groups studied the growth of single BN layer by chemical vapor deposition (CVD) method on the copper substrate. To study the initial stage of h-BN growth on the copper surface, we have performed density functional theory calculations. We investigate several adsorption sites of a boron or nitride atom on the Cu surfaces. Then, by increasing the number of adsorbed B and N atoms, we study formation behaviors of the BN flakes on the surface. Several types of BN flakes atoms such as triangular, linear, and hexagonal shapes are considered on the copper surface. We find that the formation of the BN flake in triangular shape is most favorable on the surface. On the basis of the theoretical results, we discuss the growth mechanism of h-BN layer on the copper surfaces in terms of its shapes in the initial stage of growth.

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Effect of Boron Nitride on Mechanical Properties, Thermal and Electrical Conductivities of Carbon Fiber Reinforced Plastics (탄소섬유강화 복합소재의 열적, 전기적, 기계적 특성에 대한 질화붕소 첨가제의 효과)

  • Hong, Hyunkee;Bae, Kwak Jin;Yu, Jaesang
    • Composites Research
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    • v.33 no.3
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    • pp.153-160
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    • 2020
  • In this paper, hexagonal boron nitride (h-BN) particles were added between the sheets of prepreg, and the effect of on many properties of BN-embedded carbon fiber reinforced plastics was investigated. The amount of BN particles which corresponds with 0 to 15 wt% of total resin weight was used as an additive material. The tensile strength and the inter-laminar shear strength of BN-embedded CFRP samples were improved by maximally 13.6%, and 6.7%, respectively. The tendency changes of thermal, electrical conductivities and the morphology of cross-section of CFRPs were also observed. This study suggests the possibility of controlling the characteristics of carbon fiber-BN-epoxy composites to use for aerospace applications.