• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.4
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• pp.1-1
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• 2001

본 논문에서는 μspring 패키지의 구조와 제조공정을 소개하고, 전기적 특성을 μBGA와 비교 분석한 결과를 제시하였다. μBGA에서와 같이 μSpring 패키지의 연결선 인덕턴스 값은 기존의 TSOP 패키지의 반 이하로서 월등한 고속 신호 전달 특성을 제공하게 된다. 또한 μSpring CSP 패키지의 경우 가장 열악한 substrate trace를 가진 핀에서도 2.9nH로 평가되어, Rambus DRAM module의 인덕턴스 규격 상한 값 4nH에 비하여, 약 25% 정도의 margin을 제공한다. μSpring CSP패키지는 μBGA의 약 50%의 제조 비용으로서 μBGA가 만족시키지 못하는 JEDEC Level 1 규격을 충족시킬 뿐만 아니라, thermal cycle 1000회를 통과하는 높은 신뢰성을 제공하여 강력한 경쟁력을 가진다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.4
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• pp.243-250
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• 2001

This paper presents the structure of a $\mu$Spring package, its fabrication process and an analysis of its electrical characteristics compared to that of a $\mu$BGA. It was found that both $\mu$BGA and $\mu$Spring packages provide with outstanding high speed signal transmission characteristics due to their lower inductance of package interconnection lines, smaller than half of inductance of TSOP package lines. Even the worst case substrate trace of a Rambus DRAM $\mu$Spring package yields the line inductance of 2.9nH, which provides with 25% margin compared to the Rambus DRAM specification of 4nH. The fabrication cost of $\mu$Spring package is lower than that of $\mu$BGA by 50%, passes 1000 thermal cycles, meets JEDEC Level 1 specification whereas $\mu$BGA does not, and thereby yields high reliability and strong competing power.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.12C
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• pp.1157-1164
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• 2006

In this paper, we proposed a method for measuring accurate positions and sizes of package and balls in a micro BGA. To find defects of BGA accurately, we focused on finding positions of package and balls. After labeling, we detected connected components of package and balls using feature parameters. After the detection of package component, we measured position and size of package by employing rectangular model which was constructed by the package information. After the detection of the ball components, we measured positions and diameters of balls by employing circular models which were constructed by the ball informations. We did calibration based on landmarks to measure real length, and we compared the measured results with the SEM data. Finally, we found that the accuracy of the proposed method is 94% in terms of ball's radius.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.15-20
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• 2017

Recently, with the development of the IT industry, interest in computer convergence technology is increasing in various fields. Especially, in the semiconductor field, a vision system that uses a camera and computer convergence is often used to inspect semiconductor device defects in the production process. Various systems have been studied to remove noise, which is a major cause of degradation in processing of data related to these image processing systems. In this paper, we try to detect defects in BGA (Ball Grid Array) package devices by recognizing defects in advance during mass production. We propose a measurement system using a Gaussian filter, a Median filter, and an Average filter, which are widely used for noise reduction of image data Applying the proposed system to the manufacturing process of the BGA package can be used to judge whether the defect is good or not, and it is expected that productivity will be improved.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.1-9
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• 2001

This paper proposes an inspection algorithm for micro ball grid array ($\mu$BGA) solder balls. This algorithm is motivated by the difficulty of finding defect balls by human visual inspection due to their small dimensions. Specifically, it is developed herein an automated vision-based inspection algorithm for $\mu$BGA's, which can inspect solder balls not only for so-called two dimensional errors, such as missings, positions and sizes, but also for height errors. The inspection algorithm uses two dimensional images of $\mu$BGA obtained through special blue illumination, and processes them with a rotation-invariant sub algorithm. It can also detect height errors when a two-camera system is available. Simulation results show that the proposed algorithm is more efficient in detecting ball defects compared with the conventional algorithms.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 2002.11a
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• pp.305-310
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• 2002

최근 첨단 반도체 패키지 공정에서는 전극형성 공정에 BGA package 시스템이 도입되고 있으며 BGA package은 잔존 flux 및 이물질의 제거공정이 필수적이다. 잔존하는 flux는 세척이 제대로 이루어지지 않을 경우 solder ball들이 고온 또는 습도에 노출되었을 때 lead, circuit board 등의 부식과 conductor Insulation 수축의 원인이 된다.(중략)

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.20 no.6
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• pp.26-34
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• 2006

In this paper, We proposed he algorithm for defect extraction and a study of the stereo image modeling o inspect defect for the ball height of BGA(ball grid way) device using 2-dimensional images captured by the BGA device of using the high resolution CCD cameras. This paper propose the package/ball area extraction of BGA device part, the FOV(field of view) calibration part, the top point matching part, and ball height measurement method. Each BGA device propose extraction method by defect, Through the experiment, we verified the result.

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.243-246
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• 1999

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.1-9
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• 2002

The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.