• Journal of the Korean Institute of Intelligent Systems
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• v.11 no.9
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• pp.833-836
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• 2001

One of the most important technology in Factory Automation and Unmanned Automation is to construct the diagnostic system for manufacturing process. To improve the productivity in cutting process, the state of tools such as bite, drill, endmill should be monitored continuously. In this study, fuzzy logic was used to check the wear of drill in drilling process. The input variables to construct the fuzzy rules are cutting force and the rate of cutting force's change. The experiment was done with the fixed spindle speed and feed rate in cutting condition. The proposed algorithm is verified by comparing Fuzzy wear with real wear measured.

• Journal of IKEEE
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• v.22 no.4
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• pp.959-964
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• 2018

In this study, a study is conducted on a monitoring system that can control the environment of plants using sensors in conjunction with the LED light system and the plant growth control system. To verify the performance of the developed plant growth system, an experiment was conducted on the characteristics of energy efficiency, data transmission rate, and light volume control. The experiment resulted in a satisfactory result by controlling more than 80% energy efficiency, 1Mb/sec wireless communication speed, and 5 levels of optical control. The proposed system can be applied to LED plant facilities and will contribute to the automation of agriculture by organizing an automated system for production efficiency and labor cost reduction for future commercialization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of Korean Institute of Industrial Engineers
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• v.26 no.4
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• pp.376-383
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• 2000

A flexible disk grinding process model has been implemented with varying disk orientation with respect to workpiece surface along with variable feed rate. Before implementing arbitrary disk orientation and translation, disk angle and feed rate variation have been implemented. The disk angle was changed with constant angular velocity only in the entrance stage. The effect of the variable feed rate was added to the geometric schematic. The feed rate was changed either from the entrance stage or from the between edges stage and process performance was evaluated. Effect of changing both angle end feed rate has been also analyzed. Disk trend showing actual disk deflection has also been visualized.

• Journal of Power Electronics
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• v.18 no.5
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• pp.1608-1617
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• 2018

The rapid and correct isolation of faulty submodules (SMs) is of great importance for improving the reliability of modular multilevel converters (MMCs). Therefore, a fast diagnosis method containing fault detection and fault location determination was presented in this paper. An improved incremental predictive model of arm current was proposed to detect failures, and the multi-step prediction method was used to eliminate the negative impact of disturbances. Moreover, a control method was proposed to strengthen the fault characteristics to rapidly locate faulty arms and faulty SMs by detecting the variation rate of the SM capacitor voltage. The proposed method can rapidly and easily locate faulty SMs under different load conditions without the need for additional sensors. The experimental results have validated the effectiveness of the proposed method by using a single-phase MMC with four SMs per arm.

• Mycobiology
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• v.30 no.4
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• pp.228-232
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• 2002

This study focused on the production of high quality compost for the growth of aero-thermophilic fungi, which has a promoting effect on the growth rate and production of oyster mushrooms. The automated solid-state bioreactor system was designed on the basis of a Three-Phase-One system, which controls the serial steps of prewetting, pasteurization and fermentation processes. High numbers of thermophilic fungi and bacteria were recovered from the mushroom composts prepared by this solid-state bioreactor. The rates of composting process were depended on physical as well as chemical factors. Among these factors, the parameters of moisture content and temperature were found to be particularly important. In our automated system, constant levels of moisture content, temperature and ventilation via mixing were provided by a centralized control apparatus including PLC, water tank and water jacket systems. These features induced higher microbiological activity of aero-thermophiles.

• Journal of Biosystems Engineering
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• v.25 no.1
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• pp.63-70
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• 2000

In Korea, researches for year-round leaf vegetables production system are in progress and the most of them are focused on environment control. Automation technologies for harvesting , transporting and grading need to be developed. This study was conducted to develop harvesting process automation system profitable to a competitive price. 1. Manipulator and end-effector are to be designed and fabricated , and fuzzy logic controller for controlling these are to be composed. 2. The entire system constructed is to be evaluated through a performance test. A robot system for harvesting a lettuce was developed. It was composed of a manipulator with 20DOF (degrees of freedom) an end-effector, a lettuce feeding conveyor , an air blower , a machine vision device, 6 photoelectric sensors and a fuzzy logic controller. A fuzzy logic control was applied to determined appropriate grip force on lettuce. Leaf area index and height index were used as input parameters, and voltage was used as output parameter for the fuzzy logic controller . Success rate of the lettuce harvesting system was 93.06% , and average harvesting time was about 5 seconds per lettuce.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 1996.10a
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• pp.123-128
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• 1996

In this paper, a fuzzy controller is proposed for the operation of stoker-type refuse incinerator with many kinds of uncertain factors. To build the exact mathematical model is very difficult because of the variation of physical/chemical properties of refuse as a fuel and the complexity of the combusiton process. The fuzzy controller consists of fuzzy sensor, fuzzy decision maker and tracking part. The rules based on the professional operators empirical knowledge are made for the control of the boiler evaporation rate, emission gas and refuse throughput. For the performance measure of the proposed fuzzy controller, the model of the incinerator is constructed and the simulation results are given.

• Proceedings of the KIEE Conference
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• 1995.07b
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• pp.482-484
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• 1995

This paper proposes an expert system with improved heuristics in order to enhence convergence rate to the optimal solution when an emergence problem occurrs in the automated large scale distribution system. These heurictics, which a re obtained from the line loss and load balancing change after a line section transferred, are newly adopted for the emergence problem.