• 제목/요약/키워드: Automatic Defect Detection

검색결과 68건 처리시간 0.025초

Automatic Defect Detection from SEM Images of Wafers using Component Tree

  • Kim, Sunghyon;Oh, Il-seok
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권1호
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    • pp.86-93
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    • 2017
  • In this paper, we propose a novel defect detection method using component tree representations of scanning electron microscopy (SEM) images. The component tree contains rich information about the topological structure of images such as the stiffness of intensity changes, area, and volume of the lobes. This information can be used effectively in detecting suspicious defect areas. A quasi-linear algorithm is available for constructing the component tree and computing these attributes. In this paper, we modify the original component tree algorithm to be suitable for our defect detection application. First, we exclude pixels that are near the ground level during the initial stage of component tree construction. Next, we detect significant lobes based on multiple attributes and edge information. Our experiments performed with actual SEM wafer images show promising results. For a $1000{\times}1000$ image, the proposed algorithm performed the whole process in 1.36 seconds.

AOI 데이터를 이용한 효과적인 Defect Size Distribution 구축방법: 반도체와 LCD생산 응용 (Effective Construction Method of Defect Size Distribution Using AOI Data: Application for Semiconductor and LCD Manufacturing)

  • 하정훈
    • 산업공학
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    • 제21권2호
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    • pp.151-160
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    • 2008
  • Defect size distribution is a probability density function for the defects that occur on wafers or glasses during semiconductor/LCD fabrication. It is one of the most important information to estimate manufacturing yield using well-known statistical estimation methods. The defects are detected by automatic optical inspection (AOI) facilities. However, the data that is provided from AOI is not accurate due to resolution of AOI and its defect detection mechanism. It causes distortion of defect size distribution and results in wrong estimation of the manufacturing yield. In this paper, I suggest a size conversion method and a maximum likelihood estimator to overcome the vague defect size information of AOI. The methods are verified by the Monte Carlo simulation that is constructed as similar as real situation.

국부 이진 패턴 분석에 기초한 지절 결함 검출 시스템 구현 (Implementation of Paper Cutting Defect Detection System Based on Local Binary Pattern Analysis)

  • 김진수
    • 한국정보통신학회논문지
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    • 제17권9호
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    • pp.2145-2152
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    • 2013
  • 제지 제조 산업은 대규모 설비가 요구되는 장치산업으로서 생산 설비의 자동화가 꼭 요구된다. 특히 제조공정의 효율성을 얻기 위해서는 제지 제조 공정 중에서 발생하는 지절의 결함을 효과적으로 검출하고 이를 분류하는 효율적인 요소 기술을 필요로 한다. 본 논문에서는 기존의 제지 제조 공정 방식의 문제점을 제시하고, 이를 효과적으로 개선하기 위하여 국부 이진 패턴 분석에 의한 지절 결함 검출 시스템을 제안하고 구현된 결과를 제시한다. 제안한 시스템은 제지 지절 결함에 대해 국부 이진 패턴 분석법을 이용하여 분류하고 이를 인식하는 방식으로 구성된다. 제안된 시스템은 에지형과 영역형 결함으로 지절 결함으로 분류하고, 현장 시스템에 설치되어 안정적인 결과를 보임이 검증되었다.

Automatic Detection Method for Mura Defects on Display Films Using Morphological Image Processing and Labeling

  • Cho, Sung-Je;Lee, Seung-Ho
    • 전기전자학회논문지
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    • 제18권2호
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    • pp.234-239
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    • 2014
  • This paper proposes a new automatic detection method to inspect mura defects on display film surface using morphological image processing and labeling. This automatic detection method for mura defects on display films comprises 3 phases of preprocessing with morphological image processing, Gabor filtering, and labeling. Since distorted results could be obtained with the presence of non-uniform illumination, preprocessing step reduces illumination components using morphological image processing. In Gabor filtering, mura images are created with binary coded mura components using Gabor filters. Subsequently, labeling is a final phase of finding the mura defect area using the difference between large mura defects and values in the periphery. To evaluate the accuracy of the proposed detection method, detection rate was assessed by applying the method in 200 display film samples. As a result, the detection rate was high at about 95.5%. Moreover, the study was able to acquire reliable results using the Semu index for luminance mura in image quality inspection.

비파괴 검사를 위한 개선된 퍼지 이진화와 명암 대비 스트레칭을 이용한 세라믹 영상에서의 결함 영역 자동 검출 (Automatic Defect Detection using Fuzzy Binarization and Brightness Contrast Stretching from Ceramic Images for Non-Destructive Testing)

  • 김광백;송두헌
    • 한국정보통신학회논문지
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    • 제21권11호
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    • pp.2121-2127
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    • 2017
  • 본 논문에서는 세라믹 소재의 영상에서 비파괴 검사를 위한 사람 눈으로 판단하기 어려운 결함 영역을 검출하기 위해 다양한 영상 처리 기법을 활용하여 자동으로 결함 의심 부분을 검출하는 방법을 제안한다. 제안된 방법은 명암도의 차이를 통해 배경이 제거된 관심 영역에서 개선된 명암 대비 스트레칭 기법을 적용하여 관심 영역의 명암 대비를 강조한다. 우리가 제안한 방법은 다양한 두께의 세라믹 소재 영상에 대해 안정적으로 결함을 추출하기 위해 설계되었다. 실험은 명암이 강조된 ROI 영역에서 8, 10, 11, 16, 22mm 영상의 결함 영역 검출을 실험했는데 다른 경우는 히스토그램 이진화 기법을 적용하여 결함의 후보 영역을 추출하지만 8mm 영상은 다른 영상에 비해 결함의 밝기값과 잡음의 밝기값이 유사하여 허위 양성 영역이 결함으로 추출되는 문제점이 발생한다. 이 문제를 해결하기 위해 8mm는 개선된 퍼지 이진화 기법을 적용하여 결함 후보 영역을 추출한다. 제안된 방법을 다섯 종류의 세라믹 영상을 대상으로 실험한 결과, 제안된 검출 방법이 기존의 검출 방법보다 모든 두께의 세라믹 영상에서 효과적으로 결함 영역이 검출되는 것을 확인하였다.

영상기반 자동검사시스템에서 Run Length Coding을 이용한 한도 결함 검출 전처리 기법 (Ultimate Defect Detection Using Run Length Coding in Automatic Vision Inspection System)

  • 주영복;권오영;허경무
    • 전자공학회논문지SC
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    • 제49권1호
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    • pp.8-11
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    • 2012
  • 자동 결함 검사 시스템 (AVI - Automated Vision Inspection Systems)은 디지털 영상을 통하여 표면의 결함을 자동으로 검출해 주는 시스템이다. 일반적으로 AVI 시스템의 성능은 한도 결함 검출력으로 판별한다. 한도 결함이란 결함 신호가 배경신호와 매우 유사하여 명확히 결함을 검출하기 어렵다. 본 논문에서는 신호대잡음비 (SNR - Signal to Noise Ratio)를 개선할 수 있는 전처리 기법을 제안하였다. 제안된 기법은 인간 시각 시스템 (HVS - Hunman Visual System) 원리를 기반으로 하였으며 이를 RLC (Run Length Code)로 구현하였다. 실험결과 제안된 전처리 기법은 한도 결함 영상에 대해 SNR이 두 배 이상 개선되는 효과를 보였으며 이를 이용하면 AVI 시스템의 검출성능 향상을 기대할 수 있다.

배관용접부 결함검사 자동화 시스템 개발 (The Development of Automatic Inspection System for Flaw Detection in Welding Pipe)

  • 윤성운;송경석;차용훈;김재열
    • 한국공작기계학회논문집
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    • 제15권2호
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    • pp.87-92
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    • 2006
  • This paper supplements shortcoming of radioactivity check by detecting defect of SWP weld zone using ultrasonic wave. Manufacture 2 stage robot detection systems that can follow weld bead of SWP by method to detect weld defects of SWP that shape of weld bead is complex for this as quantitative. Also, through signal processing ultrasonic wave defect signal system of GUI environment that can grasp easily existence availability of defect because do videotex compose. Ultrasonic wave signal of weld defects develops artificial intelligence style sightseeing system to enhance pattern recognition of weld defects and the classification rate using neural net. Classification of weld defects that do fan Planar defect and that do volume defect of by classify.

온라인 결함계측용 협대역 제거형 공간필터의 최적설계 및 제작 (Optical Design and Construction of Narrow Band Eliminating Spatial Filter for On-line Defect Detection)

  • 전승환
    • 한국항해학회지
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    • 제22권4호
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    • pp.59-67
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    • 1998
  • A quick and automatic detection with no harm to the goods is very important task for improving quality control, process control and labour reduction. In real fields of industry, defect detection is mostly accomplished by skillful workers. A narrow band eliminating spatial filter having characteristics of removing the specified spatial frequency is developed by the author, and it is proved that the filter has an excellent ability for on-line and real time detection of surface defect. By the way,. this spatial filter shows a ripple phenominum in filtering characteristics. So, it is necessary to remove the ripple component for the improvement of filter gain, moreover efficiency of defect detection. The spatial filtering method has a remarkable feature which means that it is able to set up weighting function for its own sake, and which can to obtain the best signal relating to the purpose of the measurement. Hence, having an eye on such feature, theoretical analysis is carried out at first for optimal design of narrow band eliminating spatial filter, and secondly, on the basis of above results spatial filter is manufactured, and finally advanced effectiveness of spatial filter is evaluated experimentally.

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태양광 웨이퍼의 결함검출을 위한 자동 정밀검사 시스템 개발 (Development of Automatic Precision Inspection System for Defect Detection of Photovoltaic Wafer)

  • 백승엽
    • 한국생산제조학회지
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    • 제20권5호
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    • pp.666-672
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    • 2011
  • In this paper, we describes the development of automatic inspection system for detecting the defects on photovoltaic wafer by using machine vision. Until now, The defect inspection process was manually performed by operators. So these processes caused the produce of poorly-made articles and inaccuracy results. To improve the inspection accuracy, the inspection system is not only configured, but the image processing algorithm is also developed. The inspection system includes dimensional verification and pattern matching which compares a 2-D image of an object to a pattern image the method proves to be computationally efficient and accurate for real time application and we confirmed the applicability of the proposed method though the experience in a complex environment.

자동 표면 결함검사 시스템에서 Retro 광학계를 이용한 3D 깊이정보 측정방법 (Linear System Depth Detection using Retro Reflector for Automatic Vision Inspection System)

  • 주영복
    • 반도체디스플레이기술학회지
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    • 제21권4호
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    • pp.77-80
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    • 2022
  • Automatic Vision Inspection (AVI) systems automatically detect defect features and measure their sizes via camera vision. It has been populated because of the accuracy and consistency in terms of QC (Quality Control) of inspection processes. Also, it is important to predict the performance of an AVI to meet customer's specification in advance. AVI are usually suffered from false negative and positives. It can be overcome by providing extra information such as 3D depth information. Stereo vision processing has been popular for depth extraction of the 3D images from 2D images. However, stereo vision methods usually take long time to process. In this paper, retro optical system using reflectors is proposed and experimented to overcome the problem. The optical system extracts the depth without special SW processes. The vision sensor and optical components such as illumination and depth detecting module are integrated as a unit. The depth information can be extracted on real-time basis and utilized and can improve the performance of an AVI system.