• Title/Summary/Keyword: Au-ZnO

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Fabrication of Thin Film Inductors Using Ni-Zn Ferrite Core (Ni-Zn 페라이트 박막을 이용한 박막 인덕터의 제조)

  • Kim, Min-Heung;Yeo, Hwan-Gun;Hwang, Gi-Hyeon;Lee, Dae-Hyeong;Yun, Ui-Jun;Kim, Hyeong-Jun
    • Korean Journal of Materials Research
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    • v.6 no.1
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    • pp.22-28
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    • 1996
  • 고주파 이동통신의 효용이 증가할수록 고주파 회로에 들어가는 부품들의 소형화가 중요한 과제로 대두되고 있다. 인덕터는 전자회로에 이용되는 주요 부품의 하나이며, 현재 교주파용 소형 인덕터를 박막화하려는 시도가 진행중이다. 본 연구에서 열산화시킨 Si(100)기판위에 성공적으로 박막형 인덕터를 제조하였다. Core 물질로는 ion beam sputtering 법으로 증착한 Ni-Zn 페라이트와 PECVD법으로 증착한 SiO2를 사용하였다. 고온산화분위기의 박막 증착과정을 고려하여 귀금속류인 Au를 전극으로 이용하였으며, life-off법으로 미세회로를 구현하였다. 상하부 전극의 안정적인 연결을 위하여 2차 전극배선 전에 via를 채워넣었다. 제조된 박막 인덕터의 고주파 특성은 network analyzer로 측정한 후 HP사의 Mecrowave Design System으로 분석하였다.

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Evaporation characteristics of materials from resistive heating sources(I) (저항가열원에 의한 물질의 증발특성(I))

  • 정재인;임병문;문종호;홍재화;강정수;이영백
    • Journal of the Korean institute of surface engineering
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    • v.24 no.1
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    • pp.25-30
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    • 1991
  • The evaporation characteristics of Ag, Al, Au, Cr. Cu, In, Mg, Mn, Pb, Pd, Si, SiO, Sn, Ti and Zn with the various resistive heating sources have been studied. The employed sources are refractory metal (Mo, Ta and W) boats, W-wire, ceramic (usually Al2O3)-coated and -barriered refractory metal boats, and special boats such as baffled boats and intermetallic boats (nitride compound and graphite). We investigated the melting mode, evaporation rate at a specific power, and lifetime of the sources. A special boat holder is also discussed which is needed to cool the sources at a large heat capacity.

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in-situ 타원해석법의 응용

  • 김상열;이순일;오수기
    • Proceedings of the Optical Society of Korea Conference
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    • 1995.06a
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    • pp.75-83
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    • 1995
  • In-situ, 실시간 측정을 위해 상업화 모형의 He-Ne 타원해석기 및 고속 분광 타원해석기(SE, Spectoscopic Ellipsometer)를 제작하였다. 후자의 경우 1024개의 화소를 가진 광학 다채널분석기 (OMA, Optical Multichannel Analyzer)를 이용한 RP형 분광타원해석기로써 1.5∼5.0eV의 측정 파장대역을 가지며, 한 스펙트럼의 측정시간은 약 100msec이다. cos 와 tanΨ의 정확도는 각각 약0.01이하로 측정되었다. 이러한 in-situ 타원해석기들을 사용하여 Au, ZnS 박막들의 성장 초기단계에서의 박막구조의 변화, 성장속도 그리고 HF식각후의 Si 자연산화층(SiO2)의 초기 성장과정을 밝히고 SiO2/c-Si 시료의 온도를 비 접촉적, 비간석적으로 기존의 방법에 의한 결과와 비교하였다.

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Ni/Au Electroless Plating for Solder Bump Formation in Flip Chip (Flip Chip의 Solder Bump 형성을 위한 Ni/Au 무전해 도금 공정 연구)

  • Jo, Min-Gyo;O, Mu-Hyeong;Lee, Won-Hae;Park, Jong-Wan
    • Korean Journal of Materials Research
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    • v.6 no.7
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    • pp.700-708
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    • 1996
  • Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.

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저온 공정 온도에서 $Al_2O_3$ 게이트 절연물질을 사용한 InGaZnO thin film transistors

  • 우창호;안철현;김영이;조형균
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.11-11
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    • 2010
  • Thin-film-transistors (TFTs) that can be deposited at low temperature have recently attracted lots of applications such as sensors, solar cell and displays, because of the great flexible electronics and transparent. Transparent and flexible transistors are being required that high mobility and large-area uniformity at low temperature [1]. But, unfortunately most of TFT structures are used to be $SiO_2$ as gate dielectric layer. The $SiO_2$ has disadvantaged that it is required to high driving voltage to achieve the same operating efficiency compared with other high-k materials and its thickness is thicker than high-k materials [2]. To solve this problem, we find lots of high-k materials as $HfO_2$, $ZrO_2$, $SiN_x$, $TiO_2$, $Al_2O_3$. Among the High-k materials, $Al_2O_3$ is one of the outstanding materials due to its properties are high dielectric constant ( ~9 ), relatively low leakage current, wide bandgap ( 8.7 eV ) and good device stability. For the realization of flexible displays, all processes should be performed at very low temperatures, but low temperature $Al_2O_3$ grown by sputtering showed deteriorated electrical performance. Further decrease in growth temperature induces a high density of charge traps in the gate oxide/channel. This study investigated the effect of growth temperatures of ALD grown $Al_2O_3$ layers on the TFT device performance. The ALD deposition showed high conformal and defect-free dielectric layers at low temperature compared with other deposition equipments [2]. After ITO was wet-chemically etched with HCl : $HNO_3$ = 3:1, $Al_2O_3$ layer was deposited by ALD at various growth temperatures or lift-off process. Amorphous InGaZnO channel layers were deposited by rf magnetron sputtering at a working pressure of 3 mTorr and $O_2$/Ar (1/29 sccm). The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. The TFT devices were heat-treated in a furnace at $300^{\circ}C$ and nitrogen atmosphere for 1 hour by rapid thermal treatment. The electrical properties of the oxide TFTs were measured using semiconductor parameter analyzer (4145B), and LCR meter.

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Occurrence and Chemical Composition of White Mica and Chlorite from Laminated Quartz Vein of Unsan Au Deposit (운산 금 광상의 엽리상 석영맥에서 산출되는 백색운모와 녹니석의 산상 및 화학조성)

  • Yoo, Bong Chul
    • Korean Journal of Mineralogy and Petrology
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    • v.34 no.1
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    • pp.1-14
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    • 2021
  • The Unsang gold deposit has been one of the three largest deposits (Daeyudong, Kwangyang) in Korea. The geology of this deposit consists of series of host rocks including Precambrian metasedimentary rock and Jurassic Porphyritic granite. The deposit consists of Au-bearing quartz veins which filled fractures along fault zones in Precambrian metasedimentary rock and Jurassic Porphyritic granite, which suggests that it is an orogenic-type deposit. Quartz veins are classified as 1) galena-quartz vein type, 2) pyrrhotite-quartz vein type, 3) pyrite-quartz vein type, 4) pegmatic quartz vein type, 5) muscovite-quartz vein type and 6) simple quartz vein type based on mineral assembles. The studied quartz vein is pyrite-quartz vein type which occurs as sericitization, chloritization and silicification. The white mica from stylolitic seams of laminated quartz vein occurs as fine or medium aggregate associated with white quartz, pyrite, chlorite, rutile, monazite, apatite, K-feldspar, zircon and calcite. The structural formular of white mica from laminated quartz vein is (K0.98-0.86Na0.02-0.00Ca0.01-0.00Ba0.01-0.00 Sr0.00)1.00-0.88(Al1.70-1.57Mg0.22-0.09Fe0.23-0.10Mn0.00Ti0.04-0.02Cr0.01-0.00V0.00Ni0.00)2.06-1.95 (Si3.38-3.17Al0.83-0.62)4.00O10(OH2.00-1.91F0.09-0.00)2.00. It indicated that white mica of laminated quartz vein has less K, Na and Ca, and more Si than theoretical dioctahedral micas. Compositional variations in white mica from laminated quartz vein are caused by phengitic or Tschermark substitution [(Al3+)VI+(Al3+)IV <-> (Fe2+ or Mg2+)VI+(Si4+)IV] and direct (Fe3+)VI <-> (Al3+)VI substitution. The structural formular of chlorite from laminated quartz vein is((Mg1.11-0.80Fe3.69-3.14Mn0.01-0.00Zn0.01-0.00K0.07-0.01Na0.01-0.00Ca0.04-0.01Al1.66-1.09)5.75-5.69 (Si3.49-2.96Al1.04-0.51)4.00O10 (OH)8. It indicated that chlorite of laminated quartz vein has more Si than theoretical chlorite. Compositional variations in chlorite from laminated quartz vein are caused by phengitic or Tschermark substitution (Al3+,VI+Al3+,IV <-> (Fe2+ or Mg2+)VI+(Si4+)IV) and octahedral Fe2+ <-> Mg2+ (Mn2+) substitution. Therefore, laminated quartz vein and alteration minerals of the Unsan Au deposit was formed during ductile shear stage of orogeny.

Towards Thermally Stable Tandem Organic Solar Cells

  • Yang, Feng;Wang, Sihan;Kim, Ji-Hwan;Kim, Yong-Sang
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.410.2-410.2
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    • 2016
  • Tandem structure is promising in organic solar cells because of its double open-circuit voltage (VOC) and efficient photon energy conversion. In a typical tandem device, the two single sub-cells are stacked and connected by an interconnecting layer. The fabrication of two sub-cells are usually carried out in a glovebox filled with nitrogen or argon gas, which makes it expensive and laborious. We report a glovebox-free fabricated inverted tandem organic solar cells wherein the tandem structure comprises sandwiched interconnecting layer based on p-doped hole-transporting, metal, and electron-transporting materials. Complete fabrication process of the tandem device was performed outside the glove box. The tandem solar cells based on poly(3-hexylthiophene) (P3HT) and (6,6)-phenyl C61-butyric acid methyl ester (PCBM) can realize a high VOC, which sums up of the two sub-cells. The tandem device structure was ITO/ZnO/P3HT:PCBM/PEDOT:PSS/MoO3/Au/Al/ZnO-d/P3HT:PCBM/PEDOT:PSS/Ag. The separate sub-cells were morphologically and thermally stable up to 160 oC. The high stability of the active layer benefits in the fabrication processes of tandem device. The performance of tandem organic solar cells comes from the sub-cells with an 50 nm thick active layer of P3HT:PCBM, achieving an average power conversion efficiency (PCE) of 2.9% (n=12) with short-circuit current density (JSC) = 4.26 mA/cm2, VOC = 1.10 V, and fill factor (FF) = 0.62. Based on these findings, we propose a new method to improve the performance and stability of tandem organic solar cells.

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Study of order-disorder transition in Pt-Ni bimetallic alloys

  • Seo, Ok-Gyun;Hwang, Jae-Seong;O, Pil-Geon;Gang, Hyeon-Cheol;Jeong, Hui-Su;Kim, -Chan;Kim, Dae-Gyun;Kim, Yun-Hui;Lee, Su-Ung;Kim, Gi-Ho;Jeong, Geon-Yeong;No, Do-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.403-403
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    • 2010
  • The Pt-Ni alloy is an electro-catalyst of interest in the low temperature direct methanol fuel cells(DMFCs). It has been already reported that the Pt-Ni alloy catalysts may even have enhanced activity compared to pure platinum catalyst, depending on how the surfaces are prepared. The order-disorder transition in bimetallic alloy such as $\beta$-CuZn, Cu3Au, and CuAu have been investigated greatly by x-ray diffraction. After annealing the bimetallic alloy, the crystal structure changes as observed in the order-disorder transition of Cu3Au which changes from the face centered cubic to a simple cubic structure. Pt-Ni bimetallic alloy has been already reported to have the face centered cubic structure. However, in nano-scale Pt-Ni bimetallic alloy crystals the crystal structures changes to a simple cubic structure. In this experiment, we have studied the order-disorder transition in Pt-Ni bimetallic nanocrystals. Pt/Ni thin films were deposited on sapphire(0001) substrates by e-beam evaporator and then Pt-Ni alloy were formed by RTA at 500, 600, and $700^{\circ}C$ in a vacuum environment and Pt-Ni nano particles were formed by RTA at $1059^{\circ}C$ in a vacuum environment. We measured the structure of Pt-Ni bimetallic alloy films using synchrotron x-ray diffraction and SEM.

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Development of Surface Plasmon Resonance Immunosensor through Metal Ion Affinity and Mixed Self-Assembled Monolayer

  • Lee, Si-Ra;Sim, Sang-Jun;Park, Chul-Hwan;Gu, Man-Bock;Hwang, Un-Yeon;Yi, Jong-Heop;Oh, Byung-Keun;Lee, Jin-Won
    • Journal of Microbiology and Biotechnology
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    • v.18 no.10
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    • pp.1695-1700
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    • 2008
  • An immunosensor based on surface plasmon resonance (SPR) with enhanced performance was developed through a mixed self-assembled monolayer. A mixture of 16-mercaptohexadecanic acid (16-MHA) and 1-undecanethiol with various molar ratios was self-assembled on gold (Au) surface and the carboxylic acid groups of 16-MHA were then coordinated to Zn ions by exposing the substrate to an ethanolic solution of $Zn(NO_3)_2\cdot 6H_2O$. The antibody was immobilized on the SPR surface by exposing the functionalized substrate to the desired solution of antibody in phosphate-buffered saline (PBS) molecules. The film formation in series was confirmed by SPR and atomic force microscopy (AFM). The functionalized surface was applied to develop an SPR immunosensor for detecting human serum albumin (HSA) and the estimated detection limit (DL) was 4.27 nM. The limit value concentration can be well measured between ill and healthy conditions.

Applications of Nanomanipulator in Nanowires (나노메니퓰레이터를 이용한 나노선의 특성평가)

  • Yoon, Sang-Won;Seo, Jong-Hyun;Ahn, Jae-Pyoung;Seong, Tae-Yeon;Lee, Kon-Bae
    • Journal of Powder Materials
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    • v.16 no.2
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    • pp.138-145
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    • 2009
  • The combination of focused ion beam (FIB) and 4 point probe nanomanipulator could make various nano manufacturing and electrical measurements possible. In this study, we manufactured individual ZnO nanowire devices and measured those electrical properties. In addition, tensile experiments of metallic Au and Pd nanowires was performed by the same directional alignment of two nanomanipulators and a nanowire. It was confirmed from I-V curves that Ohmic contact is formed between electrodes and nanomanipulators, which is able to directly measure the electrical properties of a nanowire itself. In the mechanical tensile test, Au and Pd nanowires showed a totally different fracture behavior except the realignment from <110> to <002>. The deformation until the fracture was governed by twin for Au and by slip for Pd nanowires, respectively. The crystallographic relationship and fracture mechanism was discussed by TEM observations.