• 전자공학회논문지D
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• 제35D권6호
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• pp.72-78
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• 1998

Ti:LiNbO$_3$ 광도파로위에 CPW 전극 구조를한 광변조기 내부칩을 제작한 후 일련공정에 따라 패키징 작업을 하였고 소자의 전기적특성과 광학적특성을 측정하였다. 광변조기 패키징을 위하여 페룰, 보조용 LN블럭 및 글래스, 진동 및 흡수용패드, 알루미나피더의 부분품을 사용하였으며 피그테일링, Au 와이어본딩, 에폭싱, SMA커넥팅, 실링 작업을 수행하였다. 전기적 특성에서 S/sub 21/은 -3 dB 점에서 9.8GHz의 값을, S/sub 11/은 14.4 GHz 대에서 -8.9 dB 값을 나타내었다. 광학적 특성은 제작된 광도파로가 1550nm 파장대에서 단일모드를 만족하였고, 패키지후 소자의 삽입손실은 실온에서 4.3 dB 이였으며, 소자를 온도감압챔버에 넣은후 5∼45℃까지 온도변화를 주었을 때 4.3∼6.4 dB의 삽입손실을 보였다. E-O bandwidth 응답은 3dB점에서 7.8GHz를 나타내어 10Gbps급 광통신시스템에 응용할수 있음을 확인하였다.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.61-71
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• 1999

통신분야에서 사용주파수대역의 증가, 제품의 소형화 및 가격경쟁력등의 요구에 따라 RF 소자의 패키징 기술도 플라스틱 패키지 대신에 flip chip interconnection, MCM(multichip module)등과 같은 고밀도 실장기술이 발전해가고 있다. 따라서, 본 논문은 최근 수년간 보고된 응용사례를 중심으로 RF flip chip의 기술적인 개발방향과 장점들을 분석하였고, RF 소자 및 시스템의 개발단계에 따른 적합한 적용기술을 제시하였다. RF flip chip의 기술동향을 요약하면, 1) RF chip배선은 microstrip 대신에 CPW 구조을 선택하며, 2) wafer back-side grinding을 하지 않아서 제조공정이 단순하고 wafer 파손이 적어 제조비용을 낮출 수 있고, 3) wire bonding 패키징에 비해 전기적인 특성이 우수하고 고집적의 송수신 모듈개발에 적합하다는 것이다. 그러나, CPW 배선구조의 RF flip chip 특성에 대한 충분한 연구가 필요하며 RF flip chip의 초기 개발 단계에서 flip chip interconnection 방법으로는 Au stud bump bonding이 적합할 것으로 제안한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.723-726
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• 2002

We give pressure stimulation into organic thin films and then manufacture a device under the accumulation condition that the state surface pressure is 10[mN/m]. In processing of a device manufacture, we can see the process is good from the change of a surface pressure for organic thin films and transfer ratio of area per molecule. The structure of manufactured device is Au/Poly-$\gamma$ Benzyl $_D$-Glutamate/Al; the number of accumulated layers is 1, 3, 5 and 7. Also, we then examined of the MIM device by means of I-V. The I-V characteristic of the device is measured from 0 to +2[V]. We determined electrochemical measurement by using cyclic voltammetry with a three-electrode system. LB film accumulated by monolayer on an ITO. In the cyclicvoltammetry, An Ag/AgCl reference electrode, a platinum wire counter electrode and LB film-coated ITO working electrode measured in $LiBF_4$ solution, stable up to 0.9V vs. Ag/AgCl.

• 한국표면공학회지
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• 제25권6호
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• pp.309-317
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• 1992

Evaluation of electroplated gold has been carried out to obtain the data base for electrical, mechanical and environmental properties for telecommunication component applications. Gold plating was performed to a various thickness of $0.1\mu\textrm{m}$ to 1.$25\mu\textrm{m}$ after Ni plating of $3\mu\textrm{m}$ on C52100 bronze. Electrical properties were evaluated by measuring contact resistance using 4-wire method under static contact and dynamic contact during wear. Reciprocating wear test was performed to study the wear behavior as well as failure of gold contacts. Environmental characteristics were evaluated by using salt spray testing and SO2 test. Hardness of soft gold film was measured to be 53KHN under 5g load. Friction coefficient was initially obtained to be 0.15 and 0.25 under 100g and 200g loads respectively, and then raised up to 0.8 with increasing reciprocating wear cycles. Static contact resistance was 2 to 3m$\Omega$ regardless of gold film thickness while drastic changes of contact resistance were occured upon stripping of the gold film during wear. The lifetime of contact wear showing stable contact resistance increased up to 6 times for $1\mu\textrm{m}$ thickness compared to that of$ 0.1\mu\textrm{m}$ thickness under 100g load. All gold plating appeared to be stable under salt atmosphere while only the gold plating over 1$\mu\textrm{m}$ was stable under SO2 atmosphere.

• 한국재료학회지
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• 제16권7호
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• pp.430-434
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• 2006

Au/Ni coatings are widely used in the electrical interconnect system, such as connectors, sockets and wire crimps. But due to repeated mechanical contacts, fretting corrosion occurs and causes a rapid increase in resistance. As an attempt to resolve these problem, application of Ni-P-PTFE to replace Ni undercoats was proposed, for which basic materials properties of Ni-P-PTFE coatings for preventing fretting corrosion was examined in this study. The Ni-P-PTFE coatings were formed by electroless Ni plating and PTFE coating followed by the heat-treatment. PTFE particles were found to be uniformly distributed in the Ni-P matrix. The Ni-P-PTFE coatings showed the excellent anti-adherent property with the contact angle of $104.3^{\circ}$, microhardness of 144.3 Hv comparable to that of Ni-P, and electric conductivity equivalent to that of Ni-P.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 제4회 영호남학술대회 논문집
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• pp.101-104
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• 2002

Abstract We give pressure stimulation into organic thin films and then manufacture a device under the accumulation condition that the state surface pressure is 10[mN/m]. In processing of a device manufacture, we can see the process is good from the change of a surface pressure for organic thin films and transfer ratio of area per molecule. The structure of manufactured device is Au/Poly-${\gamma}$ Benzyl $_D$-Glutamate/Al; the number of accumulated layers is 1, 3, 5 and 7. Also, we then examined of the MIM device by means of I-V. The I-V characteristic of the device is measured from 0 to +2[V]. We determined electrochemical measurement by using cyclic voltammetry with a three-electrode system. LB film accumulated by monolayer on an ITO. In the cyclicvoltammetry, An Ag/AgCl reference electrode, a platinum wire counter electrode and LB film-coated ITO working electrode measured in $LiBF_4$ solution, stable up to 0.9V vs. Ag/AgCl.

• 방송공학회논문지
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• 제25권4호
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• pp.537-544
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• 2020

본 논문에서는 FACS(Facial Action Coding System)에 기반을 둔 안드로이드 로봇 헤드의 개발을 통한 감정표현 방법을 제안한다. 안드로이드 로봇은 인간과 가까운 외모를 가진 로봇을 말하며, 인공 피부, 인공 근육을 가지고 있다. 감정 표현을 로봇으로 구현하기 위해서는 인공 근육의 개수와 배치를 정하여야 하는데 이를 위해 인간의 얼굴 움직임을 해부학적으로 분석하였다. FACS는 해부학을 기반으로 하여 표정을 만들 때의 얼굴의 움직임을 분석한 시스템이다. FACS에서는 표정은 AU(Action Unit)의 조합으로 만들어지며, 이 AU를 기반으로 로봇의 인공 근육의 수와 위치를 정하게 된다. 개발된 안드로이드 헤드는 30개의 인공 근육에 해당되는 모터와 와이어를 가지고 있으며, 표정 구현을 위한 인공 피부를 가지고 있다. 제한된 머리 공간에 많은 모터를 탑재하기 위해 spherical joint와 스프링을 이용하여 초소형 안구 모듈이 개발되었고, 와이어 경로의 효율적인 설계를 기반으로 30개의 모터가 배치되었다. 제작된 안드로이드 헤드는 30 자유도를 가지고 13개의 기본 감정 표현을 구현 가능하였고, 전시회에서 일반 관람객들을 대상으로 인식률을 평가 받았다.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP에 비해 우수한 성능은 아니지만, 저렴한 가격 때문에 많은 분야에 널리 사용되고 있습니다. 그러나, TSOP 패키지에서 몰딩공정 할 때 리드프레임의 열적 처짐 현상이 빈번하게 일어나고, 반도체 다이와 패드 사이의 Au 와이어 떨어짐 현상이 이슈가 되고 있다. 이러한 문제점을 해결하기 위해서는 리드프레임의 구조를 개선하고 낮은 CTE를 갖는 재료로 대체해야 한다. 본 연구에서는 열적 안정성을 갖도록 리드프레임 구조 개선을 위해 수치해석적 방법으로 진행하였다. TSOP 패키지에서 리드프레임의 열적 처짐은 반도체와 다이 사이의 거리(198 um~366 um)에서 안티-디플렉션의 위치에 따라 시뮬레이션을 진행하였다. 안티-디플렉션으로 TSOP 패키지의 열적 처짐은 확실히 개선되는 것을 확인 했다. 안티-디플렉션의 위치가 inside(198 um)일 때 30.738 um 처짐을 보였다. 이러한 결과는 리드프레임의 열적 팽창을 제한하는데 안티-디플렉션이 기여하고 있기 때문이다. 그러므로 리드프레임 패키지에 안티-디플렉션을 적용하게 되면 낮은 CTE를 갖는 재료로 대체하지 않아도 열적 처짐을 향상시킬 수 있음을 기대할 수 있다.

• 대한의용생체공학회:의공학회지
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• 제31권4호
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• pp.292-301
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• 2010

To restore visual sensation of blind patients, we have proposed a fully implantable retinal prosthesis comprising an three dimensionally (3D) stacked retinal chip for transforming optical signal to electrical signal, a flexible cable with stimulus electrode array for stimulating retina cells, and coupling coils for power transmission. The 3D stacked retinal chip is consisted of several LSI chips such as photodetector, signal processing circuit, and stimulus current generator. They are vertically stacked and electrically connected using 3D integration technology. Our retinal prosthesis has a small size and lightweight with high resolution, therefore it could increase the patients` quality of life (QOL). For realizing the fully implantable retinal prosthesis, we developed a retinal prosthesis module comprising a retinal prosthesis chip and a flexible cable with stimulus electrode array for generating optimal stimulus current. In this study, we used a 2D retinal chip as a prototype retinal prosthesis chip. We fabricated the polymide-based flexible cable of $20{\mu}m$ thickness where 16 channels Pt stimulus electrode array was formed in the cable. Pt electrode has an impedance of $9.9k{\Omega}$ at 400Hz frequency. The retinal prosthesis chip was mounted on the flexible cable by an epoxy and electrically connected by Au wire. The retinal prosthesis chip was cappted by a silicone to pretect from corrosive environments in an eyeball. Then, the fabricated retinal prosthesis module was implanted into an eyeball of a rabbit. We successfully recorded electrically evoked potential (EEP) elicited from the rabbit brain by the current stimulation supplied from the implanted retinal prosthesis module. EEP amplitude was increased linearly with illumination intensity and irradiation time of incident light. The retinal prosthesis chip was well functioned after implanting into the eyeball of the rabbit.

• 한국재료학회지
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• 제28권2호
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• pp.89-94
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• 2018

The properties of 18 K red gold solder alloys were investigated by changing the content of In up to 10.0 wt% in order to replace the hazardous Cd element. Cupellation and energy dispersive X-ray spectroscopy (EDS) were used to check the composition of each alloy, and FE-SEM and UV-VIS-NIR-Colormeter were employed for microstructure and color characterization. The melting temperature, hardness, and wetting angle of the samples were determined by TGA-DTA, the Vickers hardness tester, and the Wetting angle tester. The cupellation result confirmed that all the samples had 18K above 75.0wt%-Au. EDS results showed that Cu and In elements were alloyed with the intended composition without segregation. The microstructure results showed that the amount of In increased, and the grain size became smaller. The color analysis revealed that the proposed solders up to 10.0 wt% In showed a color similar to the reference 18 K substrate like the 10.0 wt% Cd solder with a color difference of less than 7.50. TGA-DTA results confirmed that when more than 5.0 wt% of In was added, the melting temperature decreased enough for the soldering process. The Vickers hardness result revealed that more than 5.0 wt% In solder alloys had greater hardness than 10.0 wt% Cd solder, which suggested that it was more favorable in making a wire type solder. Moreover, all the In solders showed a lower wetting angle than the 10.0 wt% Cd solder. Our results suggested that the In alloyed 18 K red gold solders might replace the conventional 10.0 wt% Cd solder with appropriate properties for red gold jewelry soldering.