• Journal of Mechanical Science and Technology
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• v.15 no.5
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• pp.630-638
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• 2001

The electrical resistivity of sinter dusts generated from the steel industry and coal fly ash from the coal power plant has been investigated using the high voltage conductivity cell based on JIS B 9915 as a function of temperature and water content. Dust characterization such as the chemical composition, size distribution, atomic concentration, and surface structure has been conducted. Major constituents of sinter dusts were Fe$_2$O$_3$(40∼74.5%), CaO (6.4∼8.2%), SiO$_2$(4.1∼6.0%), and unburned carbon (7.0∼14.7%), while the coal fly ash consisted of mainly SiO$_2$(51.4%), Al$_2$O$_3$(24.1%), and Fe$_2$O$_3$(10.5%). Size distributions of the sinter dusts were bi-modal in shape and the mass median diameters (MMD) were in the range of 24.7∼137㎛, whereas the coal fly ash also displayed bi-modal distribution and the MMD of the coal fly ash was 35.71㎛. Factors affecting resistivity of dusts were chemical composition, moisture content, particle size, gas temperature, and surface structure of dust. The resistivity of sinter dusts was so high as 10(sup)15 ohm$.$cm at 150$\^{C}$ that sinter dust would not precipitate well. The resistivity of the coal fly ash was measured 1012 ohm$.$cm at about 150$\^{C}$. Increased water contents of the ambient air lowered the dust resistivity because current conduction was more activated for absorption of water vapor on the surface layer of the dust.

• Journal of the Korean Vacuum Society
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• v.10 no.2
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• pp.182-188
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• 2001

Thin films of $SiO_xC_y$ deposited by means of PECVD(plasma enhanced chemical vapor deposition) using HMDSO(hexamethyldisiloxane)/$O_2$ were characterized. The effects of deposition conditions such as RF power, oxygen flow rate and hydrogen flow rate on the chemical bond structure, atomic composition, surface roughness and wear characteristics of the films were investigated by means of FTIR, XPS, AFM and Hazemeter. The deposition rate of $SiO_xC_y$ was greater than 100 nm/min, which is relatively high rate. The XPS results showed that the carbon content in a deposited film was lower than that of previous studies where different organosilicone materials were used. The optimum wear resistance was attained when RF power was 200 Watt and oxygen flow rate was 100 sccm. This study implies that the $HMDSO/O_2$ system is effective in forming a film with a lower carbon content and good abrasion resistance.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.12
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• pp.913-919
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• 2015

A supercavitating vehicle has a speed of more than 300 km/h in water. A numerical analysis of the flow around a supercavitating vehicle must deal with a multiphase flow consisting of the water, vapor and exhaust gas because the vehicle is powered by roket propulsion. The effect of the exhaust gas on the vehicle is an important part in the study of the performance of the supercavitating vehicle. In the present study, the effect of the exhaust gas on the drag of vehicle was investigated by conducting numerical analysis. When there is no exhaust gas, drag of vehicle is affected by re-entrant. In the case with rocket propulsion, the exhaust gas reduces the influence of re-entrant. The exhaust gas also creates Mach disk and it changes drag profile.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.538-539
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• 2013

여러 장점으로 인해 OLED는 디스플레이 및 조명 등 적용분야가 넓어지고 있지만, 수분 및 산소에 취약하여 그 수명이 제한되는 단점이 있다. 이를 해결하고자 현재까지는 glass cap을 이용한 encapsulation 기술이 적용되고 있지만, flexible 기판에 적용하지 못하는 문제가 있다. 이러한 문제를 해결하고자 여러 가지 thin film encapsulation 기술이 적용되고 있으나 보다 신뢰성이 높은 기술의 개발이 절실한 때이다. Encapsulation 무기 박막 물질로서 $Si_3N_4$ 박막은 PE-CVD (Plasma Enhanced Chemical Vapor Deposition) 등의 박막 증착법을 사용한 많은 연구가 진행되어, 저온에서의 좋은 품질의 박막 증착이 가능하지만, 100도 이하의 thermal budget을 갖는 OLED Encapsulation에 사용하기에는 충분하지 않았다. CVD 박막의 특성을 더욱 개선하기 위해 최근 ALD (Atomic Layer Deposition) 방법을 통한 $Al_2O_3$ film 증착 방법이 연구되고 있지만, 낮은 증착 속도로 인해 양산에 걸림돌이 되고 있다. 본 연구에서는 또 다른 해결책으로서 Digital CVD 방법을 이용한 양질의 $Si_3N_4$ 박막의 증착을 연구하였다. 이것은 ALD 증착법과 유사하며, 1st step에서 PECVD 방법으로 4~5 ${\AA}$의 얇은 silicon 박막을 증착하고, 2nd step에서 nitrogen plasma를 이용하여 질화 반응을 진행하고, 이러한 cycle을 원하는 두께가 될 때까지 반복적으로 진행된다. 이 때 1 cycle 당 증착속도는 7 ${\AA}$/cycle 정도였다. 최적의 증착 방법과 조건으로 기존의 CVD $Si_3N_4$ 박막 대비 1/5 이하로 pinhole을 최소화 할 수는 있지만 완벽하게 제거하기는 힘든 문제가 있고, 이를 해결하기 위한 개선을 위한 접근 방법이 필요하다고 판단하였다. 본 연구에서는 무기물 박막인 carbon nitride를 이용한 SiN/C:N multilayer 증착 연구를 진행하였다. Fig. 1은 CVD 조건으로 증착된 두께 750 nm SiN film에서 여러 층의 C:N film layer를 삽입했을 때, 38 시간의 85%/$85^{\circ}C$ 가속실험에 따라 OLED의 발광 사진이다. 그림에서 볼 수 있듯이 C:N 층을 삽입하고 또한 그 박막의 수가 증가함에 따라서 OLED에 대한 encapsulation 특성이 크게 개선됨을 확인할 수 있다.

• Journal of Korean Society for Atmospheric Environment
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• v.5 no.1
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• pp.11-21
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• 1989

Atmospheric gaseous mercury was automatically measured by a mercury air monitor (Mercury monitor AM-1). The sample air was led to a scrubber and washed with buffer solution, and mercury was trapped with gold coated chromosorb P(AW) was successively eluted by heating the chromosorb and then detected by the cold vapor atomic absorption spectrophotometry. $SO_2, TSP, NO_x, CO, THC$. and some of meteorological factors were also measured simultaneously with mercury. A significant correlation between the concentration of mercury and those of 2,513 measurements, gaseous mercury concentration ranged from 4.73 to 112.8 $ng/m^3$ with an annual mean of 14.7$ng/m^3$ in urban area. At this place there was a clear seasonal variation with a maximuminDecember-January and aminimum in March-June. A secondary maximum existed in August to September. THe seasonal variation was found that the gaseous mercury in ambient air has a tendency to become low in spring and high in winter. Namely, the average of concentration in winter was about two times, 19.2 $ng/m^3$, higher than that in spring. In Seoul mercury levels on some months mainly Septermber-October increase with increasing relative humidity of the atmosphere. In Olympic park air levels were 8.2 (range 4.4-23.7)$ng/m^3$ with an coefficients of variation of 0.34 and in Seoul sports complex those were 7.7 (rnage 4.4-25.5) $ng/m^3$ with an coefficients of variation of 0.38 within the Seoul olympiad holding period of time. A significant diurnal mercury variation occurs both at the measuring sites and in the period of observation.

• Journal of Microbiology and Biotechnology
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• v.15 no.5
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• pp.1001-1010
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• 2005

Bacillus megaterium KL39, an antibiotic-producing plant growth promoting rhizobacterium (PGPR), was selected from soil. The antifungal antibiotic, denoted KL39, was purified from culture filtrate by column chromatography using Dion HP-20, Silica gel, Sephadex LH-20, and prep-HPLC. Thin layer chromatography, employing the solvent system of ethanol:ammonia:water=8:1:1, showed the $R_{f}$. value of 0.32. The antibiotic KL39 showed a negative reaction with ninhydrin solution, positive with iodine vapor, and also positive with Ehrlich reagent. It was soluble in methanol, ethanol, butanol, and acetonitrile, but insoluble in chloroform, toluene, hexane, ethyl ether, or acetone. Its UV spectrum had the maximum absorption at 208 nm. Amino acid composition, FAB-mass, $^{1}H-NMR,\;^{13}C-NMR$, and atomic analyses showed that the antibiotic KL39 (MW=1,071) has a structure very similar to iturin E. The antibiotic KL39 has a broad antifungal spectrum against a variety of plant pathogenic fungi including Rhizoctonia solani, Pyricularia oryzae, Monilinia froeticola, Botrytis cinenea, Altenaria kikuchiana, Fusarium oxysporum, and F. solani. An MIC value of $10\;{\mu}g/ml$ was determined for Phytophthora capsici. Macromolecular incorporation studies with P. capsici using radioactive [$^{3}H-adenine$] as the precursor, indicated that the antibiotic KL39 strongly inhibits the DNA biosynthesis of the fungal cell. Microscopic observation of the antifungal action showed abnormal hyphal swelling of P. capsici. The purified antibiotic KL39 was very effective for the biocontrol of in vivo Phytophthora-blight disease of pepper.

• Advances in nano research
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• v.5 no.3
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• pp.193-201
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• 2017

ZnO, ZnO: Cu, Ga, and ZnO: Cu, Ga, Ag thin films were obtained by oxidization of ZnS and ZnS: Cu, Ga films deposited onto glass substrates by electron-beam evaporation from ZnS and ZnS: Cu, Ga targets and from ZnS: Cu, Ga film additionally doped with Ag by the closed space sublimation technique at atmospheric pressure. The film thickness was about $1{\mu}m$. The oxidation was carried out at $600-650^{\circ}C$ in air or in an atmosphere containing water vapor. Structural characteristics were investigated by X-ray diffraction (XRD) and atomic force microscopy (AFM). Photoluminescence (PL) spectra of the films were measured at 30-300 K using the excitation wavelengths of 337, 405 and 457.9 nm. As-deposited ZnS and ZnS: Cu, Ga films had cubic structure. The oxidation of the doped films in air or in water vapors led to complete ZnO phase transition. XRD and AFM studies showed that the grain sizes of oxidized films at wet annealing were larger than of the films after dry annealing. As-deposited doped and undoped ZnS thin films did not emit PL. Shape and intensity of the PL emission depended on doping and oxidation conditions. Emission intensity of the films annealed in water vapors was higher than of the films annealed in the air. PL of ZnO: Cu, Ga films excited by 337 nm wavelength exhibits UV (380 nm) and green emission (500 nm). PL spectra at 300 and 30 K excited by 457.9 and 405 nm wavelengths consisted of two bands - the green band at 500 nm and the red band at 650 nm. Location and intensities ratio depended on the preparation conditions.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.7
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• pp.73-82
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• 1989

We developed a photo-CVD equipment for the deposition of silicon based insulating materials. Silicon dioxide thin films were deposited at various process conditions especially low temperature range $50-250^{\circ}C$. Low pressure mercury lamp was used in the direct excitation of $SiH_4/N_2O$ mixture gas without mercury sensitization. AES and ESCA analysis showed that oxygen to silicon atomic ratio and binding state of Si-O bond was nearly 2.0 and $SiO_2$ type, respectively. The refractive indices were measured to be 1.39-1.44, indicating that films were in relatively low density.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.422-448
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• 1996

Low-temperature epitaxial growth of Si and SiGe layers of Si is one of the important processes for the fabrication of the high-speed Si-based heterostructure devices such as heterojunction bipolar transistors. Low-temperature growth ensures the abrupt compositional and doping concentration profiles for future novel devices. Especially in SiGe epitaxy, low-temperature growth is a prerequisite for two-dimensional growth mode for the growth of thin, uniform layers. UHV-ECRCVD is a new growth technique for Si and SiGe epilayers and it is possible to grow epilayers at even lower temperatures than conventional CVD's. SiH and GeH and dopant gases are dissociated by an ECR plasma in an ultrahigh vacuum growth chamber. In situ hydrogen plasma cleaning of the Si native oxide before the epitaxial growth is successfully developed in UHV-ECRCVD. Structural quality of the epilayers are examined by reflection high energy electron diffraction, transmission electron microscopy, Nomarski microscope and atomic force microscope. Device-quality Si and SiGe epilayers are successfully grown at temperatures lower than 600℃ after proper optimization of process parameters such as temperature, total pressure, partial pressures of input gases, plasma power, and substrate dc bias. Dopant incorporation and activation for B in Si and SiGe are studied by secondary ion mass spectrometry and spreading resistance profilometry. Silicon p-n homojunction diodes are fabricated from in situ doped Si layers. I-V characteristics of the diodes shows that the ideality factor is 1.2, implying that the low-temperature silicon epilayers grown by UHV-ECRCVD is truly of device-quality.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.7
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• pp.85-94
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• 1994

A high-resolution transmission electron microscopy study of the solid phase crystallization of the amorphous silicon thin films, deposited on SiOS12T at 52$0^{\circ}C$ by low pressure chemical vapor deposition and annealed at 55$0^{\circ}C$ in a dry N$_{2}$ ambient was carried out so that the arrangement of atoms in the crystalline silicon and at the amorphous/crystalline interface of the growing grains could be understood on an atomic level. Results show that circular crystalline silicon nuclei have formed and then the grains grow to an elliptical or dendritic shape. In the interior of all the grains many twins whose{111} coherent boundaries are parallel to the long axes of the grains are observed. From this result, it is concluded that the twins enhance the preferential grain growth in the <112> direction along {111} twin planes. In addition to the twins. many defect such as intrinsic stacking faults, extrinsic stacking faults, and Shockley partial dislocations, which can be formed by the errors in the stacking sequence or by the dissociation of the perfect dislocation are found in the silicon grain. But neither frank partial dislocations which can be formed by the condensation of excess silicon atoms or vacancies and can form stacking fault nor perfect dislocations which can be formed by the plastic deformation are observed. So it is concluded that most defects in the silicon grain are formed by the errors in the stacking sequence during the crystallization process of the amorphous silicon thin films.