• Title/Summary/Keyword: Assembly block

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Fabrication of Microcapsules Encapsulating Fluorescent Nanoparticles and Visualization of Their Inclusion (형광 나노입자를 수용하는 마이크로캡슐의 제작 및 수용 가시화)

  • Kim, Eun-Young;Kim, Hyoung-Hoon;Go, Jeung-Sang
    • Journal of the Korean Society of Visualization
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    • v.9 no.2
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    • pp.16-20
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    • 2011
  • This paper presents a fabrication method of microcapsules encapsulating fluorescent nanoparticles sensitive to an organic liquid, which is potentially applicable to the encapsulation of protein, cell and drug. It uses the supra-molecular self-assembly of a block copolymer at the interface of the stable and controllable droplets of water suspended with fluorescent nanoparticles and the polymer solved organic. The size and uniformity of the microcapsules were examined for the various polymer concentrations by using SEM image analysis. The maximum standard deviation of the produced microcapsules of less than 3.5% was obtained from the microcapsules produced from the same conditions. The inclusion of fluorescent nanoparticles was visualized in the fluorescence microscope and by using TEM image. It is shown that this fabrication method can provide the uniform size microcapsules with a higher inclusion.

Ultrasound-Aided Monolayer Assembly of Spherical Silica Nanobeads

  • Yun, Sang-Hui;Yun, Seo-Yeong;Lee, Jin-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.267.1-267.1
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    • 2013
  • In modern science and technology, the organization of building blocks, such as spherical particles and zeolite, is important to form a nanostructure. So, it is essential to develop methods for organizing them into large scale for many precise applications. Up to now, reflux and stirring is widely used method for organization of colloidal particles. However, because this method is hard to organize building block with high coverage and uniform orientation, it is necessary to research another method. In this work, we synthesized spherical silica particles using St$\"{o}$ber method and organized them on the glass which is coated with 3-chloropropyltrimethoxysilane (CP-TMS) and polyethyleneimine (PEI) using Sonication method. Although spherical silica particles are difficult to attach on the glass due to their small attachment site, we improved this problem by coating PEI. We introduced two mode of reaction promotion, sonication (SO) and sonication with stacking between the bare glass (SS), and investigated degree of coverage (DOC) and degree of close packing (DCP).

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Control of Welding Distortion for Thin Panel Block Structure using Mechanical Tensioning Method (기계적 인장법을 이용한 박판 평 블록의 용접변형 제어)

  • Kim, Sang-Il
    • Journal of the Society of Naval Architects of Korea
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    • v.43 no.1 s.145
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    • pp.68-74
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    • 2006
  • The welding distortion of a hull structure in the shipbuilding industry is inevitable at each assembly stage. This geometric inaccuracy caused by the welding distortion tends to preclude the introduction of automation and mechanization and needs the additional man-hours for the adjusting work at the following assembly stage. To overcome this problem, a distortion control method should be applied. For this purpose, it is necessary to develop an accurate prediction method which can explicitly account for the influence of various factors on the welding distortion. The validity of the prediction method must be also clarified through experiments. For the purpose of reducing the weld-induced bending deflection, this paper proposes the mechanical tensioning method (MTM) as the optimum distortion control method. The validity of this method has been substantiated by a number of numerical simulations and actual measurements.

Chemoenzymatic Synthesis of Dual-responsive Amphiphilic Block Copolymers and Drug Release Studies

  • Chen, Peng;Li, Ya-Peng;Wang, Shu-Wei;Meng, Xin-Lei;Zhu, Ming;Wang, Jing-Yuan
    • Bulletin of the Korean Chemical Society
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    • v.34 no.6
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    • pp.1800-1808
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    • 2013
  • Dual-responsive amphiphilic block copolymers were synthesized by combining enzymatic ring-opening polymerization (eROP) of ${\varepsilon}$-caprolactone (CL) and ATRP of N,N-dimethylamino-2-ethyl methacrylate (DMAEMA). The obtained block copolymers were characterized by gel permeation chromatography (GPC), $^1H$ NMR and FTIR-IR. The critical micelle concentration (CMC) of copolymer was determined by fluorescence spectra, it can be found that with hydrophilic block (PDMAEMA) increasing, CMC value of the polymer sample increased accordingly, and the CMC value was 0.012 mg/mL, 0.025 mg/mL and 0.037 mg/mL for $PCL_{50}$-b-$PDMAEMA_{68}$, $PCL_{50}$-b-$PDMAEMA_{89}$, $PCL_{50}$-b-$PDMAEMA_{112}$, $PCL_{50}$-b-$PDMAEMA_{89}$ was chosen as drug carrier to study in vitro release profile of anti-cancer drug (taxol). The temperature and pH dependence of the values of hydrodynamic diameter (Dh) of micelles, and self-assembly of the resulting block copolymers in water were evaluated by dynamic light scattering (DLS). The result showed that with the temperature increasing and pH decreasing, the Dh decreased. Drug-loaded nanoparticles were fabricated using paclitaxel as model. Transmission electron microscopy (TEM) and atomic force microscopy (AFM) had been explored to study the morphology of the hollow micelles and the nanoparticles, revealing well-dispersed spheres with the average diameters both around 80 nm. In vitro release kinetics of paclitaxel from the nanoparticles was also investigated in different conditions (pH and temperature, etc.), revealing that the drug release was triggered by temperature changes upon the lower critical solution temperature (LCST) at pH 7.4, and at $37^{\circ}C$ by an increase of pH.

High Speed AES Implementation on 64 bits Processors (64-비트 프로세서에서 AES 고속 구현)

  • Jung, Chang-Ho;Park, Il-Hwan
    • Journal of the Korea Institute of Information Security & Cryptology
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    • v.18 no.6A
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    • pp.51-61
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    • 2008
  • This paper suggests a new way to implement high speed AES on Intel Core2 processors and AMD Athlon64 processors, which are used all over the world today. First, Core2 Processors of EM64T architecture's memory-access-instruction processing efficiency are lower than calculus-instruction processing efficiency. So, previous AES implementation techniques, which had a high rate of memory-access-instruction, could cause memory-bottleneck. To improve this problem we present the partial round key techniques that reduce the rate of memory-access-instruction. The result in Intel Core2Duo 3.0 Ghz Processors show 185 cycles/block and 2.0 Gbps's throughputs in ECB mode. This is 35 cycles/block faster than bernstein software, which is known for being the fastest way. On the other side, in AMD64 processors of AMD64 architecture, by removing bottlenecks that occur in decoding processing we could improve the speed, with the result that the Athlon64 processor reached 170 cycles/block. The result that we present is the same performance of Matsui's unpublished software.

Design of an ARM9 Compatible 32bit RISC Microprocessor (ARM9 호환 32bit RISC Microprocessor의 설계)

  • Hwang, Bo-Sik;Nam, Hyoung-Gin
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.885-888
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    • 2005
  • In this study, we designed an ARM9 compatible RISC microprocessor using VHDL. The microprocessor was designed to support Harvard architecture with separate instruction cache and data cache. The state machine was optimized for multi-cycle instructions. In addition, a data forwarding mechanism was adopted to reduce the stall cycles due to data hazards. Assembly programs were up-loaded into a ROM block for system-level simulation. Proper operation of the designed microprocessor was confirmed by investigating the contents of the internal registers as well as the RAM block. Futhermore, the simulation results clearly indicated that the operation speed of the processor designed in this study is enhanced by reducing the execution cycles required for multiplication related instructions.

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Numerical Analysis on Cooling Characteristics of Electronic Components Using Convection and Conduction Heat Transfer (대류와 전도 열전달을 이용한 전자부품의 냉각특성 수치해석)

  • Son, Young-Seok;Shin, Jee-Young
    • Proceedings of the KSME Conference
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    • 2001.06d
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    • pp.390-395
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    • 2001
  • Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.

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Study on the manufacturing of high-frequency heating Japanese cedar laminated board by finger jointing method (1) - Gluing characteristics of Japnese cedar board by PVAc emulsion adhesives - (핑거접합방식에 의한 삼나무의 고주파가열 집성판 제조에 관한 연구 (1) - 삼나무 판재의 초산비닐수지 접착특성 -)

  • So Won-Tek;Chai Jyung-Ki
    • Journal of the Korea Furniture Society
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    • v.16 no.1
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    • pp.1-8
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    • 2005
  • This experiment was carried out to investigate the gluing characteristics of poly vinyl acetate emulsion adhesive(PVAc) on the Cryptomeria japonica laminated boards. This sample trees are major planting species and have been planted in southern district for a long time. The optimum gluing conditions for laminated board were summarized as follows; the amount of spreading glue, assembly time, clamping pressure, and clamping time for PVAc resin were $200g/m^2$, 10min., $5kg/cm^2$, and 6hrs., respectively, and the relative formulae between extension ratio(x) and block shear strength(y) was $y=-9.6x+85.2(R^2=0.95)$.

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Application of Sensor Technology for the Efficient Positioningand Assembling of Ship Blocks

  • Lee, Sang-Don;Eun, Seong-Bae;Jung, Jai-Jin;Song, Ha-Cheol
    • International Journal of Naval Architecture and Ocean Engineering
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    • v.2 no.3
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    • pp.171-176
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    • 2010
  • This paper proposes the application of sensor technology to assemble ship blocks efficiently. A sensor-based monitoring system is designed and implemented to improve shipbuilding productivity by reducing the labor cost for the adjustment of adequate positioning between ship blocks during pre-erection or erection stage. For the real-time remote monitoring of relative distances between two ship blocks, sensor nodes are applied to measure the distances between corresponding target points on the blocks. Highly precise positioning data can be transferred to a monitoring server via wireless network, and analyzed to support the decision making which needs to determine the next construction process; further adjustment or seam welding between the ship blocks. The developed system is expected to put to practical use, and increase the productivity during ship blocks assembly.

An Assemble and Expandable Substrate Heating Apparatus for the Semiconductor Manufacturing (조립과 확장이 가능한 반도체 제조용 기판 가열 장치)

  • Jung, Soon-Won;Koo, Kyung-Wan
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.58 no.1
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    • pp.67-71
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    • 2009
  • This research is a new structure of the semiconductor substrate heating apparatus in which the assembly and expansion are possible. The fast thermo-responsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, the contact area of the sheath heater, which is the heating plate layer built-in heating apparatus, is increased, so that it has more heating valid area. There is no problem with the deformation interpreted in the state where it assembles the block of a several of the simulation result structure, the safety, and the stress. In addition, it is confirmed that building a large-size heating block is possible since the temperature deflection of the manufactured plate is lower than the standard value.