• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.77-81
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• 2006

We report the performance of a four-element, 11.67 GHz, high-Tc superconducting (HTS) microstrip antenna array with corporate feed network and circular polarization for direct broadcasting satellite (DBS) system. Our array antennas were designed and built on a 0.5 mm thick MgO substrate. To compare the superconducting antennas with normal conducting counterpart, One antenna pattern was fabricated from gold thin film, and a second pattern was fabricated from $YBa_2Cu_3O_{7-x}$ (YBCO) superconducting thin film. To improve the axial ratio of circularly polarized arrays, sequential rotation technique were used. Efficiency, radiation pattern, return loss and bandwidth were measured for both antennas at room temperature and at cryogenic temperature. The array produced good circular polarization, and the gain of the array at 77 K, relative to a copper array at room temperature was approximately 1.54 dB. The measured return loss of our HTS antenna array was 35.79 dB at the resonant frequency of 11.67 GHz and The total effective bandwidth was about 3.4 %. The results showed that high-temperature superconductors, when used in microstrip arrays, improved the efficiency of the HTS antenna array for circularly polarization.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.776-781
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• 2004

We report the performance of a four-element, 11.67 GHz, $high-{T}_c$ superconducting (HTS) microstrip antenna array with corporate feed network. The HTS antenna array used in this work had a circular polarization for direct broadcasting satellite (DBS) system. Our array antennas were designed and built on a 0.5 mm thick MgO substrate. To compare the superconducting antennas with normal conducting counterpart, One antenna pattern was fabricated from gold thin film, and a second pattern was fabricated from ${YBa}_2{Cu}_3{O}_7-x(YBCO)$ superconducting thin film. To improve the axial ratio of circularly polarized arrays, sequential rotation technique were used. Efficiency, radiation pattern, return loss and bandwidth were measured for both antennas at cryogenic temperature and room temperature. The array produced good circular polarization, and the gain of the array at 77 K, relative to a copper array at room temperature was approximately 1.54 dB. The measured return loss of our HTS antenna array was 35.79 dB at the resonant frequency of 11.67 GHz and The total effective bandwidth was about 3.4 %. The results showed that high-temperature superconductors, when used in microstrip arrays, improved the efficiency of the HTS antenna array for circularly polarization.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.12
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• pp.2311-2317
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• 2011

In this paper, we study the temperature change of a ${\mu}$-bolometer focal plane array with a capacitive transimpedance amplifier bias cancellation circuit. Thermal analysis is essential to understand the performance of a ${\mu}$-bolometer focal plane array, and to improve the temperature stability of a focal plane array characteristics. In this study, the thermal analyses of a ${\mu}$-bolometer and its two reference detectors are carried out as a function of time. The analyses are done with the $30{\mu}m$ pitch $320{\times}240$ focal plane array operating of 60 Hz frame rate and having a columnwise readout. From the results, the temperature increase of a ${\mu}$-bolometer in FPA by an incident IR is estimated as $0.689^{\circ}C$, while the temperature increase by a pulsed bias as $7.1^{\circ}C$, which is about 10 times larger than by IR. The temperature increase of a reference detector by a train of bias pulses may be increased much higher than that of an active ${\mu}$-bolometer. The suppression of temperature increase in a reference bolometer can be done by increasing the thermal conductivity of the reference bolometer, in which the selection of thermal conductivity also determines the range of CTIA output voltage.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.62-68
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• 2002

This study investigated the feasibility of penetration depth measurement using infrared temperature sensing on the weld surface. The detection point was optimized by FEM analysis in the laser keyhole welding. The profile of the weld surface temperature was measured using infrared detector array. Surface temperature behind the weld pool is proportional or exponentially proportional to penetration depth and bead width. From the results, the monitoring device of surface temperature using infrared detector array was applicable fur real time penetration depth control.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.1
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• pp.65-70
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• 2013

A 0.18-${\mu}m$ 3.3 V grounded-gate NMOS (GGNMOS) I/O cell array for timing controller (TCON) application is proposed for improving electrical overstress (EOS) robustness. The improved cell array consists of 20 GGNMOS, 4 inserted well taps, 2 end-well taps and shallow trench isolation (STI). Technology computer-aided design (TCAD) simulation results show that the inserted well taps and extended drain contact gate spacing (DCGS) is effective in preventing EOS failure, e.g. local burnout. Thermodynamic models for device simulation enable us to obtain lattice temperature distributions inside the cells. The peak value of the maximum lattice temperature in the improved GGNMOS cell array is lower than that in a conventional GGNMOS cell array. The inserted well taps also improve the uniformity of turn-on of GGNMOS cells. EOS test results show the validity of the simulation results on improvement of EOS robustness of the new GGNMOS I/O cell array.

• The Journal of the Acoustical Society of Korea
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• v.22 no.2E
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• pp.78-86
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• 2003

We analyzed the measured acoustic field to explore the characteristics of a horizontal coherence in shallow water. Signal spatial coherence data were obtained in the continental shelf off the east coast of Korea using a horizontal line array. The array was deployed on the bottom of 130 m water depth and a sound source was towed at 26 m depth in the source-receiver ranges of 1-13 ㎞. The source transmitted 200 ㎐ pure tone. Topography and temperature profiles along the source track were measured to investigate the relationship between the horizontal coherence and environment variations. The beam bearing disturbance and array signal gain degradation is examined as parameters of horizontal coherence. The results show that the bearing disturbance is about ± 8° and seems to be affected by temporal variations of temperature caused by internal waves. The array signal gains show degradation more than 5㏈ by the temporal and spatial variations of temperature and by the down-sloped topography.

• Journal of the Korean Society of Visualization
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• v.7 no.2
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• pp.17-21
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• 2010

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.186-191
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• 2008

In this study, a room temperature AMRR (Active magnetic regenerative refrigerator) was fabricated, and experimentally investigated. Gadolinium (Gd) was selected as a magnetic refrigerant with Curie temperature of 293 K. Permanent magnet was utilized to magnetize and demagnetize the AMR. To produce large magnetic field above 1 T in the magnetic refrigeration space, a special arrangement of permanent magnets, so called Halbach array, is employed. Sixteen segments of the permanent magnets magnetized different direction, constitute a hollow cylindrical shaped permanent magnet. The AMR is reciprocated along the bore of the magnet array and produces cooling power. Helium is selected as the working fluid and a helium compressor is utilized to supply helium flow to the regenerator. The fabricated AMRR has different structure and compared to a convectional AMRR since it has an additional volume after the regenerator. Therefore, the cooling ability is generated not only by magnetocaloric effect of magnetic refrigerant but also by the pulse tube effect. It is verified that the cooling ability of AMR is increased due to the magnetocalric effect by the fact that the temperature span becomes $16^{\circ}C$ while the temperature span is only $8^{\circ}C$ when the magnetic field is not applied to the regenerator.

• Journal of the Korean Society of Visualization
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• v.9 no.2
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• pp.34-39
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• 2011

This paper presents a novel direct fabrication method of the thin metal film RTD temperature sensor array on an arbitrary curved surface by using MEMS technology to measure a distributed temperature field up to $300^{\circ}C$ without disturbing a fluid flow. In order to overcome the difficulty in the three dimensional photography of sensor patterning, the UV pre-irradiated photosensitive dry film resist technology has been developed newly. This method was applied to the fabrication of the temperature sensor array on a glass tube, which is arranged parallel and transverse to a main flow. Gold was used as a temperature sensing material. The resistance change was measured in a thermally controlled oven by increasing the environmental temperature. The linear increase in resistance change and a constant slope were obtained. Also, the sensitivity of each RTD temperature sensor was evaluated.