• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.10
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• pp.1845-1852
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• 2008

The key elements of inter prediction are motion estimation(ME) and motion compensation(MC). Motion estimation is to find the optimum motion vectors, not only by using a distance criteria like the SAD, but also by taking into account the resulting number of 비트s in the 비트 stream. Motion compensation is compensate for movement of blocks of current frame. Inter-prediction Encoding is always the main bottleneck in high-quality streaming applications. Therefore, in real-time streaming applications, dedicated hardware for executing Inter-prediction is required. In this paper, we studied a motion estimator(ME) for H.264/AVC. The designed motion estimator is based on 2-D systolic array and it connects processing elements for fast SAD(Sum of Absolute Difference) calculation in parallel. By providing different path for the upper and lower lesion of each reference data and adjusting the input sequence, consecutive calculation for motion estimation is executed without pipeline stall. With data reuse technique, it reduces memory access, and there is no extra delay for finding optimal partitions and motion vectors. The motion estimator supports variable-block size and takes 328 cycles for macro-block calculation. The proposed architecture is local memory-free different from paper [6] using local memory. This motion estimation encoder can be applicable to real-time video processing.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.6
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• pp.740-747
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• 2012

An Active Electronically Scanned Array(AESA) radar required necessarily as the Fire Control Radar(FCR) of recent fighters has ununiform detection range with regard to scan angle due to scan loss. Although the compensation method of scan loss in an AESA radar with variable dwell time is investigated, the effectiveness of the method in a fighter FCR with multi-function such as search, track, and missile guidance within limited resources should be considered systematically. In this paper, uniform search performance of an AESA radar using variable dwell time with regard to scan angle is derived. We assumed the search load of 50 % for case without changing dwell time in fixed frame time and showed the fighter FCR requirement for multi-function is not satisfied because the search load for the uniform search performance should be increased by about 100 %. On the other hand, in case of increasing the frame time for the uniform search performance and search load of 50 %, degradation of the search performance is shown by 86.7 % compared with the former. Based on these analyses, the effective beam operation strategy on an airborne AESA radar with uniform search performance in whole scan area is described with consideration of frame time, search load and performance as a whole.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.49 no.2
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• pp.35-44
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• 2012

Most recent infrared (IR) sensors have a focal-plane array (FPA) structure. Spatial non-uniformity of a FPA structure, however, introduces unwanted fixed pattern noise (FPN) to images. This non-uniformity correction (NUC) of a FPA can be categorized into target-based and scene-based approaches. In a target-based approach, FPN can be separated by using a uniform target such as a black body. Since the detector response randomly drifts along the time axis, however, several scene-based algorithms on the basis of a video sequence have been proposed. Among those algorithms, the state-of-the-art one based on Kalman filter uses one-directional warping for motion compensation and only compensates for offset non-uniformity of IR camera detectors. The system model using one-directional warping cannot correct the boundary region where a new scene is being introduced in the next video frame. Furthermore, offset-only correction approaches may not completely remove the FPN in images if it is considerably affected by gain non-uniformity. Therefore, for FPN reduction in IR videos, we propose a joint correction algorithm of gain and offset based on bi-directional warping. Experiment results using simulated and real IR videos show that the proposed scheme can provide better performance compared with the state-of-the art in FPN reduction.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.2
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• pp.160-168
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• 2019

In this study, we propose a verification method for a planar-phased array radar system using a near-field beam focusing(NFBF) test method. We then confirmed the validity of the results. The proposed method can be used to verify a radar system in the near-field range of twice the antenna aperture size, and this is done in the same manner as the field system performance test conducted in a non-outdoor electromagnetic anechoic chamber. The test configuration and procedure for verifying the NFBF using near-field energies were reviewed. In addition, the phase compensation values of additional individual channels were quantified through mathematical verification of the beam-steered NFBF test. Based on a theoretical verification, the actual NFBF test was performed and the validity of the test method was confirmed through comparison with ideal analytical results.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.4B
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• pp.771-782
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• 2000

In this paper, an H.263 video codec is implemented by adopting the concept of hardware and software co-design. Each module of the codec is investigated to find which approach between hardware and software is better to achieve real-time processing speed as well as flexibility. The hardware portion includes motion-related engines, such as motion estimation and compensation, and a memory control part. The remaining portion of theH.263 video codec is implemented in software using a RISC processor. This paper also introduces efficient design methods for hardware and software modules. In hardware, an area-efficient architecture for the motion estimator of a multi-resolution block matching algorithm using multiple candidates and spatial correlation in motion vector fields (MRMCS), is suggested to reduce the chip size. Software optimization techniques are also explored by using the statistics of transformed coefficients and the minimum sum of absolute difference (SAD)obtained from the motion estimator.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2017.04a
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• pp.122-122
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• 2017

Recently, environmental problems have become an area of growing interests. In-situ monitoring of water quality is fundamental to most environmental applications. The accurate measurement of nitrate concentrations is fundamental to understanding biogeochemistry in aquatic ecosystems. Several studies have reported that one of the most feasible methods to measure nitrate concentration is the use of Ion Selective-electrodes (ISEs). The ISE application to water monitoring has several advantages, such as direct measurement methodology, high sensitivity, wide measurement range, low cost, and portability. However, the ISE methods may yield inconsistent results where there was a difference in temperature between the calibration and measurement solutions, which is associated with the temperature dependence of ionic activity coefficients in solution. In this study, to investigate the potential of using the combination of a temperature sensor and nitrate ISEs for minimizing the effect of temperature on real-time nitrate sensing in natural water, a prototype of on-site water monitoring system was built, mainly consisting of a sensor chamber, an array of 3 ISEs, an waterproof temperature sensor, an automatic sampling system, and an arduino MCU board. The analog signals of ISEs were obtained using the second-order Sallen-key filter for performing voltage following, differential amplification, and low pass filtering. The performance test of the developed water nitrate sensing system was conducted in a monitoring station of drinking water located in Jeongseon, Kangwon. A temperature compensation method based on two-point normalization was proposed, which incorporated the determination of temperature coefficient values using regression equations relating solution temperature and electrode signal determined in our previous studies.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.10 s.113
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• pp.1000-1006
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• 2006

In this paper, the gain of the square hem antenna is enhanced with $3{\times}3$ latticed aperture. In order to get the uniform field distribution on the aperture, the different thicknesses of dielectric plates for the phase compensation are inserted into the center and the edge of the aperture respectively. The proposed horn antenna is designed at 12.5 GHz band, and then the analysis of the field distribution on the aperture is performed by using FDTD method. The radiation pattern is also calculated from the analysis. Based on the measured data, it is verified that the gain of a horn antenna with latticed aperture is 18 dBi and this is 2 dB gain enhancement compare with a normal horn antenna without latticed aperture.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.3
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• pp.485-490
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• 2012

In this paper, driver circuit of LED lights for ships is designed and implemented to replace conventional lights with filament which have short life time due to vibration of ships. The driver of LED module is switching circuit without transformer to reduce volume and cost. As switch circuit controls input 220 VAC with PWM, LED module is reliably driven. Power factor is improved by using valley-fill PFC compensation circuit which is handled to pulse current of switching circuit. Serial-parallel LED circuit is applied to reduce change period of lights of long-term navigation ships. Array of serial-parallel can operate even if some of LEDs is damaged. It is suitable for ships that power consumption and power factor of lights including developed drive circuit have 39Watt and 0.925 respectively.