• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2019.05a
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• pp.464-466
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• 2019

Controllers used in nuclear power plants require high reliability. A controller including a Field Programmable Gate Array (FPGA) and a Complex Programmable Logic Device (referred to hereinafter as FPGA) has been applied to many Nuclear Power Plants (NPP) in the past, including the APR1400 (Advanced Power Reactor 1400), a Korean digital nuclear power plant. Initially, the FPGA was considered as a general IC (Integrated Circuit) and verified only by device verification and performance testing. In the 1990s, research on FPGA verification began, and until the FPGA became a chip, it was regarded as software and the software Verification and Validation (V&V) using IEEE 1012-2004 was implemented. Currently, IEC 62566, which is a European standard, has been applied for a lot of verification. This method has been evaluated as the most sensible method to date. This is because the method of verifying the characteristics of SoC (System on Chip), which has been a problem in the existing verification method, is sufficiently applied. However, IEC 62566 is a European standard that has not yet been adopted in the United States and maintains the application of IEEE 1012 for FPGA. IEEE 1012-2004 or IEC 62566 is a technical standard. In practice, various methods are applied to meet technical standards. In this paper, we describe the procedure and important points of verification method of Nuclear Safety Class FPGA applying SoC verification method.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.25 no.11
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• pp.1627-1634
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• 2021

This paper introduces a low-power compact ADC circuit for analog Convolutional filter for low-power neural network accelerator SOC. While convolutional neural network accelerators can speed up the learning and inference process, they have drawback of consuming excessive power and occupying large chip area due to large number of multiply-and-accumulate operators when implemented in complex digital circuits. To overcome these drawbacks, we implemented an analog convolutional filter that consists of an analog multiply-and-accumulate arithmetic circuit along with an ADC. This paper is focused on the design optimization of a low-power 8bit SAR ADC for the analog convolutional filter accelerator We demonstrate how to minimize the capacitor-array DAC, an important component of SAR ADC, which is three times smaller than the conventional circuit. The proposed ADC has been fabricated in CMOS 65nm process. It achieves an overall size of 1355.7㎛², power consumption of 2.6㎼ at a frequency of 100MHz, SNDR of 44.19 dB, and ENOB of 7.04bit.

• Proceedings of the Korea Society of Information Technology Applications Conference
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• 2005.11a
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• pp.285-288
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• 2005

We propose a novel programmable miniature vision module based on a custom designed analog VLSI (aVLSI) chip. The vision module consists of the optical flow vision sensor embedded with commercial off-the-shelves digital hardware; in our case is the Intel XScale PXA270 processor enforced with a programmable gate array device. The aVLSI sensor provides gray-scale imager data as well as smooth optical flow estimates, thus each pixel gives a triplet of information that can be continuously read out as three independent images. The particular computational architecture of the custom designed sensor, which is fully parallel and also analog, allows for efficient real-time estimations of the smooth optical flow. The Intel XScale PXA270 controls the sensor read-out and furthermore allows, together with the programmable gate array, for additional higher level processing of the intensity image and optical flow data. It also provides the necessary standard interface such that the module can be easily programmed and integrated into different vision systems, or even form a complete stand-alone vision system itself. The low power consumption, small size and flexible interface of the proposed vision module suggests that it could be particularly well suited as a vision system in an autonomous robotics platform and especially well suited for educational projects in the robotic sciences.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.142-146
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• 2012

Today, the demand for high-speed data communication and mobile communication has exploded. Thus, there is a growing need for optical communication systems that convert large volumes of data to optical signals and that accommodate and transmit the signals across long distances. Digital optical communication with these characteristics consists of a master unit (MU) and a slave unit (SU). However, the digital optical units that are currently commercialized or being developed transmit data without compression. Thus, digital optical communication using these units is restricted by the quantity of optical frames when adding diversity or operating with various combinations of CDMA, WCDMA, WiBro, GSM, LTE, and other mobile communication technologies. This paper suggests the application of a data compression algorithm to a digital signal processor (DSP) chip as a field programmable gate array (FPGA) and a complex programmable logic device (CPLD) of a digital optical unit to add separate optical waves or to transmit complex data without specific changes in design of the optical frame.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.4
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• pp.211-216
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• 2003

This work describes a 3 V 12b 100 MS/s CMOS digital-to-analog converter (DAC) for high-speed communication system applications. The proposed DAC is composed of a unit current-cell matrix for 8 MSBs and a binary-weighted array for 4 LSBs, trading-off linearity, power consumption, chip area, and glitch energy with this process. The low-glitch switch driving circuits are employed to improve linearity and dynamic performance. Current sources of the DAC are laid out separately from the current-cell switch matrix core block to reduce transient noise coupling. The prototype DAC is implemented in a 0.35 um n-well single-poly quad-metal CMOS technology and the measured DNL and INL are within ${\pm}0.75$ LSB and ${\pm}1.73$ LSB at 12b, respectively. The spurious-free dynamic range (SFDR) is 64 dB at 100 MS/s with a 10 MHz input sinewave. The DAC dissipates 91 mW at 3 V and occupies the active die area of $2.2{\;}mm{\;}{\times}{\;}2.0{\;}mm$

• Journal of the Optical Society of Korea
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• v.11 no.1
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• pp.18-25
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• 2007

We present an ultrahigh-resolution full-field optical coherence tomography (FF-OCT) implemented with a white-light interference microscope and a detector array as an alternative OCT technique. The use of detector array allows the capture of two-dimensional en-face images in parallel without taking any lateral scanning process. The phase shifting interferometric technique with the sinusoidal phase modulation (SPM) is utilized to get the demodulated OCT images. The configuration of the system and the resolution of the obtained image are presented. The topographic images, taken with the implemented system, of a coin, an integrated circuit chip, and the tomographic images of an onion epithelium are demonstrated also. Axial and lateral spatial resolution of ${\sim}1.0{\mu}m$ and ${\sim}2.0{\mu}m$ are achieved with the system respectively.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.6
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• pp.695-702
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• 2015

A 1-V 1.6-GS/s 5.58-ENOB flash ADC with a high-speed time-domain comparator is proposed. The proposed time-domain comparator, which consumes low power, improves the comparison capability in high-speed operations and results in the removal of preamplifiers from the first-stage of the flash ADC. The time interpolation with two factors, implemented using the proposed time-domain comparator array and SR latch array, reduces the area and power consumption. The proposed flash ADC has been implemented using a 65-nm 1-poly 8-metal CMOS process with a 1-V supply voltage. The measured DNL and INL are 0.28 and 0.41 LSB, respectively. The SNDR is measured to be 35.37 dB at the Nyquist frequency. The FoM and chip area of the flash ADC are 0.38 pJ/c-s and $620{\times}340{\mu}m^2$, respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.536-539
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• 2002

In this paper, we developed the automatic optical fiber aligner by image processing and automatic loading system. Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super-precision technology in sub-micron units is required for optical axis adjustment, we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system/software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10\mu\textrm{mm}$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up. and fiber input array and waveguide chip formed in line by automatic. Therefore, the developed and manufactured optical aligning system in this research fulfills the great role of support industry for major electronics manufacturers, telecommunications companies, universities, government agencies and other research institutions.