• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.127-128
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• 2009

CCP방식의 식각에 있어서 CF4/O2 Plasma Etch에 Ar을 첨가함으로써 Etch특성이 어떻게 변화하는지를 조사하였다. FE-SEM를 이용하여 Etch Profile를 측정하였다. 또한 Elipsometer와 Nanospec을 이용하여 Etch rate를 측정하였다. Ar의 비율이 전체의 47%정도를 차지하였을 때까지 Etch Profile이 향상되었다가 그이후로는 다시 감소하는 것을 볼 수 있었다. Ar을 첨가할수록 etch rate은 계속 향상되었다. Ar을 첨가하는 것은 물리적인 식각으로 반응하여 Etch rate의 향상과 적정량의 Ar을 첨가했을 때 Etch profile이 향상되는 결과를 얻었다.

• Journal of Surface Science and Engineering
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• 제39권3호
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• pp.137-141
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• 2006

Process window for infinite etch selectivity of silicon nitride $(Si_3N_4)$ layers to ArF photoresist (PR) was investigated in dual frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters such as low frequency power $(P_{LF})$, $CH_2F_2$ and $H_2$ flow rate in $CH_2F_2/H_2/Ar$ plasma. It was found that infinite etch selectivities of $Si_3N_4$ layers to the ArF PR on both blanket and patterned wafers can be obtained for certain gas flow conditions. The etch selectivity was increased to the infinite values as the $CH_2F_2$ flow rate increases, while it was decreased from the infinite etch selectivity as the $H_2$ flow rate increased. The preferential chemical reaction of the hydrogen with the carbon in the polymer film and the nitrogen on the $Si_3N_4$ surface leading to the formation of HCN etch by-products results in a thinner steady-state polymer and, in turn, to continuous $Si_3N_4$ etching, due to enhanced $SiF_4$ formation, while the polymer was deposited on the ArF photoresist surface.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 한국표면공학회 2006년도 춘계학술발표회 초록집
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• pp.134-134
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• 2006

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.468-470
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• 1999

One of the most critical problem in etching of platinum was generally known that the etch slope was gradual. therefore, the addition of $N_2$ gas into the Ar/C1$_2$ gas mixture, which has been proposed the optimized etching gas combination for etching of platinum in our previous article, was performed. The selectivity of platinum film to oxide film as an etch mask increased with the addition of N2 gas, and the steeper etch slope over 75 $^{\circ}$ could be obtained. These phenomena were interpreted the results the results of a blocking layer such as Si-N or Si-O-N on the oxide mask. Compostional analysis was carried out by X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). Moreover, it could be obtained the higher etch rate of Pt film and steeper profile without residues such as p.-Cl and Pt-Pt ant the addition N\ulcorner of 20 % gas in Ar(90)/Cl$_2$(10) Plasma. The Plasma characteristic was extracted from optical emissionspectroscopy (OES).

• Fire Science and Engineering
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• 제18권3호
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• pp.9-17
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• 2004

The values of physical properties of the inert gases of Ar, $N_2$, $CO_2$ were calculated by the empirical equations. The regression coefficients were obtained by the experimental data and the resulting calculated values. For the empirical equation with a lower regression coefficient, a new correlation was suggested. At an atmosphere pressure, the empirical equation was confirmed by the experimental values for the viscosity, density, saturated pressure, and surface tension of Ar, $N_2$, $CO_2$. The correlation coefficients of the empirical equations proposed in this work was higher than 0.99.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.189-189
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• 2000

고분자 재료에 이온을 주입함으로서 경도, 내마모, 내피로성의 기계적인 특성과 내부식성 등의 화학적 특성이 향상되며, 표면 전기전도도와 광학밀도(optical density)가 변한다. 본 연구에서는 MPPO(Modified-Polyphenlene Oxide) 표면에 N2, Ar, Xe 이온을 에너지 50keV, 선량(dose)을 1$\times$1015에서 1$\times$1017ions/cm2로 증가시키면서 조사하였다. 이온 조사량의 증가에 따라 표면 저항이 2$\times$1015에서 6$\times$106($\Omega$/$\square$)으로 감소하여 표면 전기전도도가 향상되었다. Ar 이온은 1016ion/cm2이하의 조사량(dose)에서 N2보다 표면 저항을 더 많이 감소하는데 반해 1016ion/cm2 이상의 조사량에서는 Ar과 N2의 표면 저항이 비슷한 값을 나타냈다. Xe은 Ar과 N2이온에 비하여 전체적으로 표면저항이 많이 감소하여 전도도의 향상은 Xe, Ar, N2 순서로 질량이 큰 이온이 조사 효과가 큰 것으로 나타났다. 소재 표면은 SIMS 분석을 통하여 깊이에 따른 주입이온의 분포를 관찰하였으며, 표면 색상은 황색에서 갈색을 거쳐 암갈색으로 변화함으로서 가시광선에 대한 반사율(reflectance)이 감소하고 광학밀도(optical density)가 증가하여 광학적 특성이 변하였다. 이온 주입 후 에너지 전이에 의한 효과는 optical gap를 감소시켜 광학밀도(optical density)와 표면 전기 전도도를 증가시킨다. 이에 따라 본 논문에서는 이온주입에 의한 광학적, 전기적 특성간의 상관관계를 밝히고자 한다.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.385-385
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• 2013

음극 아크로 증착한 TiAlN 박막의 표면형상과 물리적 특성을 관찰하였다. 음극 아크로 박막을 코팅할 경우, 거대 입자가 박막 표면에 존재하여 박막의 품질을 저하시킨다. 본 연구에서는 거대입자의 생성을 막기 위한 기판 청정공정을 도출하였다. 먼저 글로우 방전을 이용하여 기판을 청정한 후 $N_2$ 가스를 주입하여 TiAlN 박막을 코팅하였다. 글로우 방전의 경우 Ar 가스주입 후 공정압력은 $1.9{\sim}2.1{\times}10^{-2}$ Torr, 전압 -800 V에서 30분 동안 청정을 실시하였다. 다른 청정 방법으로는 Ar과 $N_2$ 가스를 동시에 주입하여 아크를 발생시키고 시편에 전압을 -400 V 인가하여 청정을 실시한 후 인가전압만을 -100 V로 낮추어 TiAlN을 코팅하였다. 글로우 방전 청정과 Ar과 $N_2$의 혼합가스로 아크를 발생시켜 청정을 실시한 후 코팅된 시편의 박막 표면형상과 물리적 특성을 비교해 본 결과, 앞서 서술한 두 종류의 청정공정 모두 거대입자의 수가 주목할 만하게 줄어들었다. 글로우 방전과 Ar과 $N_2$의 혼합가스로 발생시킨 아크로 청정을 실시하고 코팅한 TiAlN 박막은 거대입자의 제거와 함께 박막의 경도가 최대 47 GPa까지 향상되는 경향을 보였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제21권12호
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• pp.1051-1056
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• 2008

In this study, the investigations of the TiN etching characteristics were carried out with addition of $Cl_2$ gas in an inductively coupled $BCl_3$-base plasma system. Dry etching of the TiN was studied by varying the etching parameters including $Cl_2$ gas addition ratio, RF power, DC-bias voltage and pressure. The etch rate of TiN thin film was maximum when the $Cl_2$ gas addition flow was 2 sccm with fixed other conditions. As the RF power DC-bias voltage were increased, the etch rate of TiN thin film showed increasing tendency. $BCl_3/Cl_2$/Ar plasmas were characterized by optical emission spectroscopy (OES) analysis. The chemical reaction on the surface of the etched TiN films was investigated with X-ray photoelectron spectroscopy (XPS).

• Journal of the Korean Vacuum Society
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• 제13권4호
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• pp.139-144
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• 2004

Recently, the importance of clean vacuum and partial pressure measurement of gas species has been increased in the vaccum process. In this study, the partial pressures of $H_2$, He, C, N, $O_2$, $H_2O $, Ar/2, $N_2$(CO), Ar, $CO_2$ were measured by residual gas analyzer according to temperature of cryogenic pump which is used to clean vacuum generation and compared. The experimental results showed that the cryopanel temperature was reached to 12K after 72 minutes of pumping and after 25hours, the partial pressures in percent were 24.9 %, 6.6%, 5.5 %, 2.2 %, 3.8%, 30.7%, 6.5%, 6.1 %, 5.5%, 8.2% for $H_2$, He, C, N, $O_2$, $H_2O $, Ar/2, $N_2$, Ar, $CO_2$ respectively. The dominant gases were $H_2$ and $H_2O $, and the partial pressures were relatively high compare to other gases.

• Transactions on Electrical and Electronic Materials
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• 제9권1호
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• pp.12-15
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• 2008

Hafnium oxynitride films have been deposited onto a silicon substrate by means of radio frequency (RF) reactive sputtering using a hafnium dioxide $(HfO_2)$ target with a variety of nitrogen! argon $(N_2/Ar)$ gas flow ratios. Auger electron spectroscopy (AES)results confirm that $N_2$ was successfully incorporated into the HfON films. An increase in the $N_2/Ar$ gas flow ratio resulted in metal oxynitride formation. The films prepared with a $N_2/Ar$ flow ratio of 20/20 sccm show (222), (530), and (611) directions of $HfO_2N_2$, and the (-111), (311) directions of $HfO_2$. From X-ray reflectometry measurements, it can be concluded that with $N_2$ incorporated into the HfON films, the film density increases. The density increases from 9.8 to $10.1g/cm^3$. XRR also reveals that the surface roughness is related to the $N_2/Ar$ flow ratio.