• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.5
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• pp.237-241
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• 2004

Amorphous silicon (a-Si) films are used in a broad range of solar cell, flat panel display, and sensor. Because of the greater ease of deposition and lower processing temperature, thin films are widely used for thin film transistors (TFTs). However, they have lower stability under the exposure of visible light and because of their low field effect mobility ($\mu$$_{FE}$ ) , less than 1 c $m^2$/Vs, they require a driving IC in the external circuits. On the other hand, polycrystalline silicon (poly-Si) thin films have superiority in $\mu$$_{FE}$ and optical stability in comparison to a-Si film. Many researches have been done to obtain high performance poly-Si because conventional methods such as excimer laser annealing, solid phase crystallization and metal induced crystallization have several difficulties to crystallize. In this paper, a new crystallization process using a molybdenum substrate has been proposed. As we use a flexible substrate, high temperature treatment and roll-to-roll process are possible. We have used a high temperature process above 75$0^{\circ}C$ to obtain poly-Si films on molybdenum substrates by a rapid thermal annealing (RTA) of the amorphous silicon (a-Si) layers. The properties of high temperature crystallized poly-Si studied, and poly-Si has been used for the fabrication of TFT. By this method, we are able to achieve high crystal volume fraction as well as high field effect mobility.

• Journal of Surface Science and Engineering
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• v.46 no.5
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• pp.181-186
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• 2013

We performed plasma spraying for 2001 (Bi:Cu = 2:1), 0212 (Sr:Ca:Cu = 2:1:2) oxide powders. $Bi_2Sr_2CaCu_2Ox$ (2212) superconductor has been prepared by PMP-AT (partial melting process-annealing treatment). The 2212 phase is synthesized between Sr-Ca-Cu oxide coating layer (0212) and Bi-Cu oxide coating layer (2001) by movement of partial melted Bi on 2001 layer and the diffusion reaction (Cu, Sr, Ca) after PMP-AT. There are two different coating layers on joining process. The one is ABAB coating layers and the other is BAAB coating layers by arrangement of 2001 (A), 0212 (B) layers. We performed heat treatment these two different coating layers processes under same PMP-AT conditions. We obtained Bi-2212 superconducting layers at each experimental condition, and the result of MPMS, the critical temperature was showed about 78 K. But the microstructure images and result of EDS as each experimental variable were showed about the qualitatively different Bi-2212 superconducting phases. We also deduced the generation mechanism of Bi-2212 superconducting layer as a result of these experimental data, microstruc ture images, EDS data and phase diagram.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.46 no.3
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• pp.139-147
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• 2023

The metal bush assembling process is a process of inserting and compressing a metal bush that serves to reduce the occurrence of noise and stable compression in the rotating section. In the metal bush assembly process, the head diameter defect and placement defect of the metal bush occur due to metal bush omission, non-pressing, and poor press-fitting. Among these causes of defects, it is intended to prevent defects due to omission of the metal bush by using signals from sensors attached to the facility. In particular, a metal bush omission is predicted through various data mining techniques using left load cell value, right load cell value, current, and voltage as independent variables. In the case of metal bush omission defect, it is difficult to get defect data, resulting in data imbalance. Data imbalance refers to a case where there is a large difference in the number of data belonging to each class, which can be a problem when performing classification prediction. In order to solve the problem caused by data imbalance, oversampling and composite sampling techniques were applied in this study. In addition, simulated annealing was applied for optimization of parameters related to sampling and hyper-parameters of data mining techniques used for bush omission prediction. In this study, the metal bush omission was predicted using the actual data of M manufacturing company, and the classification performance was examined. All applied techniques showed excellent results, and in particular, the proposed methods, the method of mixing Random Forest and SA, and the method of mixing MLP and SA, showed better results.

• Applied Science and Convergence Technology
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• v.26 no.5
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• pp.133-138
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• 2017

We investigated the interface defect engineering and reaction mechanism of reduced transition layer and nitride layer in the active plasma process on 4H-SiC by the plasma reaction with the rapid processing time at the room temperature. Through the combination of experiment and theoretical studies, we clearly observed that advanced active plasma process on 4H-SiC of oxidation and nitridation have improved electrical properties by the stable bond structure and decrease of the interfacial defects. In the plasma oxidation system, we showed that plasma oxide on SiC has enhanced electrical characteristics than the thermally oxidation and suppressed generation of the interface trap density. The decrease of the defect states in transition layer and stress induced leakage current (SILC) clearly showed that plasma process enhances quality of $SiO_2$ by the reduction of transition layer due to the controlled interstitial C atoms. And in another processes, the Plasma Nitridation (PN) system, we investigated the modification in bond structure in the nitride SiC surface by the rapid PN process. We observed that converted N reacted through spontaneous incorporation the SiC sub-surface, resulting in N atoms converted to C-site by the low bond energy. In particular, electrical properties exhibited that the generated trap states was suppressed with the nitrided layer. The results of active plasma oxidation and nitridation system suggest plasma processes on SiC of rapid and low temperature process, compare with the traditional gas annealing process with high temperature and long process time.

• Composites Research
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• v.32 no.5
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• pp.229-236
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• 2019

In this study, the effects of the additional processing parameters on the mechanical properties of thermoplastic composites fabricated with automated fiber placement (AFP) were evaluated. Annealing and vacuum bag only processes were then performed on the manufactured thermoplastic composites, respectively. For verification, the crystallinity was measured by differential scanning calorimetry (DSC), confirming the variation of semi-crystalline thermoplastic composite according to the process conditions. The void content of thermoplastic composites was evaluated by matrix digestion method while microscopic examination confirmed the porosity distribution. The interlaminar shear strength test was conducted for three different process parameters (VBO, annealing, and no treatment). A comparison of the three tested strengths was made, revealing that the porosity value had larger effect on the mechanical properties of the thermoplastic composite compared to the degree of crystallinity. Additionally, when thermoplastic composite melted up, the pores were continuously removed under vacuum process; the removal of the pores resulted in an increase of the interlaminar shear strength.

• Korean Journal of Metals and Materials
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• v.47 no.5
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.4
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• pp.413-418
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• 2021

Nano-materials with high effective surface areas have been applied to functional materials, such as high sensitive gas sensors and biosensors and high-efficiency catalytic materials. In this study, titanate sheets with a 3D nano-wall-like structure, high effective surface area, were synthesized vertically to the substrate by a chemical bath deposition (CBD) process using a Ti sheet and urea. The synthesis temperature and synthesis duration time were controlled to the optimal conditions of a 3D nano-wall-like structure in the CBD process. The synthesized ammonium titanate sheets with a 3D nano-wall-like structure were annealed in air to transform to TiO2 with a 3D nano-wall-like structure for various applications. As a result, the optimal temperature in the CBD process for the synthesis of a uniform ammonium titanate sheet with a 3D nano-wall-like structure was 90 ℃. TiO2 with a 3D nano-wall-like structure was obtained from the ammonium titanate sheet with a 3D nano-wall-like structure by annealing above 550 ℃ for three hours. In particular, TiO2 with a 3D nano-wall-like structure with a dominant rutile phase was obtained by post-annealing at 700 ℃. On the other hand, damage to the 3D nano-wall edge was observed after 700 ℃ post-annealing.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.3
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• pp.99-105
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• 2014

$LiCoO_2$ thin film have received attention as cathodes of thin-film microbatteries. In this study, $LiCoO_2$ thin films were synthesized on Au substrates by sol-gel spin coating method and electrochemical properties were investigated under annealing temperature and time. The phycochemical properties of $LiCoO_2$ thin film were investigated by X-ray diffraction, scaning electron microscopy and atomic force microscopy. The electrochemical properties were characterized using galvanostatic charging/discharging cycling tests. From X-ray diffraction, as-grown films annealed at $550^{\circ}C$ and $750^{\circ}C$ are presumed to be spinel structure and a single phase of the layered-rock-salt, respectively. The RMS roughness and grain size of the films which annealed at $750^{\circ}C$ has similar values for annealing time 10 and 30 min, while for annealing time 120 min surface roughness, grain size increase and pore appearance were observed. The first discharge capacity of $LiCoO_2$ thin films annealed at $750^{\circ}C$ for 10, 30 and 120 min is about 54.5, 56.8 and $51.87{\mu}Ah/cm^2{\mu}m$, respectively. Corresponding capacity retention at 50th cycle is 97.25, 76.69, 77.19%.

• Journal of the Korean Vacuum Society
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• v.9 no.2
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• pp.155-161
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• 2000

BN films composed of c-BN(70%) and h-BN(30%) phases have been synthesized by the ion beam assisted deposition (IBAD) process and stabilized by post-annealing. Boron was e-beam evaporated at 1.2 $\AA$/sec and nitrogen was ionized and accelerated at about 100 eV by the end-hall type ion gun. Substrates were negatively biased by DC 400 and 500 V, respectively, and heated at $700^{\circ}C$. Synthesized BN films were in-situ post-annealed at 700 or $800^{\circ}C$, respectively, for 1 hr without breaking vacuum. BN films without post-annealing were peeled off from substrates immediately when they were exposed to the air while those with post-annealing at $800^{\circ}C$ were stabilized. Post annealing reduced the film stress from 4.9 GPa to 3.4 GPa, but no considerable stress release in the c-BN phase was observed, contrary to previous reports that the stress relaxation in the c-BN phase is the main mechanism for the stabilization. Structural and chemical relaxation of non c-BN phase is supposed to be responsible for the film stress reduction and, in turn, stabilization, especially when the c-Bn content of the film is not high.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.316-321
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• 2007

The effect of annealing on the pitting corrosion resistance of anodized Al-Mg alloy (AA5052) processed by equal-channel angular pressing (ECAP) was investigated by electrochemical techniques in a solution containing 0.2 mol/L of $AlCl_3$ and also by surface analysis. The Al-Mg alloy was annealed at a fixed temperature between 473 and 573 K for 120 min in air after ECAP. Anodizing was conducted for 40 min at $100-400A/m^2$ at 293 K in a solution containing 1.53 mol/L of $H_2SO_4$ and 0.0185 mol/L of $Al_2(SO_4)_3$. The internal stress generated in anodic oxide films during anodization was measured with a strain gauge to clarify the effect of ECAP on the pitting corrosion resistance of anodized Al-Mg alloy. The time required to initiate the pitting corrosion of anodized Al-Mg alloy was shorter in samples subjected to ECAP, indicating that ECAP decreased the pitting corrosion resistance. However, the pitting corrosion resistance was greatly improved by annealing after ECAP. The time required to initiate pitting corrosion increased with increasing annealing temperature. The strain gauge attached to Al-Mg alloy revealed that the internal stress present in the anodic oxide films was compressive stress, and that the stress was larger with ECAP than without. The compressive internal stress gradually decreased with increasing annealing temperature. Scanning electron microscopy showed that cracks occurred in the anodic oxide film on Al-Mg alloy during initial corrosion and that the cracks were larger with ECAP than without. The ECAP process of severe plastic deformation produces large internal stresses in the Al-Mg alloy; the stresses remain in the anodic oxide films, increasingthe likelihood of cracks. It is assumed that the pitting corrosion is promoted by these cracks as a result of the higher internal stress resulting from ECAP. The improvement in the pitting corrosion resistance of anodized AlMg alloy as a result of annealing appears to be attributable to a decrease in the internal stresses in anodic oxide films