• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.130.2-130.2
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• 2013

Today, chemical vapor deposition (CVD) of hydrocarbon gases has been demonstrated as an attractive method to synthesize large-area graphene layers. However, special care should be taken to precisely control the resulting graphene layers in CVD due to its sensitivity to various process parameters. Therefore, a facile synthesis to grow graphene layers with high controllability will have great advantages for scalable practical applications. In order to simplify and create efficiency in graphene synthesis, the graphene growth by thermal annealing process has been discussed by several groups. However, the study on growth mechanism and the detailed structural and optoelectronic properties in the resulting graphene films have not been reported yet, which will be of particular interest to explore for the practical application of graphene. In this study, we report the growth of few-layer, large-area graphene films using rapid thermal annealing (RTA) without the use of intentional carbon-containing precursor. The instability of nickel films in air facilitates the spontaneous formation of ultrathin (<2~3 nm) carbon- and oxygen-containing compounds on a nickel surface and high-temperature annealing of the nickel samples results in the formation of few-layer graphene films with high crystallinity. From annealing temperature and ambient studies during RTA, it was found that the evaporation of oxygen atoms from the surface is the dominant factor affecting the formation of graphene films. The thickness of the graphene layers is strongly dependent on the RTA temperature and time and the resulting films have a limited thickness less than 2 nm even for an extended RTA time. The transferred films have a low sheet resistance of ~380 ${\Omega}/sq$, with ~93% optical transparency. This simple and potentially inexpensive method of synthesizing novel 2-dimensional carbon films offers a wide choice of graphene films for various potential applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.427-432
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• 2024

The polymer crystallization process, promoting the formation of ferroelectric β-phase, is essential for developing polyvinylidene fluoride (PVDF)-based high-performance piezoelectric energy harvesters. However, traditional high-temperature annealing is unsuitable for the manufacture of flexible piezoelectric devices due to the thermal damage to plastic components that occurs during the long processing times. In this study, we investigated the feasibility of introducing a flash lamp annealing that can rapidly induce the β-phase in the PVDF layer while avoiding device damage through selective heating. The flash light-irradiated PVDF films achieved a maximum β-phase content of 76.52% under an applied voltage of 300 V and an on-time of 1.5 ms, a higher fraction than that obtained through thermal annealing. The PVDF-based piezoelectric energy harvester with the optimized irradiation condition generates a stable output voltage of 0.23 V and a current of 102 nA under repeated bendings. These results demonstrate that flash lamp annealing can be an effective process for realizing the mass production of PVDF-based flexible electronics.

• Korean Journal of Materials Research
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• v.3 no.4
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• pp.352-360
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• 1993

A nitride layer was df'posited on the thermal oxide layer by LPCVD process. ONO(oxidenitricle oxide) capacitors with various thickness of component layer wore fabricated by wet reoxidation of the nitride with and without anrwalmg treatment and their properties were investigated. As a result of observation on the refrative index and etching behavior of the ONO fIlms, the nitride layer OF 40 A thick ness was not so dense that the bottom oxide during the reoxidation process and the capability of securing the capacitance decreased. The conduction current in the ONO multl-Iayer dielctric film was reduced as the bottom(or top) oxide layer became thicker. However, in the case of oxide with thickness more than 50A, it merely plays a factor of reduction in capacitance, and the effect of barrier for hole injection was not so much increased. Annealing of the nitride laypr bpfore reoxidation did not show a grpat effects on the refractive index and capacitance of the film, however, the annealing process increased the breakdown voltage by 2${\cdot}$V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.170-173
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• 2001

Thin films of phase-pure perovskite (P $b_{0.72}$L $a_{0.28}$) $Ti_{0.93}$ $O_3$(PLT) were deposited in-situ onto Pt/Ti/ $SiO_2$/Si substrates by pulsed laser deposition. We have systematically investigated the variation of grain sizes depending on the process condition. Both in-situ annealing and ex-situ annealing treatments have been compared depending on the annealing time. Two-step process to grow (P $b_{0.72}$L $a_{0.28}$) $Ti_{0.93}$ $O_3$(PLT) films was adopted and verified to be useful to enlarge the grain size of the film and to enhance the leakage current characteristics. The grain sizes of PLT thin films were successfully controlled 260 to 350 nm by changing process parameters. Electrical properties including dielectric constant, ferroelectric characteristics, crystallization and leakage current of PLT thin films were shown to be strongly inf1uenced by grain size. Also PLT thin films on p-type(100) Si substrate will be fabricated by pulsed laser deposition technique using a Nd:YAG laser with different wavelengths of 355, 532 and 1064 nm. Effect of the variation of laser wavelength on dielectric properties will be discussed. Microstructural and electrical properties of the film were investigated by C-V measurement leakage current measurement and SEM.ent and SEM.

• Transactions on Electrical and Electronic Materials
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• v.11 no.6
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• pp.279-284
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• 2010

This study has been carried out to determine the optimal process conditions of $AZO:H_2$ thin films for the maximization of the transmittance of a blue GaN light-emitting diode (LED) with a wavelength of 470 nm. The Al-doped zinc oxide $(AZO):H_2$ thin films were deposited on a sapphire substrate by radio-frequency magnetron sputtering system with varying substrate temperatures, working pressures and annealing temperatures temperature, working pressure and annealing imposed on a AZO (2wt% $Al_2O_3$) ceramic target. The effect of these variables was investigated in order to improve the light extraction efficiency of the LED. As a result, the (002)-oriented peak was found in all the $AZO:H_2$ thin films. The lowest resistivity and the best transmittance at a wavelength of 470 nm was found to be $4.774\;{\times}\;10^{-4}\;{\Omega}cm$ and 92% at a substrate temperature of $500^{\circ}C$, working pressure of 7 mTorr and annealing temperature of $400^{\circ}C$. The transmittance of the $AZO:H_2$ thin film for the Blue GaN LED was improved by approximately 13% relative to that of a ITO thin film (T = 79%).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.63-71
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• 2004

Recently, a sheet forming process of Mg alloys is highlighted again due to increasing demand for Mg wrought alloys in the applications of casings of mobile electronics and outer-skins of light-weight transportation. Microstructure control is essential for the enhancement of workability and formability of Mg alloy sheets. In this research, AZ31 Mg alloy sheets were prepared by hot rolling process and the rolling condition dependency of the microstructure and texture evolution was studied by employing a conventional rolling mill as well as an asymmetric rolling mill. When rolled through multiple passes with a small reduction per pass, fine-grained and homogeneous microstructure evolved by repetitive dynamic and static recrystallization. With higher rolling temperature, dynamic recrystallization was initiated in lower reduction. However with increasing reduction per pass, deformation was locallized in band-like regions, which provided favorable nucleation sites f3r dynamic recrystallization. Through post annealing process, the microstructures could be transformed to more equiaxed and homogeneous grain structures. Textures of the rolled sheets were characterized by $\{0002\}$ basal plane textures and retained even after post annealing. On the other hand, asymmetrically rolled and subsequently annealed sheets exhibited unique annealing texture, where $\{0002\}$ orientation was rotated to some extent to the rolling direction and its intensity was reduced.

• Progress in Superconductivity
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• v.8 no.1
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• pp.108-112
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• 2006

We fabricated Bi-2212/$SrSO_4$ bulk superconductors by the casting process and evaluated the effects of the powder mixing method and annealing temperature on the texture, microstructure, and critical current. In the process, the Bi-2212 powders were mixed with $SrSO_4$ by hand-mixing(HM) and planetary ball milling(PBM) method and then the powder mixtures were melted at $1100^{\circ}C{\sim}1200^{\circ}C$, solidified, and annealed. We observed that the rod made by the PBM had a more homogeneous microstructure and smaller $SrSO_4$ and second phases than that of the rod made by the HM, resulting in increased $I_c$. The $I_c$ of the rod also depended on the annealing temperature and the highest $I_c$ was obtained to be 200 A when prepared by HM at $1200^{\circ}C$ and annealed at $810^{\circ}C$ which is probably due to the moderate density and 2212 texture and the smaller and less second phase compared to that at higher temperature. The possible causes of the variations of $I_c$ with the powder mixing method and annealing temperature were related to the microstructural evolution based on the SEM, EPMA, and DTA analyses.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.4
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• pp.312-317
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• 2000

Ferroelectric S $r_{0.9}$/B $i_{2.1}$/T $a_{2}$/ $O_{9}$ solutions were synthesized using sol-gel process in which strontinum ethoxide bismuth ethoxide trantalum ethoxide were used a s startring materials. SBT thin films were coated on Pt/Ti/ $SiO_2$/Si substrates by spin-coating. rapid thermal annealing (RTA) was used to promote crystallization. Thin films were annealed at $700^{\circ}C$ for 1 hr in an oxygen atmosphere. This temperature is about 10$0^{\circ}C$ lower than the usual annealing temperature for SBT thin films. Pt top-electrode was deposited by sputtering and thin films were post-annealed at $700^{\circ}C$ for 30 min. to enhance electrical properties. As the RTA temperature increased the higher 2 $P_{r}$ values were obtained. At RTA temperature being 78$0^{\circ}C$ remanent polarization of S $r_{0.9}$/B $i_{2.1}$/T $a_{2}$/ $O_{9}$ thin film was 7.73 $\mu$C/cm $_2$ and the leakage current density was 1.14$\times$10$^{-7}$ A/c $m^2$ at 3 V. As RTA temperature increased the breakdown voltage was decreased. It is considered that the low-field breadown is caused by the rough surface of SBT films and forming bismuth metal in SBT thin films.films.lms.

• Journal of Magnetics
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• v.13 no.3
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• pp.110-113
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• 2008

In this study, heavy rare earth garnet $Tb_2Bi_1Ga_1Fe_4O_{12}$ powders were fabricated by a sol-gel and vacuum annealing process. The crystal structure was found to be single-phase garnet with a space group of Ia3d. The lattice constant $a_0$ was determined to be 12.465 ${\AA}$. From the analysis of the vibrating sample magnetometer (VSM) hysteresis loop at room temperature, the saturation magnetization and coercivity of the sample are 7.64 emu/g and 229 Oe, respectively. The N$\acute{e}$el temperature($T_N$) was determined to be 525 K. The M$\ddot{o}$ssbauer spectrum of $Tb_2Bi_1Ga_1Fe_4O_{12}$ at room temperature consists of 2 sets of 6 Lorentzians, which is the pattern of single-phase garnet. From the results of the M$\ddot{o}$ssbauer spectrum at room temperature, the absorption area ratios of Fe ions on 24d and 16a sites are 74.7% and 25.3%(approximately 3:1), respectively. These results show that all of the non-magnetic Ga atoms occupy the 16a site by a vacuum annealing process. Absorption area ratios of Fe ions are dependent not only on a sintering condition but also on the temperature of the sample. It can then be interpreted that the Ga ion distribution is dependent on the temperature of the sample. The M$\ddot{o}$ssbauer measurement was carried out in order to investigate the atomic migration in $Tb_2Bi_1Ga_1Fe_4O_{12}$.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.453-457
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• 2007

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.