• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.186-186
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• 2000

After LeComber et al. reported the first amorphous hydrogenated silicon (a-Si: H) TFT, many laboratories started the development of an active matrix LCDs using a-Si:H TFTs formed on glass substrate. With increasing the display area and pixel density of TFT-LCD, however, high mobility TFTs are required for pixel driver of TF-LCD in order to shorten the charging time of the pixel electrodes. The most important of these drawbacks is a-Si's electron mobiliy, which is the speed at which electrons can move through each transistor. The problem of low carier mobility for the a-Si:H TFTs can be overcome by introducing polycrystalline silicon (poly-Si) thin film instead of a-Si:H as a semiconductor layer of TFTs. Therefore, poly-Si has gained increasing interest and has been investigated by many researchers. Recnetly, fabrication of such poly-Si TFT-LCD panels with VGA pixel size and monolithic drivers has been reported, . Especially, fabricating poly-Si TFTs at a temperature mach lower than the strain point of glass is needed in order to have high mobility TFTs on large-size glass substrate, and the monolithic drivers will reduce the cost of TFT-LCDs. The conventional methods to fabricate poly-Si films are low pressure chemical vapor deposition (LPCVD0 as well as solid phase crystallization (SPC), pulsed rapid thermal annealing(PRTA), and eximer laser annealing (ELA). However, these methods have some disadvantages such as high deposition temperature over $600^{\circ}C$, small grain size (<50nm), poor crystallinity, and high grain boundary states. Therefore the low temperature and large area processes using a cheap glass substrate are impossible because of high temperature process. In this study, therefore, we have deposited poly-Si thin films on si(100) and glass substrates at growth temperature of below 40$0^{\circ}C$ using newly developed high rate magnetron sputtering method. To improve the sputtering yield and the growth rate, a high power (10~30 W/cm2) sputtering source with unbalanced magnetron and Si ion extraction grid was designed and constructed based on the results of computer simulation. The maximum deposition rate could be reached to be 0.35$\mu$m/min due to a high ion bombardment. This is 5 times higher than that of conventional sputtering method, and the sputtering yield was also increased up to 80%. The best film was obtained on Si(100) using Si ion extraction grid under 9.0$\times$10-3Torr of working pressure and 11 W/cm2 of the target power density. The electron mobility of the poly-si film grown on Si(100) at 40$0^{\circ}C$ with ion extraction grid shows 96 cm2/V sec. During sputtering, moreover, the characteristics of si source were also analyzed with in situ Langmuir probe method and optical emission spectroscopy.

• The Korean Journal of Ceramics
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• 제6권2호
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• pp.100-102
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• 2000

Co fine particles were dispersed in Au metal and $AlO_x$ amorphous matrices by vacuum evaporation and rf-sputtering, respectively, thus forming granular composite films having chemical compositions of $Co_{0.59}-Au_{0.41}$ and $Co_{0.52}/(AlO_x$)_{0.48}$. The films were annealed at 200~$500^{\circ}C$ to increase the size of the Co particles, from 30$\AA$ to 180$\AA$ in the Au matrix and 40$\AA$ to 180$\AA$ in the $AlO_x$ matrix, as revealed by X-ray diffraction analysis. The Co metal in as-deposited films have saturation magnetization equivalent to that of bulk Co, which is unchanged by the annealing, showing that the Co metal is not oxidized by the annealing. Magneto-optical Kerr rotation measured at $\lambda$=400-900nm for the $Co_{0.59}-Au_{0.41}$ film as deposited is larger than that calculated for the composition. The rotation increases as the film is annealed at $200^{\circ}C$ and $300^{\circ}C$, approaching to that of bulk Co. The Kerr rotation for the $Co_{0.52}-(AlO_x)_{0.48}$ film as deposited is smaller than that calculated for the composition based on Bruggeman effective medium theory. However, the rotation increases much, exceeding the rotation of the bulk Co as annealed at $300^{\circ}C$ and $400^{\circ}C$. As a possible origin of the marked magneto-optical enhancement a weak localization of light in granular structure is suggested.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.75.2-75.2
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• 2010

We studied the fabrication of polycrystalline silicon (pc-Si) films as seed layers for application of pc-Si thin film solar cells, in which amorphous silicon (a-Si) films in a structure of glass/Al/$Al_2O_3$/a-Si are crystallized by the aluminum-induced layer exchange (ALILE) process. The properties of pc-Si films formed by the ALILE process are strongly determined by the oxide layer as well as the various process parameters like annealing temperature, time, etc. In this study, the effects of the oxide film thickness on the crystallization of a-Si in the ALILE process, where the thickness of $Al_2O_3$ layer was varied from 4 to 50 nm. For preparation of the experimental film structure, aluminum (~300 nm thickness) and a-Si (~300 nm thickness) layers were deposited using DC sputtering and PECVD method, respectively, and $Al_2O_3$ layer with the various thicknesses by RF sputtering. The crystallization of a-Si was then carried out by the thermal annealing process using a furnace with the in-situ microscope. The characteristics of the produced pc-Si films were analyzed by optical microscope (OM), scanning electron microscope (SEM), Raman spectrometer, and X-ray diffractometer (XRD). As results, the crystallinity was exponentially decayed with the increase of $Al_2O_3$ thickness and the grain size showed the similar tendency. The maximum pc-Si grain size fabricated by ALILE process was about $45{\mu}m$ at the $Al_2O_3$ layer thickness of 4 nm. The preferential crystal orientation was <111> and more dominant with the thinner $Al_2O_3$ layer. In summary, we obtained a pc-Si film not only with ${\sim}45{\mu}m$ grain size but also with the crystallinity of about 75% at 4 nm $Al_2O_3$ layer thickness by ALILE process with the structure of a glass/Al/$Al_2O_3$/a-Si.

• 한국결정성장학회지
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• 제24권3호
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• pp.106-110
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• 2014

Atomic layer deposition(ALD)을 이용하여 $Al_2O_3$ 박막을 형성하고 이에 대한 패시베이션 특성에 대한 연구를 수행하였다. ALD로 증착된 $Al_2O_3$ 박막은 $400^{\circ}C$ 5분간 후속 열처리 공정 후에도 $Al_2O_3$ - 실리콘 계면 반응 없이 비정질 상태를 유지할 만큼 구조적으로 안정한 특성을 나타내었다. 후속 열처리 후 $Al_2O_3$ 박막의 패시베이션 특성이 향상되었으며, 이는 field effective 패시베이션과 화학적 패시베이션 효과가 동시에 상승에 기인하는 것으로 판단된다. $Al_2O_3$ 박막의 음고정 전하를 정량적으로 평가하기 위해서 후속 열처리 공정을 거친 $Al_2O_3$ 박막을 이용하여 metal-oxide-semiconductor(MOS) 소자를 제작하고 capacitance-voltage(C-V) 분석을 수행하였다. C-V 결과로부터 추출된 flatband voltage($V_{FB}$)와 equivalent oxide thickness(EOT)의 관계식을 통하여 $Al_2O_3$ 박막의 고정음전하는 $2.5{\times}10^{12}cm^{-2}$로 계산되었으며, 이는 본 연구에서 제시된 $Al_2O_3$ 박막 공정이 N-type 실리콘 태양전지의 패시베이션 공정에 응용 가능하다는 것을 의미한다.

• 한국자기학회지
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• 제7권6호
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• pp.293-298
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• 1997

기계적합금법으로 Fe$_{5}$Si$_{x}$B$_{5-x}$ 분말을 제조하고, Si 치환에 따른 합성상의 변화 및 합성분말의 자기적 성질을 XRD, TEM, Mossbauer spectroscopy, VSM 등으로 조사하였다. 각 출발 원소들은 milling 초기에 .alpha. -Fe 구조로 고용되어 비정질(amorphous) 상태로 되며, 기계적합금화가 진행됨에 따라 최종 안정상이 석출되었다. Fe$_{5}$B$_{5}$ 조성의 경우(x=0) 250시간 볼밀 처리한 후 800 .deg. C에서 2시간 열처리하면 FeB와 Fe$_{2}$B 상이 혼재된 구조가 얻어 진다. B의 일부를 Si으로 치환하면 Fe$_{2}$B 상의 생성이 억제되는 반면에 여분의 Si이 Fe$_{5}$SiB$_{2}$, Fe$_{2}$Si$_{0.4}$B$_{0.6}$ 상 및 상자성 상을 형성한다. FeB 상은 800 .deg. C에서 열처리한 후에도 결정성이 높지 않아서 넓은 범위의 초미세자장 값을 갖는 반면에, 다른 상들은 결정화가 이루어져 일정한 초미세자장 값을 보였다. 포화자화 값은 Fe$_{2}$B 상이 가장 많이 함유된 Fe$_{5}$B$_{5}$ 조성에서 가장 크게 나타났다.다.

• 한국산학기술학회논문지
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• 제7권2호
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• pp.120-125
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• 2006

산업적으로 경제적인 급속 응고법과 $450^{\circ}C-1hr$ 대기 어닐링을 이용하여 ${\pm}5000Oe$ 이상의 고자계에서 5% 이상의 거대 자기효과를 보이는 두께 $20{\mu}m$의 granular CuCo 합금 리본을 제작하였다. Co의 함량에 따른 최대 자기저항 효과를 확인하기 위해서 Co의 함량을 $5{\sim}30at%$ 범위에서 변화시키며 아래의 자기저항효과와 포화자화의 자기적 특성과 미세구조를 확인하였다. 최대자기저항 효과는 Cu-10at%Co에서 1.2T에서 5.2%의 GMR ratio를 얻었으며, 0.5T에서는 $Cu-8{\sim}14at%Co$에서 공업적으로 활용이 가능한 3% 이상의 MR ratio를 확보할 수 있었다. 5% 이하의 Co 조성범위 리본에서는 초상자성(superparamagnetic)때문에, 20%이상의 Co 조성의 리본에서는 포화자화는 커지지만 Co 클러스터의 과도 성장으로 MR 효과가 급격히 감소하였다. 대기 분위기의 급속 응고와 열처리에 의한 표면 산화막은 자기저항효과에 큰 영향을 주지 못하였다. 따라서 고자계 센서로 사용되는 CuCo 그래뉼라 합금 리본은 $8{\sim}14wt%Co$의 조성 범위에서 공업적 목적에 유리한 거대 자기저항을 갖는 것이 가능하였다.

• Advanced Composite Materials
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• 제18권4호
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• pp.339-350
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• 2009

Al-Fe-V-Si alloys reinforced with SiC particles were prepared by multi-layer spray deposition technique. Both microstructures and mechanical properties including hardness and tensile properties development during hot exposure process of Al-8.5Fe-1.3V-1.7Si, Al-8.5Fe-1.3V-1.7Si/15 vol% $SiC_P$ and Al-10.0Fe-1.3V-2Si/15 vol% $SiC_P$ were investigated. The experimental results showed that an amorphous interface of about 3 nm in thickness formed between SiC particles and the matrix. SiC particles injected silicon into the matrix; thus an elevated silicon concentration was found around $\alpha-Al_{12}(Fe,\;V)_3Si$ dispersoids, which subsequently inhibited the coarsening and decomposition of $\alpha-Al_{12}(Fe,\;V)_3Si$ dispersoids and enhanced the thermostability of the alloy matrix. Moreover, the thermostability of microstructure and mechanical properties of Al-10.0Fe-1.3V-2Si/15 vol% $SiC_P$ are of higher quality than those of Al-8.5Fe-1.3V-1.7Si/15 vol% $SiC_P$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.48-48
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• 2007

P-type transparent conducting $CuGaO_2$ thin films have been prepared by DC/RF sputtering using Quartz(0001) and sapphire(0001) substrates. The target was fabricated by heating a stoichiometric mixture of CuO and $Ga_2O_3$ at 1373K for 12h under $N_2$ atmosphere. The film were deposited under mixture gas of Ar and $O_2(Ar:O_2=4:1)$ during 10~30min. and the as-deposited films were annealed at 1123K and $N_2$ atmosphere. Room temperature conductivity and the activation energy of the sintered body in the temperature range of 223K ~ 423K were 0 004S/cm, 1.9eV, respectively. XRD revealed that all of the as-deposited films were amorphous. Heating of the films deposited on Quartz substrates above 1123K resulted in crystallization with a second phase of $CuSiO_3$, which was assumed owing to reaction with Quartz substrate. The single phase of $CuGaO_2$ was obtained at the film deposited on the sapphire substrates. The transmittance after annealing of DC- and RF-sputtered films were 55~75% at 550nm. From the transmittance and reflectance measurement. the direct band gap of the DC/RF-sputtered films were 3.63eV and 3.57eV. and there was little difference between DC and RF sputtered films.

• 공업화학
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• 제10권3호
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• pp.354-361
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• 1999

티타늄을 물리증착시킨 후 열처리한 막과 플라즈마에 의해 무정형 실리콘을 증착시킨 후 열처리한 막은 양질의 결정성을 갖는 Si가 풍부한 티타늄 실리사이드가 형성되고, 열처리 과정에서 에피택시 성장을 위한 격자들의 회전에 의해 다양한 형태의 격자구조를 갖는다. 티타늄 실리사이드 막의 band gap은 플라즈마에 의해 a-Si:H막을 증착시킨 후 열처리한 막이 수소의 탈착에 의해 제공된 dangling bond, a-Si 등의 영향을 받아 1.14~1.165 eV의 값을 가진다. 물리증착하여 열처리한 막의 Urbach tail인 $E_0$는 0.045~0.05 eV 범위로 거의 일정하고, 플라즈마에 의해 a-Si:H 막을 증착시킨 후 열처리한 막의 결함수는 Ti/Si를 열처리했을 때 얻어진 결함수보다 약 2~3 배 정도 많은 것으로 나타났다.

• 반도체디스플레이기술학회지
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• 제9권1호
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• pp.41-47
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• 2010

The effects of thermal treatment on CNTs, which were coated with a-$CN_x$ thin film, were investigated and related to variations of chemical bonding and morphologies of CNTs and also properties of field emission induced by thermal treatment. CNTs were directly grown on nano-sized conical-type tungsten tips via the inductively coupled plasma-chemical vapor deposition (ICP-CVD) system, and a-$CN_x$ films were coated on the CNTs using an RF magnetron sputtering system. Thermal treatment on a-$CN_x$ coated CNT-emitters was performed using a rapid thermal annealing (RTA) system by varying temperature ($300-700^{\circ}C$). Morphologies and microstructures of a-$CN_x$/CNTs hetero-structured emitters were analyzed by FESEM and HRTEM. Chemical composition and atomic bonding structures were analyzed by EDX, Raman spectroscopy, and XPS. The field emission properties of the a-$CN_x$/CNTs hetero-structured emitters were measured using a high vacuum (below $10^{-7}$ Torr) field-emission measurement system. For characterization of emission stability, the fluctuation and degradation of the emission current were monitored in terms of operation time. The results were compared with a-$CN_x$ coated CNT-emitters that were not thermally heated as well as with the conventional non-coated CNT-emitters.